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Электронный компонент: 2SJ130S

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2SJ130(L), 2SJ130(S)
Silicon P-Channel MOS FET
Application
High speed power switching
Features
Low on-resistance
High speed switching
Low drive current
No secondary breakdown
Suitable for switching regulator, DC-DC converter and ultrasonic power oscillators
Outline
1
2
3
1
2 3
4
4
DPAK-1
1. Gate
2. Drain
3. Source
4. Drain
D
G
S
2SJ130(L), 2SJ130(S)
2
Absolute Maximum Ratings (Ta = 25C)
Item
Symbol
Ratings
Unit
Drain to source voltage
V
DSS
300
V
Gate to source voltage
V
GSS
20
V
Drain current
I
D
1
A
Drain peak current
I
D(pulse)
2
A
Body to drain diode reverse drain current
I
DR
1
A
Channel dissipation
Pch*
1
20
W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Note:
1. Value at T
C
= 25
C
Electrical Characteristics (Ta = 25C)
Item
Symbol Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V
(BR)DSS
300
--
--
V
I
D
= 10 mA, V
GS
= 0
Gate to source breakdown
voltage
V
(BR)GSS
20
--
--
V
I
G
=
100
A, V
DS
= 0
Gate to source leak current
I
GSS
--
--
10
A
V
GS
=
16 V, V
DS
= 0
Zero gate voltage drain current I
DSS
--
--
100
A
V
DS
= 240 V, V
GS
= 0
Gate to source cutoff voltage
V
GS(off)
2.0
--
4.0
V
I
D
= 1 mA, V
DS
= 10 V
Static drain to source on state
resistance
R
DS(on)
--
6.0
8.5
I
D
= 0.5 A, V
GS
= 10 V*
1
Forward transfer admittance
|y
fs
|
0.25
0.4
--
S
I
D
= 0.5 A, V
DS
= 20 V*
1
Input capacitance
Ciss
--
235
--
pF
V
DS
= 10 V, V
GS
= 0,
Output capacitance
Coss
--
65
--
pF
f = 1 MHz
Reverse transfer capacitance
Crss
--
16
--
pF
Turn-on delay time
t
d(on)
--
10
--
ns
I
D
= 0.5 A, V
GS
= 10 V,
Rise time
t
r
--
25
--
ns
R
L
= 60
Turn-off delay time
t
d(off)
--
35
--
ns
Fall time
t
f
--
45
--
ns
Body to drain diode forward
voltage
V
DF
--
0.9
--
V
I
F
= 1 A, V
GS
= 0
Body to drain diode reverse
recovery time
t
rr
--
200
--
ns
I
F
= 1 A, V
GS
= 0,
di
F
/dt = 50 A/
s
Note:
1. Pulse test
2SJ130(L), 2SJ130(S)
3
30
20
10
0
50
100
150
Case Temperature T
C
(C)
Power vs. Temperature Derating
Channel Dissipation Pch (W)
5
1.0
0.2
0.05
20
100
500
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
Maximum Safe Operation Area
2
0.1
5
10
50
200
Ta = 25C
10
s
Operation in this area
is limited by R
DS (on)
0.5
PW = 10 ms (1 Shot)
DC Operation (T
C
= 25C)
100
s
1 ms
2.0
20
50
Drain to Source Voltage V
DS
(V)
Typical Output Characteristics
1.6
0.4
10
30
40
Pulse Test
0
0.8
1.2
5 V
V
GS
= 4 V
7 V
15 V
Drain Current I
D
(A)
6 V
10 V
2.0
4
10
Gate to Source Voltage V
GS
(V)
Drain Current I
D
(A)
Typical Transfer Characteristics
1.6
0.4
2
6
8
25C
0
0.8
