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Электронный компонент: HA17324

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HA17324/A Series
Quad Operational Amplifier
ADE-204-031 (Z)
1st Edition
Apr. 2000
Description
HA17324 series and HA17324A series are quad operational amplifier that provide high gain and internal
phase compensation, with single power supply. They can be widely used to control equipments.
Features
Wide range of supply voltage, and single power supply used
Internal phase compensation
Wide range of common mode voltage, and possible to operate with an input about 0V
Features only for "A" series
Low electro-magnetic interference level
Output Offset Voltage vs. Input Interference
Measurement Condition
Output offset voltage
(arb. unit)
5.0
4.0
3.0
2.0
1.0
0
-
1.0
100E+3
1E+6
10E+6
100E+6
1E+9
10E+9
Input RF frequency (Hz)
HA17324A series
HA17324 series
Rs
-
+
Rs
0.01
Vin
-
10 dBm
RF signal source
(for quasi-RF noise)
Vcc = +7.5 V
Vee =
-
7.5 V
Rf
Rf
Vout
(= 100
Vio)
V
_
Notice: The example of an applied circuit or combination with other equipment shown herein indicates
characteristics and performance of semiconductor -applied products.
The company shall assume no responsibility for any problem involving a patent caused when
applying the descriptions in the example.
HA17324/A Series
2
Ordering Information
HA17324 Series
Type No.
Application
Package
HA17324P
Industrial use
DP-14
HA17324FP
FP-14DA
HA17324
Commercial use
DP-14
HA17324F
FP-14DA
HA17324A Series
Type No.
Application
Package
HA17324AP
Industrial use
DP-14
HA17324ARP
FP-14DN
HA17324AFP
FP-14DA
HA17324/A Series
3
Pin Arrangement
Vout1
Vin(
-
)1
Vin(+)1
V
CC
Vin(+)2
Vin(
-
)2
Vout2
Vout4
Vin(
-
)4
Vin(+)4
V
EE
Vin(+)3
Vin(
-
)3
Vout3
-
1
+
2
(Top view)
1
3
2
3
4
5
6
7
14
13
12
11
10
9
8
+
4
-
-
+
+
-
Circuit Schematic (1/4)
Q
1
Q
4
Q
2
Q
3
Q
5
Q
6
Q
7
Q
13
Q
12
Q
11
Q
10
Q
8
Q
9
Vout
R
1
Vin(+)
Vin(
-
)
C
HA17324/A Series
4
Absolute Maximum Ratings (Ta = 25
C)
Ratings
Item
Symbol
HA17324/P/AP
HA17324F/FP/ARP/AFP
Unit
Supply voltage
V
CC
32
32
V
Sink current
Isink
50
50
mA
Power dissipation
P
T
625 *
1
625 *
2
mW
Common mode input voltage
V
CM
0.3 to V
CC
0.3 to V
CC
V
Differential input voltage
Vin (diff)
V
CC
V
CC
V
Operating temperature
Topr
20 to +75
20 to +75
C
Storage temperature
Tstg
55 to +125
55 to +125
C
Notes: 1. This is the allowable values up to Ta = 50
C. Derate by 8.3 mW/
C.
2. Tjmax =
j-a P
C
max + Ta (
j-a; Thermal resistor between junction and ambient at set board
use).
The wiring density and the material of the set board must be chosen for thermal conductance of
efficacy board.
And P
C
max cannot be over the value of P
T
.
240
220
200
180
160
140
120
100
80
Thermal resistor
j-a
(
C)
0.5
1
2
5
10
20
Thermal conductance of efficacy board (W/m
C)
a
b
SOP14
-
with compound
SOP14
-
no compound
40 mm
a. Class epoxy board of 10% wiring density
b. Class epoxy board of 30% wiring density
1.5 t epoxy
HA17324/A Series
5
Electrical Characteristics (V
CC
= +15 V, Ta = 25
C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Input offset voltage
V
IO
--
2
7
mV
V
CM
= 7.5 V, R
S
= 50
, Rf = 50 k
Input offset current
I
IO
--
5
50
nA
V
CM
= 7.5 V, I
IO
=
|
I
I ()
I
I (+)
|
Input bias current
I
IB
--
30
500
nA
V
CM
= 7.5 V
Power source rejection
ratio
PSRR
--
93
--
dB
f = 100 Hz, R
S
= 1 k
, Rj = 100 k
Voltage gain
A
VD
75
90
--
dB
R
S
= 1 k
, Rf = 100 k
, R
L
=
Common mode rejection
ratio
CMR
--
80
--
dB
R
S
= 50
, Rf = 5 k
Common mode input
voltage range
V
CM
0.3
--
13.5
V
R
S
= 1 k
, Rf = 100 k
, f = 100 Hz
Maximum output voltage
Vop-p
--
13.6
--
V
f = 100 Hz, R
S
= 1 k
