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Электронный компонент: 2SK740

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2SK740
Silicon N-Channel MOS FET
Application
High speed power switching
Features
Low on-resistance
High speed switching
Low drive current
No secondary breakdown
Suitable for switching regulator, DC-DC converter and motor driver
Outline
1
2
3
TO-220AB
1. Gate
2. Drain
(Flange)
3. Source
D
G
S
2SK740
2
Absolute Maximum Ratings (Ta = 25C)
Item
Symbol
Ratings
Unit
Drain to source voltage
V
DSS
150
V
Gate to source voltage
V
GSS
20
V
Drain current
I
D
10
A
Drain peak current
I
D(pulse)
*
1
40
A
Body to drain diode reverse drain current
I
DR
10
A
Channel dissipation
Pch*
2
50
W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10
s, duty cycle
1%
2. Value at T
C
= 25
C
Electrical Characteristics (Ta = 25C)
Item
Symbol Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V
(BR)DSS
150
--
--
V
I
D
= 10 mA, V
GS
= 0
Gate to source breakdown
voltage
V
(BR)GSS
20
--
--
V
I
G
=
100
A, V
DS
= 0
Gate to source leak current
I
GSS
--
--
10
A
V
GS
=
16 V, V
DS
= 0
Zero gate voltage drain current I
DSS
--
--
250
A
V
DS
= 120 V, V
GS
= 0
Gate to source cutoff voltage
V
GS(off)
2.0
--
4.0
V
I
D
= 1 mA, V
DS
= 10 V
Static drain to source on state
resistance
R
DS(on)
--
0.12
0.15
I
D
= 5 A, V
GS
= 10 V *
1
Forward transfer admittance
|y
fs
|
4.0
7.0
--
S
I
D
= 5 A, V
DS
= 10 V *
1
Input capacitance
Ciss
--
1200
--
pF
V
DS
= 10 V, V
GS
= 0,
Output capacitance
Coss
--
550
--
pF
f = 1 MHz
Reverse transfer capacitance
Crss
--
85
--
pF
Turn-on delay time
t
d(on)
--
20
--
ns
I
D
= 5 A, V
GS
= 10 V,
Rise time
t
r
--
50
--
ns
R
L
= 6
Turn-off delay time
t
d(off)
--
70
--
ns
Fall time
t
f
--
40
--
ns
Body to drain diode forward
voltage
V
DF
--
1.2
--
V
I
F
= 10 A, V
GS
= 0
Body to drain diode reverse
recovery time
t
rr
--
220
--
ns
I
F
= 10 A, V
GS
= 0,
di
F
/dt = 50 A/
s
Note:
1. Pulse test
2SK740
3
Power vs. Temperature Derating
60
40
20
0
Channel Dissipation Pch (W)
50
100
150
Case Temperature T
C
(C)
Maximum Safe Operation Area
1
10
1,000
Drain to Source Voltage V
DS
(V)
1.0
0.1
100
100
Operation in this area is
limited by R
DS (on)
DC Operation (T
C
= 25C)
PW = 10 ms (1 Shot)
Ta = 25C
1 ms
100
s
10
s
10
Drain Current I
D
(A)
Typical Output Characteristics
20
16
12
8
0
4
8
12
16
20
4
Drain Current I
D
(A)
Drain to Source Voltage V
DS
(V)
15V
6 V
10 V
Pulse Test
5.5 V
5 V
V
GS
= 4.5 V
8 V
Typical Transfer Characteristics
16
12
8
4
0
2
4
6
8
10
Gate to Source Voltage V
GS
(V)
20
75C
Drain Current I
D
(A)
V
DS
= 10 V
Pulse Test
25C
T
C
= 25C
2SK740
4
5
4
3
2
1
0
4
8
12
16
20
Gate to Source Voltage V
GS
(V)
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
5 A
2 A
I
D
= 10 A
PulseTest
Drain to Source Saturation Voltage
V
DS (on)
(V)
0.5
0.2
0.1
0.05
0.005
1.0
2
5
10
50
Drain Current I
D
(A)
0.5
Static Drain to Source on State
Resistance vs. Drain Current
20
0.02
0.01
Static Drain to Source on State Resistance
R
DS (on)
(
)
15 V
V
GS
= 10 V
Pulse Test
0.5
0.4
0.3
0.2
0.1
0
0
40
80
120
160
Case Temperature T
C
(C)
40
Static Drain to Source on State
Resistance vs. Temperature
V
GS
= 10 V
Pulse Test
Static Drain to Source on State Resistance
R
DS (on)
(
)
2 A
5 A
10 A
Forward Transfer Admittance
vs. Drain Current
50
20
10
5
0.5
0.2
0.5
1.0
5
10
20
1.0
2
2
Drain Current I
D
(A)
Forward Transfer Admittance
yfs
(S)
25C
Ta = 25C
75C
V
GS
= 10 V
Pulse Test
2SK740
5
Body to Drain Diode Reverse
Recovery Time
Reverse Drain Current I
DR
(A)
Reverse Recovery Time t
rr
(ns)
500
200
50
20
10
5
100
0.5
1.0
2
5
10
20
50
di/dt = 50 A/
s
V
GS
= 0
Ta = 25C
Pulse Test
Typical Capacitance
vs. Drain to Source Voltage
10,000
1,000
100
10
0
10
20
30
40
50
Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
Crss
V
GS
= 0
f = 1 MHz
Coss
Ciss
Dynamic Input Characteristics
200
160
120
80
40
0
8
16
24
32
40
Gate Charge Qg (nc)
20
16
12
8
4
0
Gate to Source Voltage V
GS
(V)
25 V
V
DD
= 100 V
V
DS
I
D
= 10 A
V
GS
50 V
V
DD
= 100 V
25 V
50 V
Drain to Source Voltage V
DS
(V)
50 V
Switching Characteristics
500
100
50
20
10
5
200
Switching Time t (ns)
0.2
0.5
1.0
2
5
20
Drain Current I
D
(A)
t
d (on)
10
t
d (off)
t
r
V
GS
= 10 V V
DD
= 30 V
PW = 2
s, duty 1 %
t
f
<

2SK740
6
Reverse Drain Current vs.
Source to Drain Voltage
20
16
12
8
4
0
0.4
0.8
1.2
1.6
2.0
Source to Drain Voltage V
SD
(V)
Reverse Drain Current I
DR
(A)
Pulse Test
5 V, 10 V
V
GS
= 0, 5 V
3
1.0
0.1
0.03
0.01
0.3
10
100
1 m
10 m
100 m
1
10
Pulse Width PW (s)
0.05
0.02
0.2
0.1
0.5
D = 1
chc (t) =
S
(t)
chc
chc = 2.5C/W, T
C
= 25C
P
DM
PW
T
D =
T
PW
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance
S
(t)
1 Shot Pulse
T
C
= 25C
0.01
Vin Monitor
Vout Monitor
R
L
50
Vin = 10 V
D.U.T
.
V
DD
= 30 V
.
Switching Time Test Circuit
Vin
10 %
90 %
90 %
90 %
10 %
td (on)
td (off)
tr
tf
Vout
10 %
Wavewforms
0.5
0.1
2.54
0.5
0.76
0.1
14.0
0.5
15.0
0.3
2.79
0.2
18.5
0.5
7.8
0.5
10.16
0.2
2.54
0.5
1.26
0.15
4.44
0.2
2.7 MAX
1.5 MAX
11.5 MAX
9.5
8.0
1.27
6.4
+0.2
0.1
3.6
+0.1
-0.08
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-220AB
Conforms
Conforms
1.8 g
Unit: mm
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