MICROWAVE CORPORATION
10 - 84
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
FREQ.
DIVIDER & DETECT
ORS - SMT
10
HMC434
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 8.0 GHz
General Description
Features
Functional Diagram
The HMC434 is a low noise Divide-by-8 Static
Divider utilizing InGaP GaAs HBT technology
in an ultra small surface mount SOT26 plastic
package. This device operates from DC (with a
square wave input) to 8.0 GHz input frequency
with a single +3.0V DC supply. Single-ended
inputs and outputs reduce component count and
cost. The low additive SSB phase noise of -150
dBc/Hz at 100 kHz offset helps the user maintain
good system noise performance.
Ultra Low SSB Phase Noise: -150 dBc/Hz
Single-Ended I/O's
Output Power: -2 dBm
Single DC Supply: +3V @ 62 mA
9 mm
2
Ultra Small Package: SOT26
Electrical Specifi cations,
T
A
= +25 C, 50 Ohm System, Vcc= +3V
Typical Applications
Prescaler for DC to C Band PLL Applications:
UNII, Pt. - Pt. & VSAT Radios
802.11a & HiperLAN WLAN
Fiber Optic
Cellular / 3G Infrastructure
1. Divider will operate down to DC for square-wave input signal.
v01.1002
Parameter
Conditions
Min.
Typ.
Max.
Units
Maximum Input Frequency
8
8.5
GHz
Minimum Input Frequency
Sine Wave Input. [1]
0.2
GHz
Input Power Range
Fin= 1 to 3 GHz
Fin= 3 to 7 GHz
Fin= 7 to 8 Ghz
-10
-3
0
-15
-7
-4
+12
+12
+10
dBm
dBm
dBm
Output Power
Fin= 1 to 8 GHz
-5.0
-2.0
dBm
Reverse Leakage
RF Output Terminated, Fin= 4 GHz, Pin= 0 dBm
-20
dBm
SSB Phase Noise (100 kHz offset)
Pin= 0 dBm, Fin= 4 GHz
-150
dBc/Hz
Output Transition Time
Pin= 0 dBm, Fout= 882 MHz
140
ps
Supply Current (Icc)
Vcc= +3.0V
62
mA
MICROWAVE CORPORATION
10 - 85
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
10
FREQ.
DIVIDERS & DETECT
ORS - SMT
-20
-15
-10
-5
0
5
10
15
20
0
1
2
3
4
5
6
7
8
9
10
INPUT POWER (dBm)
INPUT FREQUENCY (GHz)
-20
-15
-10
-5
0
5
10
15
20
0
1
2
3
4
5
6
7
8
9
10
Min Pin +25 C
Max Pin +25 C
Min Pin -40 C
Max Pin -40 C
Min Pin +85 C
Max Pin +85 C
INPUT POWER (dBm)
INPUT FREQUENCY (GHz)
-5
-4
-3
-2
-1
0
0
1
2
3
4
5
6
7
8
9
10
+25 C
-40 C
+75 C
OUTPUT POWER (dBm)
INPUT FREQUENCY (GHz)
-160
-140
-120
-100
-80
-60
-40
-20
0
10
2
10
3
10
4
10
5
10
6
10
7
SSB PHASE NOISE (dBc/Hz)
OFFSET FREQUENCY (Hz)
GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 17 - 25 GHz
HMC434
SSB Phase Noise
Performance, Pin= 0 dBm, T= 25 C
Input Sensitivity Window, T= 25 C
Input Sensitivity Window vs. Temperature
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 8.0 GHz
Output Power vs. Temperature
Recommended
Operating Window
-50
-40
-30
-20
-10
0
0
1
2
3
4
5
6
7
8
9
10
Pfeedthru
2nd Harmonic
3rd Harmonic
OUTPUT LEVEL (dBm)
INPUT FREQUENCY (GHz)
-60
-50
-40
-30
-20
-10
0
0
1
2
3
4
5
6
7
8
9
10
POWER LEVEL (dBm)
INPUT FREQUENCY (GHz)
Reverse Leakage, Pin= 0 dBm, T= 25 C
Output Harmonic
Content, Pin= 0 dBm, T= 25 C
v01.1002
MICROWAVE CORPORATION
10 - 86
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
FREQ.
DIVIDER & DETECT
ORS - SMT
10
-300
-250
-200
-150
-100
-50
0
50
100
150
200
250
300
22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7
AMPLITUDE (mV)
TIME (nS)
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 C
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 8.0 GHz
HMC434
Absolute Maximum Ratings
Outline Drawing
Typical Supply Current vs. Vcc
Note: Divider will operate over full voltage range shown above
v01.1002
RF Input (Vcc= +3.0V)
+15 dBm
Vcc
+3.5V
Maximum Channel Temperature
135 C
Continuous Pdiss (T=85 C)
(derate 5.35mW/C above 85 C)
268 mW
Storage Temperature
-65 to +150 C
Operating Temperature
-40 to + 85 C
Vcc (V)
Icc (mA)
2.70
50
3.0
62
3.30
74
DC blocking capacitors are required at RF input and RF output ports.
Choose value for lowest frequency of operation.
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
MICROWAVE CORPORATION
10 - 87
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
10
FREQ.
DIVIDERS & DETECT
ORS - SMT
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 8.0 GHz
HMC434
Pin Description
v01.1002
Pin Number
Function
Description
Interface Schematic
1, 4
N/C
No Connection
2
GND
Pin must connect ro RF/DC ground.
3
IN
RF input must be DC blocked.
5
Vcc
Supply voltage 3V 0.3V.
6
OUT
Divided output must be DC blocked.
MICROWAVE CORPORATION
10 - 88
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
FREQ.
DIVIDER & DETECT
ORS - SMT
10
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 8.0 GHz
HMC434
The circuit board used in the fi nal application should
use RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads should be connected directly to the ground
plane similar to that shown. A suffi cient number of via
holes should be used to connect the top and bottom
ground planes. The evaluation circuit board shown is
available from Hittite upon request.
Evaluation PCB
List of Materials
v01.1002
Item
Description
J1 - J2
PC Mount SMA RF Connector
J3 - J4
DC Pin
C1 - C2
100 pF Capacitor, 0402 Pkg.
C3
1000 pF Capacitor, 0402 Pkg.
C4
10 F Tantalum Capacitor, 1206 Pkg.
U1
HMC434 Divide-by-8
PCB*
105199 Eval Board
* Circuit Board Material: Rogers 4350
Note: Line lengths on pins 1 & 4
(N/C) are not necessary.
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