, Rf = 100 k
,
R
L
= 20 k
Output source current
Iosource
20
40
--
mA
V
IN
+
= 1 V, V
IN
= 0 V, V
OH
= 10 V
Output sink current
Iosink
10
20
--
mA
V
IN
= 0 V, V
IN
= 1 V, V
OL
= 2.5 V
Supply current
I
CC
--
0.8
2
mA
V
IN
= GND, R
L
=
Slew rate
SR
--
0.19
--
V/
s
f = 1.5 kHz, V
CM
= 7.5 V, R
L
=
Channel separation
CS
--
120
--
dB
f = 1 kHz
Output sink current
Iosink
15
50
--
A
V
IN
+
= 0 V, V
IN
= 1 V, V
OL
= 200 mV
Iosink
3
9
--
mA
V
IN
+
= 0 V, V
IN
= 1 V, V
OL
= 1 V
Output voltage
V
OH
13.2
13.6
--
V
I
OH
= 1 mA
V
OH
12.0
13.3
--
V
I
OH
= 10 mA
Output voltage
V
OL
--
0.8
1.0
V
I
OL
= 1 mA
V
OL
--
1.1
1.8
V
I
OL
= 10 mA
HA17324/A Series
6
Characteristic Curves
Output Source Current vs. Ambient Temperature
80
Output source current Iosource (mA)
Ambeint temperature Ta (
C)
70
60
50
40
30
20
10
0
-
20
0
20
40
60
80
V
CC
= 15 V
V
OH
= 10 V
Input Bias Current vs. Ambient Temperature
80
Input bias current I
IB
(nA)
Ambeint temperature Ta (
C)
70
60
50
40
30
20
10
0
-
20
0
20
40
60
80
V
CC
= 15 V
V
CM
= 7.5 V
Supply Current vs. Supply Voltage
4
Supply current I
CC
(mA)
Supply voltage V
CC
(V)
3
2
1
0
8
16
24
32
40
Ta = 25
C
80
Input bias current I
IB
(nA)
Supply voltage V
CC
(V)
60
40
20
0
8
16
24
32
40
Ta = 25
C
Voltage Gain vs. Supply Voltage
160
Voltage gain A
VD
(dB)
Supply voltage V
CC
(V)
120
80
40
0
8
16
24
32
40
Ta = 25
C
R
L
=
Maxlmum Output Voltage vs. Frequency
Input Bias Current vs. Supply Voltage
20
Maximum output voltage V
OP
-
P
(V)
Frequency f (Hz)
1 k
3 k
10 k
30 k
100 k 300 k
16
12
8
4
0
V
CC
= 15 V
Ta = 25
C
R
L
= 20 k
1 M
HA17324/A Series
7
Voltage Gain vs. Frequency
V
CC
= 15V
Ta = 25
C
R
L
=
Voltage gain A
VD
(dB)
120
100
80
60
40
20
0
1
3
10
30
100
300
1 k
3 k
10 k
30 k
100 k 300 k
1 M
Frequency f (Hz)
V
CC
= 15V
Ta = 25
C
R
S
= 50
120
100
80
60
40
20
0
100
300
1 k
3 k
10 k
30 k
100 k 300 k
1M
Frequency f (Hz)
Common Mode Rejection Ratio vs. Frequency
Common mode rejection ratio CMR (dB)
HA17324/A Series
8
Solder Mounting Method
1. Small and light surface-mount packages require spicial attentions on solder mounting.
On solder mounting, pre-heating before soldering is needed.
The following figure show an example of infrared rays refow.
2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a
failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress.
Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic
substrates.
Temperature
140 to 160
C
1 to 5
C/s
235
C Max
10 s Max
1 to 4
C/s
Time (s)
60 s
Figure 1 An Example of Infrared Rays Reflow Conditions
HA17324/A Series
9
Package Dimensions
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
DP-14
Conforms
Conforms
0.97 g
Unit: mm
7.62
0.25
0
15
19.20
20.32 Max
1
8
14
7
1.30
2.54
0.25
0.48
0.10
6.30
7.40 Max
0.51 Min
2.54 Min
5.06 Max
+ 0.10
0.05
2.39 Max
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
FP-14DA
--
Conforms
0.23 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
*0.22
0.05
*0.42
0.08
0.70
0.20
0.12
0.15
0
8
M
0.10
0.10
2.20 Max
5.5
10.06
1.42 Max
14
8
1
7
10.5 Max
+ 0.20
0.30
7.80
1.15
1.27
0.40
0.06
0.20
0.04
HA17324/A Series
10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-14DN
Conforms
Conforms
0.13 g
Unit: mm
0
8
1.27
14
8
1
7
0.15
0.25
M
1.75 Max
3.95
*0.20
0.05
8.65
9.05 Max
*0.40
0.06
0.14
+ 0.11 0.04
0.635 Max
6.10
+ 0.10
0.30
0.60
+ 0.67
0.20
1.08
*Pd plating
HA17324/A Series
11
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party's rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi's sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright ' Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
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