S5106, S5107, S7509 and S7510 are Si PIN photodiodes sealed in chip carrier packages suitable for surface mount using automated solder
reflow techniques. These photodiodes have large active areas, making them suitable for spatial light transmission where a wide field-of-view
angle is required. Other applications include POS scanners, power meters and analytical instruments.
Features
l Active area
S5106: 5 5 mm
S5107: 10 10 mm
S7509: 2 10 mm
S7510: 6 11 mm
l Ceramic chip carrier package for surface mount
l Suitable for solder reflow
l High sensitivity
Applications
l Spatial light transmission
l Laser radar
l Power meter
l Bar-code reader
P H O T O D I O D E
Si PIN photodiode
Chip carrier package for surface mount
S5106, S5107, S7509, S7510
I General ratings / Absolute maximum ratings
Absolute maximum ratings
Active
area size
Effective
active area
Reverse
voltage
V
R
Max
Power
dissipation
P
Operating
temperature
Topr
Storage
temperature
Tstg
Type No.
Dimensional
outline/
Window
material *
(mm)
(mm
2
)
(V)
(mW)
(C)
(C)
S5106
/R
5 5
25
S5107
/R
10 10
100
S7509
/R
2 10
20
S7510
/R
6 11
66
30
50
-40 to +100 -40 to +125
I Electrical and optical characteristics (Typ. Ta=25 C, unless otherwise noted)
Photo sensitivity
S
(A/W)
Spectral
response
range
l
Peak
sensitivity
wavelength
lp
Short
circuit
current
Isc
100 lx
Dark
current
I
D
V
R
=10 V
Temp.
coefficient
of I
D
T
CID
Cut-off
frequency
fc
R
L
=50 W
V
R
=10 V
Terminal
capacitance
Ct
f=1 MHz
V
R
=10 V
NEP
V
R
=10 V
Type No.
(nm)
(nm)
lp 660 nm 780 nm 830 nm
(A)
Typ.
(nA)
Max.
(nA) (times/C) (MHz)
(pF)
(W/Hz
1/2
)
S5106
27
0.4
5
20
40
1.6 10
-14
S5107
110
0.9 10
10
150
2.4 10
-14
S7509
22
0.5
5
20
40
1.7 10
-14
S7510
320 to 1100 960
0.72 0.45 0.57 0.62
72
1.0 10
1.15
15
80
2.5 10
-14
* Window R: Resin coating
Note) Minimum quantity per order is 100 pieces.
1
Si PIN photodiode
S5106, S5107, S7509, S7510
0
TEMPERATURE COEFFICIENT (
%
/C)
200
400
600
800
1000
+1.0
+0.5
(Typ.)
+1.5
-0.5
WAVELENGTH (nm)
WAVELENGTH (nm)
PHOTO SENSITIVITY (A/W)
0
200
400
600
0.1
0.2
0.3
0.4
0.5
800
1000
0.6
0.7
0.8
(Typ. Ta=25 C)
I Spectral response
I Photo sensitivity temperature characteristic
KPINB0165EA
1 pA
0.1
1
10
100
10 pA
100 pA
1 nA
10 nA
(Typ. Ta=25 C)
S7509
S5107, S7510
REVERSE VOLTAGE (V)
DARK CURRENT
S5106
KPINB0166EA
I Dark current vs. reverse voltage
I Terminal capacitance vs. reverse voltage
10 pF
0.1
1
10
100
100 pF
1 nF
10 nF
(Typ. Ta=25 C, f=1 MHz)
REVERSE VOLTAGE (V)
TERMINAL CAPACITANCE
S5106
S7509
S5107
S7510
KPINB0128EA
KPINB0093EC
2
Si PIN photodiode
S5106, S5107, S7509, S7510
(4
) R0.3
16.5 0.2
1.8
2.54
3.0
0.46
1.26 0.15
(10
) 1.2
14.5 0.2
1.8
Burrs shall protrude no more than 0.3 mm
on any side of package.
ACTIVE AREA
PHOTOSENSITIVE
SURFACE
SILICONE
RESIN
8.80 0.2
(4
) R0.3
10.6 0.2
1.5
1.27
1.5
2.5
0.46
1.26 0.15
(10
) 0.6
SILICONE
RESIN
Burrs shall protrude no more than 0.3 mm
on any side of package.
PHOTOSENSITIVE
SURFACE
ACTIVE AREA
KPINA0002ED
KPINA0013EB
KPINA0056EA
KPINA0055EA
Burrs shall protrude no more than 0.3 mm
on any side of package.
6.50
15.35
(4
) R0.25
ACTIVE AREA
1.26 0.15
0.46
(18
) 0.6
1.27
SILICONE
RESIN
PHOTOSENSITIVE
SURFACE
2
2
S7509
S7510
(4
) R0.3
ACTIVE AREA
SILICONE
RESIN
PHOTOSENSITIVE
SURFACE
11.5
0.2
2
2
14.8 0.2
1.26 0.15
0.46
1.27
(16
) 0.6
Burrs shall protrude no more than 0.3 mm
on any side of package.
I
I
I
I
I Dimensional outlines (unit: mm)
S5106
S5107
3
Si PIN photodiode
S5106, S5107, S7509, S7510
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Hamamatsu City, 435-8558 Japan, Telephone: (81) 053-434-3311, Fax: (81) 053-434-5184, http://www.hamamatsu.com
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658
France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Smidesvgen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 2003 Hamamatsu Photonics K.K.
Cat. No. KPIN1033E03
Feb. 2003 DN
G The light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that
can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window
to prevent such troubles.
G Use rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 C maximum for 5
seconds maximum time under the conditions that no moisture absorption occurs.
Reflow soldering conditions differ depending on the type of PC board and reflow oven. Carefully check these conditions before use.
G Silicone resin swells when it absorbs organic solvent, so do not use any solvent other than alcohol.
G Avoid unpacking until you actually use this product to prevent the terminals from oxidation and dust deposits or the coated resin
from absorbing moisture.
When the product is stored for 3 months while not unpacked or 24 hours have elapsed after unpacking, perform baking in
nitrogen atmosphere at 150 C for 3 to 5 hours or at 120 C for 12 to 15 hours before use.
Precautions for use
4
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