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Электронный компонент: 2SK1318

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2SK1318
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-1269 (Z)
1st. Edition
Jan. 2001
Features
Low on-resistance
High speed switching
Low drive current
4V gate drive device can be driven from 5V source
Suitable for motor drive, DC-DC converter, power switch and solenoid drive
Outline
1
2 3
TO-220FM
1. Gate
2. Drain
3. Source
D
G
S
2SK1318
2
Absolute Maximum Ratings (Ta = 25C)
Item
Symbol
Ratings
Unit
Drain to source voltage
V
DSS
120
V
Gate to source voltage
V
GSS
20
V
Drain current
I
D
20
A
Drain peak current
I
D (peak)
*
1
80
A
Body to drain diode reverse drain
current
I
DR
20
A
Channel dissipation
Pch*
2
35
W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10
s, duty cycle
1%
2. Value at Tc = 25C
2SK1318
3
Electrical Characteristics (Ta = 25C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Drain to source breakdown
voltage
V
(BR)DSS
120
--
--
V
I
D
= 10mA, V
GS
= 0
Gate to source breakdown
voltage
V
(BR)GSS
20
--
--
V
I
G
= 100A, V
DS
= 0
Gate to source leak current
I
GSS
--
--
10
A
V
GS
= 16V, V
DS
= 0
Zero gate voltege drain current
I
DSS
--
--
250
A
V
DS
= 100V, V
GS
= 0
Gate to source cutoff voltage
V
GS(off)
1.0
--
2.0
V
I
D
= 1mA, V
DS
= 10V
Static drain to source on state
R
DS(on)
--
0.095
0.12
I
D
= 10A, V
GS
= 10V*
1
resistance
--
0.11
0.16
I
D
= 10A, V
GS
= 4V*
1
Forward transfer admittance
|y
fs
|
10
17
\
S
I
D
= 10A, V
DS
= 10V*
1
Input capacitance
Ciss
--
1300
\
pF
V
DS
= 10V, V
GS
= 0,
Output capacitance
Coss
--
430
--
pF
f = 1MHz
Reverse transfer capacitance
Crss
--
60
--
pF
Turn-on delay time
td (on)
--
14
--
ns
I
D
= 10A,
Rise time
tr
--
70
--
ns
V
GS
= 10V, R
L
= 3
Turn-off delay time
td (off)
--
210
--
ns
Fall time
tf
--
90
--
ns
Bodydrain diode forward
voltage
V
DF
--
1.4
--
V
I
F
= 20A, V
GS
= 0
Bodydrain diode reverse
recovery time
trr
--
280
--
ns
I
F
= 20A, V
GS
= 0,
diF / dt = 50A / s
Note:
1. Pulse test
2SK1318
4
Main Characteristics
60
40
20
0
50
100
150
Case Temperature T
C
(
C)
Channel Dissipation Pch (W)
Power vs. Temperature Derating
100
10
1
0.1
10
100
1,000
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
30
3
0.3
1
3
30
300
Ta = 25
C
100
s
1 ms
DC Operation (T
C
= 25
C)
PW = 10 ms (1 Shot)
Operation in this Area
Limited by R
DS (on)
Maximum Safe Operation Area
10
s
20
4
10
Drain to Source Voltage V
DS
(V)
16
4
2
6
8
Pulse Test
0
8
12
3 V
2.5 V
V
GS
= 2.0 V
4 V
10 V
Drain Current I
D
(A)
Typical Output Characteristics
20
2
5
Gate to Source Voltage V
GS
(V)
Drain Current I
D
(A)
16
4
1
3
4
--25
C
0
8
12
V
DS
= 10 V
Pulse Test
75C
T
C
= 25
C
Typical Transfer Characteristics
2SK1318
5
5
8
20
Gate to Source Voltage V
GS
(V)
Drain to Source Saturation Voltage V
DS (on)
(V)
4
1
4
12
16
0
2
3
10 A
I
D
= 20 A
Pulse Test
5 A
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
1
2
50
Drain Current I
D
(A)
