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Электронный компонент: HTT1213E

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HTT1213E
Silicon NPN Epitaxial Twin Transistor
ADE-208-1449(Z)
Preliminary
Rev. 0
Aug. 2001
Features
Include 2 transistors in a small size SMD package: EMFPAK6 (6 Leads: 1.2 x 0.8 x 0.5 mm)
Q1:
Equivalent
Buffer Transistor
Q2:
Equivalent
OSC Transistor
2SC5700
2SC5700
Outline
1. Collector Q1
2. Emitter Q1
3. Collector Q2
4. Base Q2
5. Emitter Q2
6. Base Q1
6
5
4
3
2
1
B1
E2
B2
C1
E1
C2
Internal Connection
Q1
Q2
EMFPAK-6
1
2
3
4
5
6
Note: Marking is "E".
HTT1213E
Rev.0, Aug. 2001, page 2 of 4
Absolute Maximum Ratings
(Ta = 25
C)
Ratings
Item
Symbol
Q1 and Q2
Unit
Collector to base voltage
V
CBO
15
V
Collector to emitter voltage
V
CEO
4
V
Emitter to base voltage
V
EBO
1.5
V
Collector current
I
C
50
mA
Collector power dissipation
P
C
Total 200*
mW
Junction temperature
Tj
150
C
Storage temperature
Tstg
55 to
+
150
C
*Value on PCB. (FR4(13 x 13 x 0.635 mm))
Electrical Characteristics (Q1 and Q2)
(Ta = 25
C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V
(BR)CBO
15
V
I
C
= 10
A, I
E
= 0
Collector cutoff current
I
CBO
0.1
mA
V
CB
= 15 V, I
E
= 0
Collector cutoff current
I
CEO
1
mA
V
CE
= 4 V, R
BE
= infinite
Emitter cutoff current
I
EBO
0.2
mA
V
EB
= 0.8 V, I
C
= 0
DC current transfer ratio
h
FE
100
130
170
V
CE
= 1 V, I
C
= 5 mA
Reverse transfer capacitance C
re
0.30
0.45
pF
V
CB
= 1 V, f = 1 MHz
Emitter ground
Gain bandwidth product
f
T
10
12
GHz
V
CE
= 1 V, I
C
= 5 mA, f = 1 GHz
Forward transfer coefficient
|S
21
|
2
13
16
dB
Noise figure
NF
1.0
2.0
dB
V
CE
= 1 V, I
C
= 5 mA,
f = 900 MHz,
S
=
L
= 50
HTT1213E
Rev.0, Aug. 2001, page 3 of 4
Package Dimensions
1.2 0.05
0.8 0.1
(0.1)
0.2 0.1
0.2 0.1
(0.1)
1.0 0.05
0.5MAX
(0.4) (0.4)
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
EMFPAK-6
--
Conforms
1.2 mg
Unit: mm
6 0.15
+ 0.1
0.05
0.15
+ 0.1
0.05
HTT1213E
Rev.0, Aug. 2001, page 4 of 4
Disclaimer
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party's rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi's sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor
products.
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Tel: (03) 3270-2111 Fax: (03) 3270-5109
Copyright Hitachi, Ltd., 2001. All rights reserved. Printed in Japan.
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