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8 - 34

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

AMPLIFIERS - SMT

HMC300LM1

SMT MEDIUM POWER GaAs MMIC

AMPLIFIER, 25.5 - 33.5 GHz

v02.1201

General Description

Features

Functional Diagram

SMT mmWave Package

Gain > 15 dB

Broadband Performance

Saturated Output Power: +24 dBm

Positive Supply: +5V to +7V

Electrical Specifi cations,

= +25° C, Vdd = +6V

Typical Applications

The HMC300LM1 is a broadband surface mount

medium power amplifi er that operates between 25.5

and 33.5 GHz. A 0.25 um power pHEMT process is

used to achieve effi cient gain and output power per-

formance. High volume surface mount re-fl ow assem-

bly techniques may be used to mount the amplifi er

to the end user's PCB. The LM1 package eliminates

the need for wire bonding or die attach mounting. The

amplifi er provides 15 dB of gain and +24 dBm of sat-

urated output power across various microwave radio

bands. This millimeter wave amplifi er requires no exter-

nal RF matching components and minimal DC bypass

components. The amplifi er operates from a +6V Vdd

and a -0.35V Vgg gate bias.

*Adjust Vgg 1 between -1.0 to 0V to achieve Idd = 220 mA typical.

This amplifi er is ideal for use as a power amplifi er for
25.5 - 33.5 GHz applications:

· LMDS

· Microwave Radio

Parameter

Min.

Typ.

Max.

Units

Frequency Range

25.5 - 33.5

GHz

Gain

Gain Variation Over Temperature

0.06

0.07

dB/°C

Input Return Loss

Output Return Loss

Reverse Isolation

Output 1 dB Compression (P1dB)

dBm

Saturated Output Power (Psat)

dBm

Output Third Order Intercept (IP3)
(Two-tone Input Power = -5 dBm each tone)

dBm

Supply Current (Idd)(Vdd = +6.0 Vdc)*

220

275

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

AMPLIFIERS - SMT

-25

-20

-15

-10

-5

S21
S11
S22

RESPONSE (dB)

FREQUENCY (GHz)

+25 C
+85 C

-40 C

GAIN (dB)

FREQUENCY (GHz)

-20

-15

-10

-5

+25 C
+85 C
-40 C

RETURN LOSS (dB)

FREQUENCY (GHz)

-20

-15

-10

-5

+25 C
+85 C
-40 C

RETURN LOSS (dB)

FREQUENCY (GHz)

+25 C
+85 C
-40 C

Output P1dB (dBm)

FREQUENCY (GHz)

+25 C
+85 C

-40 C

THIRD ORDER INTERCEPT POINT (dBm)

FREQUENCY (GHz)

Gain vs. Temperature @ Vdd = +6V

Output Return Loss vs.
Temperature @ Vdd = +6V

Input Return Loss vs.
Temperature @ Vdd = +6V

Output IP3 vs.
Temperature @ Vdd = +6V

Broadband Gain & Return Loss

P1dB Output Power vs.
Temperature @ Vdd = +6V

SMT MEDIUM POWER GaAs MMIC

AMPLIFIER, 25.5 - 33.5 GHz

v02.1201

HMC300LM1

MICROWAVE CORPORATION

8 - 36

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

AMPLIFIERS - SMT

Vdd=+5V
Vdd=+6V
Vdd=+7V

GAIN (dB)

FREQUENCY (GHz)

-20

-15

-10

-5

Vdd=+5V
Vdd=+6V
Vdd=+7V

RETURN LOSS (dB)

FREQUENCY (GHz)

-20

-15

-10

-5

Vdd=+5V
Vdd=+6V
Vdd=+7V

RETURN LOSS (dB)

FREQUENCY (GHz)

Vdd=+5V
Vdd=+6V
Vdd=+7V

Output P1dB (dBm)

FREQUENCY (GHz)

Vdd=+5V
Vdd=+6V
Vdd=+7V

Psat (dBm)

FREQUENCY (GHz)

Vdd=+5V
Vdd=+6V
Vdd=+7V

THIRD ORDER INTERCEPT POINT (dBm)

FREQUENCY (GHz)

PSAT Output Power vs. Vdd

IP3 vs. Vdd

Input Return Loss vs. Vdd

Gain vs. Vdd

Output Return Loss vs. Vdd

P1dB Output Power vs. Vdd

SMT MEDIUM POWER GaAs MMIC

AMPLIFIER, 25.5 - 33.5 GHz

v02.1201

HMC300LM1

MICROWAVE CORPORATION

8 - 37

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

AMPLIFIERS - SMT

Outline Drawing

Absolute Maximum Ratings

SMT MEDIUM POWER GaAs MMIC

AMPLIFIER, 25.5 - 33.5 GHz

v02.1201

HMC300LM1

NOTES:

1. MATERIAL: PLASTIC

2. PLATING: GOLD OVER NICKEL

3. DIMENSIONS ARE IN INCHES [MILLIMETERS].

4. ALL TOLERANCES ARE ± 0.005 [± 0.13].

5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND.

