D11
1.27mm Pitch 8Byte DIMM Socket
SX4 Series
s
Features
1. 8Byte DIMM Compliant Socket
The SX4 series are a socket compliant to "8Byte DIMM" standardized
at JEDEC.
2. JEDEC Standard MO-161
The applicable module board 1.27mm pitch 168 pos. for double-sided
connection.
3. Easy PC Board Pattern Design
The lead length for soldering dip connection on the board is 1.27mm,
row-row 1.27mm, 1.6mm, 1.905mm, and staggered alignment in 4
rows.
4. Compatible with 5V and 3.3V Operating Voltage Module
Board
5. Prevents Mis-insertion in Module Board
The key mechanism prevents mis-insertion in the module board.
6. Prevents Displacement of Module Board
The structure to sustain the module board on both sides prevents
displacement of the module board.
7. Easy Insertion and Extraction of Module Board
The unique ejector mechanism facilitates to remove the module board. with
pushing the injector.
7.
In addition, marginal space is not needed for insertion and extraction actions.
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Applications
Workstations, computers, personal computers, PPC, business machines, measuring instruments, etc.
D12
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Ordering Information
SX4 A B - 168 S - 1.27 DSA
1
2
3
4
5
6
7
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Product Specifications
Rating
Operating Temperature Range
Voltage rating
Current rating
-55
to +85
100V AC
0.5A
Storage Temperature Range -55
to +85
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Material
Part
Material
Finish
Contact
Phosphor copper
Selective gold plating
Insulator
PPS(UL94V-0)
---------------
Ejector
Polyamid
---------------
Item
1. Contact Resistance
2. Insulation Resistance
3. Withstanding voltage
5. Vibration
6. Moisture Resistance
7. Temperature Cycle
8. Operating Life
9. Salt spray
30m
ohms
min.
1000M
ohms
min.
No flashover or insulation breakdown.
No electrical discontinuity of 1s or more
Contact resistance: 50m
ohms
max.
Insulation Resistance: 1000M
ohms
min.
Contact resistance: 50m
ohms
max.
Insulation Resistance: 1000M
ohms
min.
Contact resistance: 50m
ohms
max.
Contact resistance: 50m
ohms
max.
100mA DC
250V DC
250V AC / 1 minute
Measured with the 1.37
0.002mm gauge
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
50 minutes in each of the 3 directions.
96 hours at temperature of 40 and humidity of 90% to
95%
Tested for 5 cycles under following condition
Temperature
: -55
+5 to 35
+85
+5 to 35
Time
:
-
30
10 to 15
+
30
10 to 15 minutes
30 cycles
Exposed to density 5% salt water for 48 hours
Specification
Condition
4. Insulator/Extraction Force
196N max.
1
Series Name: SX4
4
Number of Contacts: 168
5
Contact Type: Female
6
Contact Pitch: 1.27mm
7
Contact type (row interval x lead length)
DSA: 1.6mm x 3.5mm
DSD: 1.27mm x 3.5mm
DSH: 1.905mm x 3.5mm
2
DIMM Key:
A: 5V type
B: 3.3V type
3
Positioning boss
A: Without boss
B: With boss
D16
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Operating Instruction
q
168 Contacts
[Procedures for Board Insertion]
1. Adjust DIMM to the socket key direction.
2. Insert the DIMM along both socket sides and straight in the vertical direction to the mounting board. At this time, anti-
vibration mechanism (protrusion) causes slight resistance to occur, but insert the DIMM until to hit the bottom. However,
avoid slant and flap insertion, or slant engagement or half-insertion.
3. When the DIMM is inserted, it is engaged with a click tone.
[Procedures for Board Extraction]
1. Press the ejector in the vertical direction.
2. Pick up the DIMM with fingers, which floats slightly.
Precautions
0
1. The ejector has strength enough to endure. However, if force is applied according to other operation methods instead of the
Procedures for Handling Sockets, products could be damaged.
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2. This product is designed in compliance with JEDEC "8 Byte DIMM". However, if other boards are used instead of the
recommended module board or if the mounting devices are used the other than memory IC, troubles due to vibration or other
failures could occur. Confirm individual conditions.
0
3. Acute angles at pad edges of recommended module boards could cause failure in contacts. Therefore, it is recommended to
offset the tie-bar (0.1mm) from the center line, set the internal pad, or remove sharp edges or burrs according to the
recommended size ranges.
0
4. Stand-off is provided for measures to prevent flux rise, but resin sealing is not done. Confirm individual conditions.
0
5. If strong heat is concentrated on the product (reflow, etc.), the product will be deformed due to strength. Check individual
conditions.
0
6. Use alcohol-based flux solvent, which does not subject chemical reaction.
0
7. Don't provide convex or concave portions at external edges of the module board, or and chamfer areas at both edges. Comply
with the recommended sizes.
0
8. The dip section tip is considered for safety, the tip is slimmed for enhancement of mountability. Be careful for handling products.
0
9. If the board is installed under other conditions, instead of conditions indicated in the connector mounting board and installation
size pattern corresponding to individual products, failure could be caused. Observe the connector mounting board and
installation size pattern, corresponding to individual products.
10. Note that slant or flap insertion could cause product damage.
11. Slant engagement or half-insertion could cause circuit short or fuming.
12. If force is given regardless the "Procedures for Handling Sockets", it will cause breakage.
13. Dusts inclusion in connector engagement areas will cause failure in the product. In addition, it is recommended to install SX4-
1684S-DC (use a special cover. For details, consult HRS Sales Department) in the connector, which is not equipped with the
module.
14. Even if the ejector is separated from the hinge connection area, operativity of the DIMM injector is not affected. However, don't
forcibly remove the ejector lever. Such a behavior could cause the ejector lever to loosen.
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