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Электронный компонент: 2SJ471

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2SJ471
Silicon P Channel DVL MOS FET
High Speed Power Switching
ADE-208-540
1st. Edition
Features
Low on-resistance
R
DS(on)
= 25 m
typ.
4V gate drive devices.
High speed switching
Outline
1
2
3
1. Gate
2. Drain
3. Source
TO220CFM
G
D
S
2SJ471
2
Absolute Maximum Ratings (Ta = 25C)
Item
Symbol
Ratings
Unit
Drain to source voltage
V
DSS
30
V
Gate to source voltage
V
GSS
20
V
Drain current
I
D
30
A
Drain peak current
I
D(pulse)
Note1
120
A
Body to drain diode reverse drain current
I
DR
30
A
Channel dissipation
Pch
Note2
30
W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10
s, duty cycle
1 %
2. Value at Tc = 25
C
2SJ471
3
Electrical Characteristics (Ta = 25C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Drain to source breakdown
voltage
V
(BR)DSS
30
--
--
V
I
D
= 10mA, V
GS
= 0
Gate to source breakdown
voltage
V
(BR)GSS
20
--
--
V
I
G
=
100
A, V
DS
= 0
Zero gate voltege drain
current
I
DSS
--
--
10
A
V
DS
= 30 V, V
GS
= 0
Gate to source leak current
I
GSS
--
--
10
A
V
GS
=
16V, V
DS
= 0
Gate to source cutoff voltage
V
GS(off)
1.0
--
2.0
V
I
D
= 1mA, V
DS
= 10V
Static drain to source on state R
DS(on)
--
25
35
m
I
D
= 15A, V
GS
= 10V
Note3
resistance
R
DS(on)
--
40
60
m
I
D
= 15A, V
GS
= 4V
Note3
Forward transfer admittance
|y
fs
|
12
20
--
S
I
D
= 15A, V
DS
= 10V
Note3
Input capacitance
Ciss
--
1700
--
pF
V
DS
= 10V
Output capacitance
Coss
--
950
--
pF
V
GS
= 0
Reverse transfer capacitance Crss
--
260
--
pF
f = 1MHz
Turn-on delay time
t
d(on)
--
20
--
ns
V
GS
= 10V, I
D
= 15A
Rise time
t
r
--
290
--
ns
R
L
= 0.67
Turn-off delay time
t
d(off)
--
170
--
ns
Fall time
t
f
--
130
--
ns
Body to drain diode forward
voltage
V
DF
--
1.1
--
V
I
F
= 30A, V
GS
= 0
Body to drain diode reverse
recovery time
t
rr
--
70
--
ns
I
F
= 30A, V
GS
= 0
diF/ dt = 50A/
s
Note:
3. Pulse test
2SJ471
4
Main Characteristics
40
30
20
10
0
50
100
150
200
Channel Dissipation Pch (W)
Case Temperature Tc (
C)
Power vs. Temperature Derating
500
200
100
20
50
10
2
5
1
0.5
0.1 0.3
1
3
10
30
100
1 ms
Ta = 25
C
100
s
PW = 10 ms (1shot)
DC Operation (Tc = 25
C)
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Maximun Safe Operation Area
50
40
30
20
10
0
2
4
6
8
10
4 V
6 V
10 V
3 V
V = 2.5 V
GS
3.5 V
Typical Output Characteristics
Pulse Test
0
1
2
3
4
5
Typical Transfer Characteristics
10
s
4.5 V
5 V
50
40
30
20
10
Tc = 25
C
25
C
75
C
V = 10 V
Pulse Test
DS
Operation in
this area is
limited by R
DS(on)
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Gate to Source Voltage V (V)
GS
Drain Current I (A)
D
2SJ471
5
1.0
0.8
0.6
0.4
0.2
0
4
8
12
16
20
Gate to Source Voltage V (V)
GS
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
Pulse Test
0.5
0.2
0.1
0.02
0.01
0.05
1
2
5
10
20
50
Drain Current I (A)
D
Drain to Source on State Resistance
Static Drain to Source on State Resistance
vs. Drain Current
0.10
0.08
0.06
0.04
0.02
40
0
40
80
120
160
0
Cate Temperature Tc (
C)
Static Drain to Source on State Resistance
vs. Temperature
0.1
50
50
0.1
Foward Transfer Admittance vs.
