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Электронный компонент: 2SK1152L

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2SK1151(L)(S), 2SK1152(L)(S)
Silicon N-Channel MOS FET
Application
High speed power switching
Features
Low on-resistance
High speed switching
Low drive current
No secondary breakdown
Suitable for switching regulator and DC-DC converter
Outline
1
2
3
1
2 3
4
4
DPAK-1
1. Gate
2. Drain
3. Source
4. Drain
D
G
S
2SK1151(L)(S), 2SK1152(L)(S)
2
Absolute Maximum Ratings (Ta = 25C)
Item
Symbol
Ratings
Unit
Drain to source voltage
2SK1151
V
DSS
450
V
2SK1152
500
Gate to source voltage
V
GSS
30
V
Drain current
I
D
1.5
A
Drain peak current
I
D(pulse)
*
1
6
A
Body to drain diode reverse drain current
I
DR
1.5
A
Channel dissipation
Pch*
2
20
W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10
s, duty cycle
1%
2. Value at T
C
= 25
C
2SK1151(L)(S), 2SK1152(L)(S)
3
Electrical Characteristics (Ta = 25C)
Item
Symbol Min
Typ
Max
Unit
Test conditions
Drain to source
2SK1151 V
(BR)DSS
450
--
--
V
I
D
= 10 mA, V
GS
= 0
breakdown voltage
2SK1152
500
Gate to source breakdown
voltage
V
(BR)GSS
30
--
--
V
I
G
=
100
A, V
DS
= 0
Gate to source leak current
I
GSS
--
--
10
A
V
GS
=
25 V, V
DS
= 0
Zero gate voltage
2SK1151 I
DSS
--
--
100
A
V
DS
= 360 V, V
GS
= 0
drain current
2SK1152
V
DS
= 400 V, V
GS
= 0
Gate to source cutoff voltage
V
GS(off)
2.0
--
3.0
V
I
D
= 1 mA, V
DS
= 10 V
Static Drain to source 2SK1151 R
DS(on)
--
3.5
5.5
I
D
= 1 A, V
GS
= 10 V *
1
on stateresistance
2SK1152
--
4.0
6.0
Forward transfer admittance
|yfs|
0.6
1.1
--
S
I
D
= 1 A, V
DS
= 20 V *
1
Input capacitance
Ciss
--
160
--
pF
V
DS
= 10 V, V
GS
= 0,
Output capacitance
Coss
--
45
--
pF
f = 1 MHz
Reverse transfer capacitance
Crss
--
5
--
pF
Turn-on delay time
t
d(on)
--
5
--
ns
I
D
= 1 A, V
GS
= 10 V,
Rise time
t
r
--
10
--
ns
R
L
= 30
Turn-off delay time
t
d(off)
--
20
--
ns
Fall time
t
f
--
10
--
ns
Body to drain diode forward
voltage
V
DF
--
1.0
--
V
I
F
= 1.5 A, V
GS
= 0
Body to drain diode reverse
recovery time
t
rr
--
220
--
ns
I
F
= 1.5 A, V
GS
= 0,
di
F
/dt = 100 A/
s
Note:
1. Pulse test
2SK1151(L)(S), 2SK1152(L)(S)
4
Power vs. Temperature Derating
30
20
10
0
Channel Dissipation Pch (W)
50
100
150
Case Temperature T
C
(C)
Maximum Safe Operation Area
10
1
10
1,000
Drain to Source Voltage V
DS
(V)
3
0.1
0.03
1 ms
100
Ta = 25C
DC Operation (T
C
= 25C)
PW = 10ms (1 Shot)
2SK1151
2SK1152
Drain Current I
D
(A)
0.01
100
s
0.3
1.0
10
s
Operation in this
area is limited
by R
DS (on)
Typical Output Characteristics
2.0
1.6
1.2
0.8
0
4
8
12
16
20
Pulse Test
0.4
Drain Current I
D
(A)
V
GS
= 3.5 V
6 V
Drain to Source Voltage V
DS
(V)
4 V
4.5 V
10 V
5 V
15 V
Typical Transfer Characteristics
