A48
Card Bus Socket Connectors
IC9 Series
s
Features
1. Compliant with PC Card Standards
Complies with latest requirements of PC Card
Standard.
2. Repairable
Repairable terminations of connector solder
joints after installation on the board.
3. Lead Offset
Available with two board mounting levels of
terminations, to allow use of different height
components.
s
Materials
Part
Material
Finish
Notes
Insulator
Contact
Ground plate
PA
Phosphor bronze
Brass
Black
Contact Area : gold plating
Lead Area
: solder plating
Contact Area : gold plating
Lead Area
: solder plating
UL94V-0
-----------------
-----------------
s
Product Specifications
500 V DC
500 V AC / 1 minute
1 mA
Frequency: 10 to 2000 Hz, single amplitude of 0.75 mm or
acceleration of 147 m/s
2
(peak), 4 hours in each of the 3 directions.
96 hours at temperature of 40 and humidity of 90% to 95%
-55
, 30 min
/
15 to 30
, within 5 min
/
85
30 min
/
15 to 35
, within 5 min, for 5 cycles
10000 cycles at 400 to 600 cycles per hour
Reflow: At the recommended temperature profile
Manual soldering: 300 for 3 seconds
1000M
ohms
min.
No flashover or insulation breakdown.
40 m
ohms
max. (initial value)
No electrical discontinuity of 100ns or
more
Insulation resistance: 100 M
ohms
min.
No damage, cracks, or parts looseness.
Change of contact resistance from the
start should be 20 m
ohms
max.
No deformation of components
affecting performance.
1. Insulation resistance
2.
Withstanding voltage
3. Contact resistance
4. Vibration
5.
Humidity (Steady state)
6.
Temperature cycle
7.
Durability
(Insertion/withdrawal)
8. Resistance to
soldering heat
Ratings
Current rating
Voltage rating
0.5 A
125 V AC
Operating temperature
Operating humidity
-55
to +85
(Note 1)
95% R.H. or less (No condensation)
Storage temperature
Storage humidity
-10
to +60
(Note 2)
40 to 70% (Note 2)
Item
Specification
Conditions
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
A49
s
Ordering Information
Series name : IC9
Number of contacts : 68
R : card connector
D : 2-row alignment
Lead pitch : 0.635 mm
Offset type
SF : 0.3 mm offset
SFA : 0.9 mm offset
IC9 - 68 R D - 0.635 SFA
1
2
5
6
3
4
1
2
3
4
5
6
B
Mounting Method
1. Place and solder the connector without the ground plate as shown in fig.(a).
2. Place the ground plate over the connector as shown in Fig.(b), making sure that the locking tabs are correctly
aligned with the slots on both sides of the insulator. Press firmly at both ends to assure secure lock.
Note: Care should be taken that the termination leads of the ground plate are not deformed or damaged during
this operation.
3. Solder the termination leads of the ground plate to the board.
B
Lead Offset
q
Type with 0.3 mm offset
q
Type with 0.9 mm offset
A51
B
PCB mounting pattern
B
Temperature Profile
5 s.max
240
200
160
150
25
start
60
120
Time(seconds)
250
200
Temperature()
150
100
50
0
(30s)
(20 to 30s)
(60 to 90s)
(60s)
Preheating
Soldering
Applicable Conditions
Reflow system
:
IR reflow
Solder
:
Paste type 63 Sn/37 Pb
(Flux content 9 wt%)
Test board Glass epoxy 60mm x 60mm x 1.6 mm
Metal mask thickness: 0.15 mm
Recommended temperature profile.
The temperature may be slightly changed according to the
solder paste type and amount.
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