INDICATES PIN 1

Drain Bias Voltage (Vdd1, Vdd2)

+5.0 Vdc

Drain Bias Current (Idd)

500 mA

Gate Bias Voltage (Vgg1)

-2.0 to +0.4 Vdc

RF Input Power (RFin)(Vdd = +6.0 Vdc)

+10 dBm

Channel Temperature

150 °C

Continuous Pdiss (T = 85 °C)
(derate 15.03 mW/°C above 85 °C)

0.977 W

Thermal Resistance
(channel to ground paddle)

67 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85°C

Function

GND

Vdd1

Vdd2

RF OUT

GND

Vgg1

GND

RF IN

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AMPLIFIERS - SMT

Evaluation PCB

The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground (GSG)

probes for testing. Suggested probe pitch is 400µm (16 mils). Alternatively, the board can be mounted in a metal hous-

ing with 2.4 mm coaxial connectors.

Evaluation Circuit Board Layout Design Details

LM1 Package Mounted to Evaluation PCB

SMT MEDIUM POWER GaAs MMIC

AMPLIFIER, 25.5 - 33.5 GHz

v02.1201

HMC300LM1

Layout Technique

Micro Strip to CPWG

Material

Rogers 4003 with 1/2 oz. Cu

Dielectric Thickness

0.008" (0.20 mm)

Microstrip Line Width

0.018" (0.46 mm)

CPWG Line Width

0.016" (0.41 mm)

CPWG Line to GND Gap

0.005" (0.13 mm)

Ground Via Hole Diameter

0.008" (0.20 mm)

100 pF Capacitor, 0402 Pkg.

33,000 pF Capacitor, 1206 Pkg.

MICROWAVE CORPORATION

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

AMPLIFIERS - SMT

Recommended SMT Attachment Technique

Preparation & Handling of the LM1 Millimeterwave Package for Surface Mounting

The HMC LM1 package was designed to be compatible with
high volume surface mount PCB assembly processes. The
LM1 package requires a specifi c mounting pattern to allow
proper mechanical attachment and to optimize electrical
performance at millimeterwave frequencies. This PCB layout
pattern can be found on each LM1 product data sheet. It can
also be provided as an electronic drawing upon request from
Hittite Sales & Application Engineering.

Follow these precautions to avoid permanent damage:
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM1 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against
ESD strikes.
General Handling: Handle the LM1 package on the top with
a
vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoid damaging the RF, DC, & ground contacts on the package bottom. Do not apply
excess pressure to the top of the lid.
Solder Materials & Temperature Profi le: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is not recommended.

Solder Paste

Solder paste should be selected based on the user's experience and should be compatible with the metallization
systems used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes.

Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder
paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical &
electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies.

Solder Refl ow

The soldering process is usually accomplished in a refl ow oven but may also use a vapor phase process. A solder
refl ow profi le is suggested above.

Prior to refl owing product, temperature profi les should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The fi nal profi le should be determined by mounting the thermocouple to the PCB at
the location of the device.

Follow solder paste and oven vendor's recommendations when developing a solder refl ow profi le. A standard profi le
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and refl ow for the solvent in the paste to evaporate and the
fl ux to completely activate. Refl ow must then occur prior to the fl ux being completely driven off. The duration of peak
refl ow temperature should not exceed 15 seconds. Packages have been qualifi ed to withstand a peak temperature of
235°C for 15 seconds. Verify that the profi le will not expose device to temperatures in excess of 235°C.

Cleaning

A water-based fl ux wash may be used.

Recommended solder refl ow profi le

for HMC LM1 SMT Package

100

125

150

175

200

225

TEMPERATURE (

TIME (min)

SMT MEDIUM POWER GaAs MMIC

AMPLIFIER, 25.5 - 33.5 GHz

v02.1201

HMC300LM1

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ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: HMC300LM1