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Электронный компонент: 2SJ221

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2SJ221
Silicon P-Channel MOS FET
Application
High speed power switching
Features
Low on-resistance
High speed switching
Low drive current
4 V gate drive device
Can be driven from 5 V source
Suitable for motor drive, DC-DC converter, power switch and solenoid drive
Outline
1
2
3
TO-220AB
1. Gate
2. Drain
(Flange)
3. Source
D
G
S
2SJ221
2
Absolute Maximum Ratings (Ta = 25C)
Item
Symbol
Ratings
Unit
Drain to source voltage
V
DSS
100
V
Gate to source voltage
V
GSS
20
V
Drain current
I
D
20
A
Drain peak current
I
D(pulse)
*
1
80
A
Body to drain diode reverse drain current
I
DR
20
A
Channel dissipation
Pch*
2
75
W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10
s, duty cycle
1%
2. Value at T
C
= 25
C
Electrical Characteristics (Ta = 25C)
Item
Symbol Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V
(BR)DSS
100
--
--
V
I
D
= 10 mA, V
GS
= 0
Gate to source breakdown
voltage
V
(BR)GSS
20
--
--
V
I
G
=
100
A, V
DS
= 0
Gate to source leak current
I
GSS
--
--
10
A
V
GS
=
16 V, V
DS
= 0
Zero gate voltage drain current I
DSS
--
--
250
A
V
DS
= 80 V, V
GS
= 0
Gate to source cutoff voltage
V
GS(off)
1.0
--
2.0
V
I
D
= 1 mA, V
DS
= 10 V
Static drain to source on state
R
DS(on)
--
0.12
0.16
I
D
= 10 A, V
GS
= 10 V*
1
resistance
--
0.16
0.22
I
D
= 10 A, V
GS
= 4 V*
1
Forward transfer admittance
|y
fs
|
7.5
12
--
S
I
D
= 10 A, V
DS
= 10 V*
1
Input capacitance
Ciss
--
1800
--
pF
V
DS
= 10 V, V
GS
= 0,
Output capacitance
Coss
--
680
--
pF
f = 1 MHz
Reverse transfer capacitance
Crss
--
145
--
pF
Turn-on delay time
t
d(on)
--
15
--
ns
I
D
= 10 A, V
GS
= 10 V,
Rise time
t
r
--
115
--
ns
R
L
= 3
Turn-off delay time
t
d(off)
--
320
--
ns
Fall time
t
f
--
170
--
ns
Body to drain diode forward
voltage
V
DF
--
1.05
--
V
I
F
= 20 A, V
GS
= 0
Body to drain diode reverse
recovery time
t
rr
--
280
--
ns
I
F
= 20 A, V
GS
= 0,
di
F
/dt = 50 A/
s
Note:
1. Pulse test
2SJ221
3
120
80
40
0
50
100
150
Case Temperature T
C
(C)
Channel Dissipation Pch (W)
Power vs. Temperature Derating
100
1,000
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
Maximum Safe Operation Area
1
30
10
3
1
0.3
0.1
3
10
30
100 300
10
s
100
s
1 ms
DC Operation (T
C
= 25C)
PW = 10 ms (1 Shot)
Ta = 25C
Operation in this Area
is Limited by R
DS (on)
50
8
20
Drain to Source Voltage V
DS
(V)
Typical Output Characteristics
40
10
4
12
16
0
20
30
Drain Current I
D
(A)
V
GS
= 3 V
Pulse Test
4 V
5 V
6 V
8 V
10 V
20
2
5
Gate to Source Voltage V
GS
(V)
Drain Current I
D
(A)
Typical Transfer Characteristics
16
4
1
3
4
0
8
12
T
C
= 25C
25C
V
DS
