ChipFind - документация

Электронный компонент: 2SH27

Скачать:  PDF   ZIP
2SH27
Silicon N Channel IGBT
High Speed Power Switching
ADE-208-789A(Z)
2nd. Edition
May 1999
Features
High speed switching
Low on-voltage
Outline
TO220AB
1
2
3
1. Gate
2. Collector (Flange)
3. Emitter
C
E
G
2SH27
2
Absolute Maximum Ratings (Ta = 25
C)
Item
Symbol
Ratings
Unit
Collector to Emitter voltage
V
CES
600
V
Gate to Emitter voltage
V
GES
20
V
Collector current
I
C
15
A
Collector peak current
ic(peak)
30
A
Collector dissipation
P
C
Note1
50
W
Channel temperature
Tj
150
C
Storage temperature
Tstg
55 to +150
C
Note:
1. Value at Tc = 25
C
Electrical Characteristics (Ta = 25
C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Zero gate voltage collector
current
I
CES
--
--
100
A
V
CE
= 600V, V
GE
= 0
Gate to emitter leak current
I
GES
--
--
1
A
V
GE
=
20 V, V
CE
= 0
Gate to emitter cutoff voltage
V
GE(off)
6.0
--
8.0
V
I
C
= 15mA, V
CE
= 10V
Collector to emitter saturation
voltage
V
CE(sat)
--
2.1
2.6
V
I
C
= 15A, V
GE
= 15V
Input capacitance
Cies
--
920
--
pF
V
CE
= 10V, V
GE
= 0
f = 1MHz
Switching time
t
r
--
150
--
ns
I
C
= 15A
t
on
--
220
--
ns
R
L
= 20
t
f
--
300
600
ns
V
GS
=
15V
t
off
--
410
820
ns
Rg = 50
2SH27
3
Main Characteristics
Channel Dissipation Pch (W)
Case Temperature Tc (
C)
Power vs. Temperature Derating
Collector to Emitter Voltage V (V)
CE
Collector Current I (A)
C
Maximum Safe Operation Area
Typical Output Characteristics
Reverse Bias SOA
Collector to Emitter Voltage V (V)
CE
Collector Current I (A)
C
Collector to Emitter Voltage V (V)
CE
Collector Current I (A)
80
60
40
20
0
50
100
150
200
100
30
10
1
3
10
30
100
3
1
0.3
0.1
0.03
0.01
300
1000
100
s
1 ms
PW = 10 ms (1shot)
DC Operation (Tc = 25
C)
Ta = 25
C
20
16
12
8
4
0
2
4
6
8
10
0
200
400
600
800
20
5
10
2
0.5
1
0.2
0.1
V = 9 V
GS
C
10 V
12 V
Pulse Test
15 V
50
11 V
Tc = 25
C
2SH27
4
Gate to Emitter Voltage V (V)
GE
Collector to Emitter Saturation Voltage
vs. Gate to Emitter Voltage
V (V)
CE(sat)
Collector to Emitter Saturation Voltage
Collecot to Emitter Saturation Voltage
vs. Collector Current
Gate to Emitter Voltage V (V)
GE
Collector Current I (A)
C
Typical Transfer Characteristics
Capacitance C (pF)
Collector to Emitter Voltage V (V)
CE
Typical Capacitance vs.
Collecotor to Emitter Voltage
Collector Current I (A)
C
5
4
3
2
1
0
4
8
12
16
20
20
16
12
8
4
0
4
8
12
16
20
Tc = 75C
25C
25C
5 A
I = 10 A
C
V = 10 V
Pulse Test
CE
Pulse Test
0.1
1
10
100
0.3
3
30
2
1
0.5
0.2
0.1
0
10
20
30
40
50
10000
300
1000
100
30
10
5
3
10
V = 0
f = 1 MHz
GE
Cies
Coes
Cres
1
3000
V (V)
CE(sat)
Collector to Emitter Saturation Voltage
25C
Tc = 75C
25C
V = 15 V
Pulse Test
GE
2.5 A
2SH27
5
Gate Charge Qg (nc)
Collector to Emitter Voltage V (V)
CE
Gate to Emitter Voltage V (V)
GE
Dynamic Input Characteristics
Collector Current I (A)
C
Switching Time t (ns)
Switching Characteristics
Gate Resistance Rg ( )
Switching Time t (ns)
Switching Characteristics
Case Temperature Tc (C)
Switching Time t (ns)
Switching Characteristics
500
400
300
200
100
0
20
16
12
8
4
20
40
60
80
100
0
1000
200
500
100
20
10
50
1
2
10
20
V = 200 V
300 V
400 V
CC
V = 400 V
300 V
200 V
CC
I = 15 A
C
V
CE
V
GE
5
t f
r
t
d(on)
t
d(off)
t
V = 300V, V = 15 V
Rg = 50 , Ta = 25C
CC
GE
1000
100
300
30
3
1
10
1000
200
500
100
20
10
50
25
50
75
100
125
1
3
10
30
100
300
1000
t f
r
t
d(on)
t
d(off)
t
GE
I = 15A, R = 20
V = 15 V
C
L
t f
r
t
d(on)
t
d(off)
t
GE
I = 15A, R = 20
V = 15 V, Rg = 50
C
L
2SH27
6
Pulse Width PW (S)
Normalized Transient Thermal Impedance
s (t)
Normalized Transient Thermal Impedance vs. Pulse Width
Switching Time Test Circuit
Waveform
Ic Monitor
Vin Monitor
D.U.T.
Rg
Vin 15 V
R
L
V
CC
10%
tf
tr
td(off)
td(on)
Ic
Vin
0
90%
90%
90%
10%
10%
V
CE
ton
toff
V
Monitor
CE
3
1
0.3
0.1
0.03
0.01
10
100
1 m
10 m
100 m
1
10
DM
P
PW
T
D =
PW
T
ch c(t) = s (t) ch c
ch c = 2.5 C/W, Tc = 25 C

Tc = 25C
D = 1
0.5
0.2
0.1
0.05
0.02
0.01
1shot pulse
2SH27
7
Package Dimensions
Unit: mm
10.16
0.2
9.5
8.0
1.26
0.15
2.7 max
1.5 max
0.76
0.1
2.54
0.5
1.27
18.5
0.5
7.8
0.5
f 3.6
+ 0.1
0.08
Hitachi Code
EIAJ
JEDEC
TO220AB
SC46
--
1.27
0.1
1.2
0.1
15.0
0.3
6.4
+ 0.2
0.1
2.79
0.2
0.5
0.1
14.0
0.5
2.54
0.5
4.44
0.2
2SH27
8
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party's rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi's sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
URL
NorthAmerica
: http:semiconductor.hitachi.com/
Europe
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan)
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong)
: http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Europe GmbH
Electronic components Group
Dornacher Strae 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
For further information write to: