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Электронный компонент: 4AM15

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4AM15
Silicon N-Channel/P-Channel Power MOS FET Array
Application
High speed power switching
Features
Low on-resistance
N Channel: RDS(on)
0.5
, VGS = 10 V, ID = 2 A
P Channel: RDS(on)
0.9
, VGS = 10 V, ID = 2 A
Low drive current
High speed switching
High density mounting
Suitable for H-bridged motor driver
Outline
4AM15
2
Absolute Maximum Ratings (Ta = 25C)
Ratings
Item
Symbol
Nch
Pch
Unit
Drain to source voltage
VDSS
200
200
V
Gate to source voltage
VGSS
20
20
V
Drain current
ID
4
4
A
Drain peak current
ID(pulse)*
1
16
16
A
Body to drain diode reverse drain current
IDR
4
4
A
Channel dissipation
Pch (Tc = 25C)*2 32
W
Pch*2
4.0
W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10 s, duty cycle
1%
2. 4 Device Operation
4AM15
3
Electrical Characteristics (Ta = 25C)
N Channel
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V(BR)DS
S
200
--
--
V
ID = 10 mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GS
S
20
--
--
V
IG = 100 A, VDS = 0
Gate to source leak current
IGSS
--
--
10
A
VGS = 16 V, VDS = 0
Zero gate voltage drain current IDSS
--
--
250
A
VDS = 160 V, VGS = 0
Gate to source cutoff voltage
VGS(off) 2.0
--
4.0
V
ID = 1 mA, VDS = 10 V
Static drain to source on state
resistance
RDS(on) --
0.33
0.5
ID = 2 A, VGS = 10 V*
1
Forward transfer admittance
|yfs|
1.5
3.0
--
S
ID = 2 A
VDS = 10 V*
1
Input capacitance
Ciss
--
750
--
pF
VDS = 10 V
Output capacitance
Coss
--
260
--
pF
VGS = 0
Reverse transfer capacitance
Crss
--
40
--
pF
f = 1 MHz
Turn-on delay time
td(on)
--
19
--
ns
ID = 2 A
Rise time
tr
--
26
--
ns
VGS = 10 V
Turn-off delay time
td(off)
--
45
--
ns
RL = 15
Fall time
tf
--
24
--
ns
Body to drain diode forward
voltage
VDF
--
1.0
--
V
IF = 4 A, VGS = 0
Body to drain diode reverse
recovery time
trr
--
125
--
ns
IF = 4 A, VGS = 0,
diF/dt = 100 A/s
Note:
1. Pulse Test
See characteristic curves of 2SK1957
4AM15
4
Electrical Characteristics (Ta = 25C)
P Channel
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V(BR)DS
S
200
--
--
V
ID = 10 mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GS
S
20
--
--
V
IG = 100 A, VDS = 0
Gate to source leak current
IGSS
--
--
10
A
VGS = 16 V, VDS = 0
Zero gate voltage drain current IDSS
--
--
250
A
VDS = 160 V, VGS = 0
Gate to source cutoff voltage
VGS(off) 2.0
--
4.0
V
ID = 1 mA, VDS = 10 V
Static drain to source on state
resistance
RDS(on) --
0.7
0.9
ID = 2 A, VGS = 10 V*
1
Forward transfer admittance
|yfs|
1.5
3.0
--
S
ID = 2 A
VDS = 10 V*
1
Input capacitance
Ciss
--
920
--
pF
VDS = 10 V
Output capacitance
Coss
--
23 0
--
pF
VGS = 0
Reverse transfer capacitance
Crss
--
70
--
pF
f = 1 MHz
Turn-on delay time
td(on)
--
17
--
ns
ID = 2 A
Rise time
tr
--
40
--
ns
VGS = 10 V
Turn-off delay time
td(off)
--
85
--
ns
RL = 15
Fall time
tf
--
45
--
ns
Body to drain diode forward
voltage
VDF
--
1.0
--
V
IF = 4 A, VGS = 0
Body to drain diode reverse
recovery time
trr
--
170
--
ns
IF = 4 A, VGS = 0,
diF/dt = 100 A/s
Note:
1. Pulse Test
4AM15
5
4AM15
6
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performance of Hitachi's semiconductor products. Hitachi assumes no responsibility for any
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examples described herein.
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