= 10 V
Pulse Test
75C
2SJ221
4
10
8
20
Gate to Source Voltage V
GS
(V)
Drain to Source Saturation Voltage V
DS (on)
(V)
8
2
4
12
16
0
4
6
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
20 A
10 A
I
D
= 5 A
Pulse Test
5
100
Drain Current I
D
(A)
Static Drain to Source on State Resistance
R
DS (on)
(
)
0.1
Static Drain to Source on State
Resistance vs. Drain Current
3
1
0.3
0.1
0.03
0.01
0.005
0.3
1
3
10
30
Pulse Test
V
GS
= 4 V
10 V
1.0
40
160
Case Temperature T
C
(C)
Static Drain to Source on State Resistance
R
DS (on)
(
)
0.8
0.2
0
80
120
0
0.4
0.6
Static Drain to Source on State
Resistance vs. Case Temperature
40
I
D
= 20 A
5, 10 A
V
GS
= 4 V
V
GS
= 10 V
5, 10 A
20 A
Pulse Test
100
100
Drain Current I
D
(A)
Forward Transfer Admittance
yfs
(S)
Forward Transfer Admittance
vs. Drain Current
0.1
30
10
3
1
0.3
0.5
0.3
1
3
10
30
V
DS
= 10 V
Pulse Test
25C
75C
T
C
= 25C
2SJ221
5
5,000
100
Reverse Drain Current I
DR
(A)
Reverse Recovery Time t
rr
(ns)
Body to Drain Diode Reverse
Recovery Time
0.1
3,000
1,000
300
100
30
10
5
0.3
1
3
10
30
di/dt = 50 A/
s, Ta = 25C
V
GS
= 0,
10,000
20
50
Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
10
30
40
Typical Capacitance vs.
Drain to Source Voltage
0
1,000
100
10
Crss
Coss
Ciss
V
GS
= 0
f = 1 MHz
0
40
100
Gate Charge Qg (nc)
Drain to Source Voltage V
DS
(V)
Dynamic Input Characteristics
20
80
20
60
80
0
60
40
0
4
16
20
12
8
Gate to Source Voltage V
GS
(V)
100
V
DD
= 10 V
25 V
50 V
V
DS
V
GS
I
D
= 20 A
V
DD
= 50 V
25 V
10 V
5,000
100
Drain Current I
D
(A)
Switching Time t (ns)
0.1
Switching Characteristics
V
GS
= 10 V, V
DD
30 V
PW = 2
s, duty 1%
=
.
.
t
d (off)
t
f
t
d (on)
t
r
3,000
1,000
300
100
30
10
5
0.3
1
3
10
30
<
=
2SJ221
6
50
0.8
2.0
Source to Drain Voltage V
SD
(V)
Reverse Drain Current I
DR
(A)
40
0.4
1.2
1.6
20
30
Reverse Drain Current vs.
Source to Drain Voltage
0
10
Pulse Test
V
GS
= 0, 5 V
10 V
5 V
3
Pulse Width PW (s)
Normalized Transient Thermal Impedance
S
(t)
1.0
0.1
0.3
10
0.03
0.01
100
10 m
100 m
1
10
1 m
Normalized Transient Thermal Impedance vs. Pulse Width
PW
P
DM
D =
T
PW
chc (t) =
S
(t)
chc
chc = 1.67C/W, T
C
= 25C
D = 1
0.5
0.2
0.1
0.05
0.02
1 Shot Pulse
0.01
T
T
C
= 25C
Switching Time Test Circuit
Vin Monitor
Vin
10 V
50
D.U.T
Vout Monitor
R
L
V
DD
30 V
=
.
.
Waveforms
Vin
Vout
t
d
(on)
10%
t
r
t
f
10%
90%
90%
10%
90%
t
d
(off)
0.5
0.1
2.54
0.5
0.76
0.1
14.0
0.5
15.0
0.3
2.79
0.2
18.5
0.5
7.8
0.5
10.16
0.2
2.54
0.5
1.26
0.15
4.44
0.2
2.7 MAX
1.5 MAX
11.5 MAX
9.5
8.0
1.27
6.4
+0.2
0.1
3.6
+0.1
-0.08
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-220AB
Conforms
Conforms
1.8 g
Unit: mm
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