1.6
1.2
0.8
0.4
0
2
4
6
8
10
Gate to Source Voltage V
GS
(V)
2.0
Drain Current I
D
(A)
V
DS
= 20 V
Pulse Test
25C
T
C
= 25C
75C
2SK1151(L)(S), 2SK1152(L)(S)
5
20
16
12
8
4
0
4
8
12
16
20
Gate to Source Voltage V
GS
(V)
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
1 A
I
D
= 0.5 A
Drain to Source Saturation Voltage
V
DS (on)
(V)
Pulse Test
2 A
100
50
20
10
1
0.1
0.2
0.5
1.0
5
Drain Current I
D
(A)
0.05
Static Drain to Source on State
Resistance vs. Drain Current
Pulse Test
15 V
V
GS
= 10 V
2
5
2
Static Drain to Source on State Resistance
R
DS (on)
(
)
10
8
6
4
2
0
0
40
80
120
160
Case Temperature T
C
(C)
40
Static Drain to Source on State
Resistance vs. Temperature
V
GS
= 10 V
Pulse Test
Static Drain-Source on State Resistance
R
DS (on)
(
)
I
D
= 2 A
0.5 A
1 A
Forward Transfer Admittance
vs. Drain Current
5
2
1.0
0.5
0.05
0.1
0.2
1.0
2
5
Drain Current I
D
(A)
0.1
0.2
0.5
V
DS
= 20 V
Pulse Test
75C
25C
Forward Transfer Admittance
yfs
(S)
T
C
= 25C
2SK1151(L)(S), 2SK1152(L)(S)
6
Body to Drain Diode Reverse
Recovery Time
di/dt = 100A/
s, Ta = 25C
V
GS
= 0
Pulse Test
Reverse Drain Current I
DR
(A)
Reverse Recovery Time t
rr
(ns)
1,000
500
100
50
20
10
200
0.05
0.1
0.2
0.5
1.0
2
5
Typical Capacitance
vs. Drain to Source Voltage
1,000
100
10
1
0
10
20
30
40
50
Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
Coss
Ciss
Crss
V
GS
= 0
f = 1 MHz
Dynamic Input Characteristics
500
400
300
200
100
0
2
4
6
8
10
Gate Charge Qg (nc)
Drain to Source Voltage V
DS
(V)
20
16
12
8
4
0
Gate to Source Voltage V
GS
(V)
400 V
100 V
V
DS
I
D
= 1.5 A
V
GS
250 V
V
DD
= 400 V
250 V
100 V
Switching Characteristics
100
20
10
5
2
1
50
Switching Time t (ns)
0.05
0.1
0.2
0.5
1.0
2
5
Drain Current I
D
(A)
t
f
V
GS
= 10 V V
DD
= 30 V
PW = 2
s, duty < 1%
t
d (on)
t
r
t
d (off)

2SK1151(L)(S), 2SK1152(L)(S)
7
Reverse Drain Current vs.
Source to Drain Voltage
2.0
1.6
1.2
0.8
0.4
0
0.4
0.8
1.2
1.6
2.0
Source to Drain Voltage V
SD
(V)
Reverse Drain Current I
DR
(A)
Pulse Test
5 V,10 V
V
GS
=0, 10V
3
1.0
0.1
0.03
0.01
0.3
10
100
1 m
10 m
100 m
1
10
Pulse Width PW (s)
chc(t) =
S
(t)
chc
chc = 6.25C/W, T
C
= 25C
P
DM
PW
T
D =
T
PW
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance
S
(t)
T
C
= 25C
0.05
0.02
0.2
0.1
0.5
D = 1
1 Shot Pulse
0.01
Vin Monitor
Vout Monitor
R
L
50
Vin = 10 V
D.U.T
.
V
DD
= 30 V
.
Switching Time Test Circuit
Vin
10 %
90 %
90 %
90 %
10 %
td (on)
td (off)
tr
tf
Vout
10 %
Wavewforms
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DPAK (L)-(1)
--
Conforms
0.42 g
Unit: mm
6.5
0.5
2.3
0.2
0.55
0.1
1.2
0.3
0.55
0.1
5.5
0
.
5
1.7
0.5
16.2
0.5
3.1
0.5
5.4
0.5
1.15
0.1
2.29
0.5
2.29
0.5
0.8
0.1
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