Drain Current
Foward Transfer Admittance |yfs| (S)
I = 20 A
D
10 A
5 A
V = 4 V
GS
10 V
V = 4 V
GS
I = 20 A
D
5, 10, 20 A
5, 10 A
10 V
20
10
2
5
1
0.2
0.5
0.2 0.5 1 2
5 10 20
25
C
Tc = 25
C
75
C
V = 10 V
Pulse Test
DS
DS(on)
Drain to Source Saturation Voltage
V (V)
Pulse Test
DS(on)
R ( )
Drain to Source on State Resistance
DS(on)
R ( )
Pulse Test
Drain Current I (A)
D
2SJ471
6
1000
200
500
100
20
5
50
Reverse Drain Current I (A)
DR
Reverse Recovery Time trr (ns)
Body to Drain Diode Reverse
Recovery Time
0
4
8
12
16
20
10000
5000
2000
500
200
1000
100
Capacitance C (pF)
Drain to Source Voltage V (V)
DS
Typical Capacitance vs.
Drain to Source Voltage
0
10
20
30
40
0
0
4
8
12
16
20
50
16
32
48
64
80
V
GS
V
DS
V = 5 V
10 V
25 V
DD
DD
V = 25 V
10 V
5 V
I = 30 A
D
Gate Charge Qg (nc)
Drain to Source Voltage V (V)
DS
Gate to Source Voltage V (V)
GS
Dynamic Input Characteristics
Drain Current I (A)
D
Switching Time t (ns)
Switching Characteristics
0.1
50
0.2 0.5 1 2
5 10 20
10
1000
200
500
100
20
5
50
0.1
50
0.2 0.5 1 2
5 10 20
10
di / dt = 50 A /
s
V = 0, Ta = 25
C
GS
t f
r
t
d(on)
t
d(off)
t
V = 10 V, V = 10 V
duty < 1 %
GS
DD
Ciss
Coss
Crss
V = 0
f = 1 MHz
GS
2SJ471
7
3
1
0.3
0.1
0.03
0.01
10
100
1 m
10 m
100 m
1
10
DM
P
PW
T
D =
PW
T
ch c(t) = s (t) ch c
ch c = 4.17
C/W, Tc = 25
C

Tc = 25
C
D = 1
0.5
0.2
0.1
0.05
0.02
0.01
1shot pulse
Pulse Width PW (S)
Normalized Transient Thermal Impedance vs. Pulse Width
50
40
30
20
10
0
0.4
0.8
1.2
1.6
2.0
Source to Drain Voltage V (V)
SD
Reverse Drain Current I (A)
DR
Reverse Drain Current vs.
Source to Drain Voltage
V = 0, 5 V
GS
5 V
Pulse Test
10 V
Normalized Transient Thermao Impedance
s (t)
2SJ471
8
Vin Monitor
D.U.T.
Vin
10 V
R
L
V
= 10 V
DD
tr
td(on)
Vin
90%
90%
10%
10%
Vout
td(off)
Vout
Monitor
50
90%
t
f
Switching Timen Test Circuit
Waveform
10%
2SJ471
9
Package Dimensions
Unit: mm
10.0
0.3
1.0
0.2
1.15
0.2
0.6
0.1
2.54
0.5
2.54
0.5
4.1
0.3
12.0
0.3
2.7
0.2
4.45
0.3
0.7
0.1
13.6
1.0
15.0
0.3
3.2
0.2
f
2.5
0.2
Hitachi Code
EIAJ
JEDEC
TO220CFM
--
--
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