Static Drain to Source on State Resistance
R
DS (on)
(
)
0.5
0.02
1
5
20
0.5
0.1
0.2
0.05
0.01
10
10 V
V
GS
= 4 V
Pulse Test
Static Drain to Source on State
Resistance vs. Drain Current
0.25
40
160
Case Temperature T
C
(
C)
Static Drain to Source on State Resistance
R
D
S (on)
(
)
0.2
0.05
0
80
120
0
0.1
0.15
I
D
= 20 A
Pulse Test
10 A
--40
Static Drain to Source on State
Resistance vs. Temperature
V
GS
= 4 V
V
GS
= 10 V
5 A
10 A
5 A
100
2
50
Drain Current I
D
(A)
Forward Transfer Admittance
yfs
(S)
50
5
1
5
20
1
10
20
Forward Transfer Admittance
vs. Drain Current
Tc = --25
C
V
DS
= 10 V
Pulse Test
0.5
2
10
25
C
75
C
2SK1318
6
500
1
20
Reverse Drain Current I
DR
(A)
Reverse Recovery Time t
rr
(ns) 200
20
0.5
2
10
5
50
100
di/dt = 50 A/
s
V
GS
= 0, Ta
= 25
C
Pulse Test
0.2
10
5
Body to Drain Diode Reverse
Recovery Time
10,000
20
50
Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
1,000
10
30
40
100
0
10
Crss
Coss
Ciss
V
GS
= 0
f = 1 MHz
Typical Capacitance vs.
Drain to Source Voltage
200
40
100
Gate Charge Qg (nc)
Drain to Source Voltage V
DS
(V)
160
40
20
60
80
0
80
120
V
DS
20
16
4
0
8
12
V
DD
= 100 V
50 V
25 V
I
D
= 20 A
V
GS
Gate to Source Voltage V
GS
(V)
Dynamic Input Characteristics
25 V
50 V
V
DD
= 100 V
500
1
20
Drain Current I
D
(A)
Switching Time t (ns)
200
20
0.5
2
10
5
50
100
0.2
10
5
t
f
t
d (on)
t
r
V
GS
= 10 V, PW = 2
s
duty 1%, V
DD
30 V
t
d (off)
=
.
.
Switching Characteristics
<
=
2SK1318
7
20
1
2.5
Source to Drain Voltage V
SD
(V)
Reverse Drain Current I
DR
(A) 16
0.5
1.5
2
8
12
Pulse Test
0
4
V
GS
= 0, --5 V
Reverse Drain Current vs.
Source to Drain Voltage
V
GS
= 10 V
15 V
3
Pulse Width PW (s)
Normalized Transient Thermal Impedance
S
(t)
1.0
0.1
0.3
D = 1
10
0.03
0.01
100
10 m
100 m
1
10
1 m
T
C
= 25
C
0.5
0.2
0.1
0.05
0.02
0.01
1 Shot Pulse
T
PW
P
DM
D =
T
PW
ch - c (t) =
S
(t)
ch--c
ch - c = 3.57
C/W, T
C
= 25
C
Normalized Transient Thermal Impedance vs. Pulse Width
2SK1318
8
Switching Time Test Circuit
Vin Monitor
Vin
10 V
50
D.U.T
Vout Monitor
V
DD
30 V
=
.
.
R
L
Waveforms
Vin
Vout
t
d (on)
10%
t
r
t
f
10%
90%
10%
90%
t
d (off)
90%
2SK1318
9
Package Dimensions
10.0
0.3
7.0
0.3
3.2
0.2
12.0
0.3
0.6
2.8
0.2
2.5
0.2
17.0
0.3
14.0
1.0
0.5
0.1
2.5
4.45
0.3
5.0
0.3
2.0
0.3
0.7
0.1
2.54
0.5
2.54
0.5
1.2
0.2
1.4
0.2
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
TO-220FM
--
Conforms
1.8 g
As of January, 2001
Unit: mm
2SK1318
10
Cautions
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of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
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failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
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5. This product is not designed to be radiation resistant.
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Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright
Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
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