MICROWAVE CORPORATION
14 - 158
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
SWITCHES - SMT
14
HMC284MS8G
SPDT NON-REFLECTIVE
SWITCH, DC - 3.5 GHz
v03.0404
General Description
Features
Functional Diagram
High Isolation: >45 dB
Positive control: 0/+5V
Non-Refl ective Design
Ultra Small Pakcage: MSOP8G
Electrical Specifi cations,
T
A
= +25 C, Vctl = 0/+5 Vdc, 50 Ohm System
Typical Applications
The HMC284MS8G is ideal for:
Cellular/PCS Base Stations
2.4 GHz ISM
3.5 GHz Wireless Local Loop
The HMC284MS8G is a low-cost SPDT switch in an
8-lead grounded base MSOP package. The design
has been optimized to provide high isolation with
minimal insertion loss for medium and low power
applications. On-chip circuitry allows positive volt-
age control operation at very low DC currents with
control inputs compatible with CMOS and most TTL
logic families. In the "OFF" state, RF1 and RF2 are
non-refl ective. See refl ective high isolation SPDT
version, HMC194MS8.
Parameter
Frequency
Min.
Typ.
Max.
Units
Insertion Loss
DC - 2.0 GHz
DC - 3.0 GHz
DC - 3.5 GHz
0.5
0.6
0.7
0.8
0.9
1.1
dB
dB
dB
Isolation
RF1 & RF2
RF1 / RF2
RF1 / RF2
RF1 & RF2
DC - 2.0 GHz
DC - 2.5 GHz
DC - 3.0 GHz
DC - 3.5 GHz
41
38/41
34/36
30
45
41/45
37/39
33
dB
dB
dB
dB
Return Loss (On State)
DC - 2.0 GHz
DC - 2.5 GHz
DC - 3.5 GHz
21
13
10
25
17
12
dB
dB
dB
Return Loss (Off State)
0.5 - 3.5 GHz
10
13
dB
Input Power for 1 dB Compression
0.5 - 1.0 GHz
0.5 - 3.5 GHz
20
18
25
24
dBm
dBm
Input Third Order Intercept
(Two-Tone Input Powew = 0 dBm Each Tone)
0.5 - 3.5 GHz
43
48
dBm
Switching Speed
DC - 3.5 GHz
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
40
60
ns
ns
MICROWAVE CORPORATION
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
14
SWITCHES - SMT
-3
-2.5
-2
-1.5
-1
-0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
INSERTION LOSS (dB)
FREQUENCY (GHz)
+85 C
+25 C
-40 C
-60
-50
-40
-30
-20
-10
0
0
0.5
1
1.5
2
2.5
3
3.5
4
ISOLATION (dB)
FREQUENCY (GHz)
RF1
RF2
-40
-35
-30
-25
-20
-15
-10
-5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
RETURN LOSS (dB)
FREQUENCY (GHz)
S22 (ON)
S11 (ON)
S22 (OFF)
HMC284MS8G
Return Loss
v03.0404
Insertion Loss
Isolation
SPDT NON-REFLECTIVE
SWITCH, DC - 3.5 GHz
MICROWAVE CORPORATION
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
SWITCHES - SMT
14
HMC284MS8G
v03.0404
SPDT NON-REFLECTIVE
SWITCH, DC - 3.5 GHz
Truth Table
*Control Input Tolerances are +/-0.2 Vdc
DC blocks are required at ports RFC, RF1, RF2.
Control Input*
Control Current
Signal Path State
A
(Vdc)
B
(Vdc)
Ia
(uA)
Ib
(uA)
RFC to
RF1
RFC to
RF2
0
+5
-25
25
ON
OFF
+5
0
25
-25
OFF
ON
Compression vs Frequency
Caution:
Do not operate continuously at RF power input greater than 1 dB compression and
do not "hot switch" power levels greater than +18 dBm (Control = 0/+5 Vdc).
Carrier at 900 MHz
Carrier at 1900 MHz
CTL
Input
Input Power for 0.1
dB Compression
Input Power for 1.0
dB Compression
Input Power for 0.1
dB Compression
Input Power for 1.0
dB Compression
(Vdc)
(dBm)
(dBm)
(dBm)
(dBm)
+5
23
25
22
24
Distortion vs Frequency
Control Input
Third Order Intercept (dBm)
0 dBm Each Tone
(Vdc)
900 MHz
1900 MHz
+5
48
50
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
14
SWITCHES - SMT
HMC284MS8G
v03.0404
SPDT NON-REFLECTIVE
SWITCH, DC - 3.5 GHz
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Absolute Maximum Ratings
Control Voltage Range
-0.2 to +7.5 Vdc
Channel Temperature
150 C
Thermal Resistance
(Insertion Loss Path)
140 C/W
Thermal Resistance
(Terminated Path)
190 C/W
Storage Temperature
-65 to +150 C
Operating Temperature
-40 to +85 C
RF Input Power Vctl = 0/+5V
+26 dBm
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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
SWITCHES - SMT
14
Typical Application Circuit
Notes:
1. Set A/B control to 0/+5V, Vdd = +5V and use HCT series logic to provide a TTL driver interface.
2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd = +5 Volts applied to the CMOS logic gates.
3. DC blocking capacitors are required for each RF port as shown. Capacitor value determines lowest frequency of
operation.
4. Highest RF signal power capability is acheived wiht Vdd = +7V and A/B set to 0/+7V.
5. Back side paddle must be connected to RF ground.
6. A grounded coplanar waveguide PCB layout technique is recommended to achieve high isolation. The component side
ground plane between RFC/grounded paddle and RF1/RF2 should be continuous, see below. There should be a continu-
ous ground plane under component side layout.
HMC284MS8G
v03.0404
SPDT NON-REFLECTIVE
SWITCH, DC - 3.5 GHz
MICROWAVE CORPORATION
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
14
SWITCHES - SMT
HMC284MS8G
v03.0404
SPDT NON-REFLECTIVE
SWITCH, DC - 3.5 GHz
Evaluation PCB
The circuit board used in the fi nal application should
be generated with proper RF circuit design tech-
niques. Signal lines at the RF port should have 50
ohm impedance and the package ground leads and
package bottom should be connected directly to the
ground plane similar to that shown above. The evalu-
ation circuit board shown above is available from
Hittite Microwave Corporation upon request.
List of Material
Item
Description
J1 - J3
PC Mount SMA RF Connector
J4 - J6
DC Pin
C1 - C3
100 pF capacitor, 0402 Pkg.
R1, R2
100
resistor, 0402 Pkg.
U1
HMC284MS8 SPDT Switch
PCB*
107821 Evaluation PCB
* Circuit Board Material: Rogers 4350
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