1.2
V
DS
= 20 V
Pulse Test
75C
T
C
= 25C
2SJ130(L), 2SJ130(S)
4
20
8
20
Gate to Source Voltage V
GS
(V)
Drain to Source Saturation Voltage V
DS (on)
(V)
16
4
4
12
16
0
8
12
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
1 A
I
D
= 2 A
Pulse Test
0.5 A
50
0.2
5
Drain Current I
D
(A)
Static Drain to Source on State Resistance
R
DS (on)
(
)
20
1.0
0.1
0.5
2
0.05
5
10
Static Drain to Source on State
Resistance vs. Drain Current
2
0.5
1.0
15 V
V
GS
= 10 V
Pulse Test
20
40
160
Case Temperature T
C
(C)
Static Drain to Source on State Resistance
R
DS (on)
(
)
16
4
0
8
0
120
0
8
12
Static Drain to Source on State
Resistance vs. Temperature
I
D
= 2 A
V
GS
= 10 V
Pulse Test
40
1 A
0.5 A
5
0.05
2
Drain Current I
D
(A)
Forward Transfer Admittance
yfs
(S)
2
0.2
0.02
0.1
0.5
0.05
0.5
1.0
Forward Transfer Admittance
vs. Drain Current
V
DS
= 20 V
Pulse Test
0.1
0.2
1.0
75C
25C
Ta = 25C
2SJ130(L), 2SJ130(S)
5
5
0.5 M
20 M
Frequency f (Hz)
Forward Transfer Admittance
yfs
(S)
2
0.2
0.2 M
1.0 M
5
M
0.05
0.5
1
Forward Transfer Admittance
vs. Frequency
T
C
= 25C
V
DS
= 20 V
I
D
= 0.5 A
0.1
2 M
10 M
1,000
20
50
Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
10
10
30
40
Typical Capacitance vs.
Drain to Source Voltage
0
1
Crss
Coss
Ciss
V
GS
= 0
f = 1 MHz
100
0
82
0
Gate Charge Qg (nc)
RDrain to Source V
DS
(V)
100
41
2
01
6
200
300
400
I
D
= 1 A
V
DD
= 200 V
V
DS
Dynamic Input Characteristics
100 V
50 V
V
DD
= 50V
100 V
200 V
V
GS
0
Gate to Source Voltage V
GS
(V)
4
8
12
16
20
500
100
0.2
5
Drain Current I
D
(A)
Switching Time t (ns)
50
5
0.1
0.5
2
1
10
20
0.05
2
1.0
Switching Characteristics
t
f
t
d (on)
t
d (off)
t
r
V
GS
= 10 V
PW = 2
s
duty < 1%
V
DD
30 V
= .
.
2SJ130(L), 2SJ130(S)
6
2.0
2.0
Source to Drain Voltage V
SD
(V)
Reverse Dratin Current I
DR
(A)
1.6
0.4
0.8
1.6
0
0.8
1.2
0
0.4
1.2
Reverse Drain Current vs.
Source To Drain Voltage
5 V, 10 V
V
GS
= 0, 10 V
V
GS
= 0
Pulse Test
3
Pulse Width PW (s)
Normalized Transient Thermal Impedance
S
(t)
1.0
0.1
0.3
D = 1
10
0.03
0.01
100
10 m
100 m
1
10
1 m
T
C
= 25C
0.5
0.2
0.1
0.05
0.02
0.01
1 Shot Pulse
T
PW
P
DM
D =
T
PW
chc (t) =
S
(t)
chc
chc = 6.25C/W, T
C
= 25C
Normalized Transient Thermal Impedance vs. Pulse Width
Switching Time Test Circuit
Vin Monitor
Vin
10 V
50
D.U.T
Vout Monitor
R
L
V
DD
30 V
=
.
.
Waveforms
Vin
Vout
t
d (on)
10%
t
r
t
f
10%
90%
90%
10%
90%
t
d (off)
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DPAK (L)-(1)
--
Conforms
0.42 g
Unit: mm
6.5
0.5
2.3
0.2
0.55
0.1
1.2
0.3
0.55
0.1
5.5
0
.
5
1.7
0.5
16.2
0.5
3.1
0.5
5.4
0.5
1.15
0.1
2.29
0.5
2.29
0.5
0.8
0.1
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