_________________________________________________________________________________________________________
Solid State Electronics Center
12001 State Highway 55, Plymouth, MN 55441 (800) 323-8295 http://www.ssec.honeywell.com
HIGH PERFORMANCE (SOI-V) ASICS
HX3000
FAMILY
FEATURES
GENERAL DESCRIPTION
Fabricated on Honeywell's Radiation Hardened
0.30
m L
eff
RICMOS
TM
Silicon On Insulator
(SOI-V) process
ASICS to 2.0M Usable Gates
3.3V or 2.5V Core Operation
Mixed Voltage I/O Power Supply (2.5V, 3.3V)
CMOS, PCI, Schmitt Trigger, LVDS, 5V Tol I/O
Single- or Multi-Port Custom SRAM Drop-In
Capability
Supports Chip Level Power Down for Cold
Sparing
On-Chip Analog Phase Locked Loop (PLL)
Maximum Clock Rates >300 MHz
Total Dose Hardness 3x10
5
rad(Si)
1x10
6
rad(Si) Option Available
Soft Error Rate < 1x10
-11
Errors/Bit-Day
No Latchup
Three library options
Gate Array
High Speed Standard Cell
Low Power Standard Cell
Ultra Low Power Typical Results
85-140 nW/Gate/MHz (3.3V)
50-80 nW/Gate/MHz (2.5V)
The HX3000 ASIC family is fabricated on
Honeywell's RICMOS
TM
Silicon on Insulator (SOI-V)
process. Very high density is achieved using a fully
planarized 4-layer metal process, providing up to
1.0 million usable gates. The high density and
performance characteristics of the SOI-V process
enable device operation beyond 250 MHz over the
full military temperature range, even after exposure
to ionizing radiation. Flip-flops are available with a
Soft Error Rate (SER) of less than 1x10
-11
Errors/Bit-Day in the Adams 90% worst case
environment.
Each HX3000 design is based on our proven
Radiation Insensitive CMOS (RICMOS) ASIC
Library of logic elements, configurable RAMs, and
selectable I/O pads. Clock tree insertion is
provided for low skew clock distribution. This family
is available with Honeywell's high reliability
screening procedures and consistent with S
requirements. QML qualification is anticipated.
Designers can choose from a wide variety of I/O
types. Buffer options include multiple drive
strengths, three-state capability, and pull-up/pull-
down resistors. PCI and LVDS buffers are also
supported. 5 volt tolerant I/O provides interface to
legacy components.
The HX3000 product family supports dual voltage I/O.
The designer has the flexibility to specify either voltage
supply for each I/O site.
Each HX3000 array features on-chip Phase Locked
Loops (PLLs) for clock deskewing and frequency
multiplication. The PLL requires no external
components.
HX3000
________________________________________________________________________
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design.
Honeywell does not assume any liability arising out of the application or use of any product or circuit described herein: neither does it
convey any license under its patent rights nor the rights of others. Rev. G 1/03
*
Contact Honeywell for additional I/O options
To learn more about Honeywell Solid State Electronics Center, visit our web site at
http://www.ssec.honeywell.com
The HX3000 family has a special feature to
allow a chip level power down mode in which
the associated buses connected to the chip can
remain active. The high impedance off-state
buffer feature allows users to power down
portions of their system for high reliability cold
sparing.
The HX3000 family provides options for
configurable single or multi-port SRAMs.
ASIC designers need not have prior experience
in radiation hardening. Honeywell's VDS
TM
Design Kit and HX3000 libraries provide the
necessary guidance to achieve first pass design
success. The VDS Design Kit supports industry
standard platforms including those offered by
Mentor Graphics, Synopsys and Cadence.
Design Kit options includes VHDL and Verilog.
Honeywell can perform design translations to
HX3000 ASICS from other CAD platforms and
ASIC vendors. Our synthesis capabilities allow
customers to use familiar CAD tools and
libraries to map existing designs to Honeywell
library components. Timing-driven placement,
clock-tree synthesis, and placement-based
optimization are also supported for fast design
cycles. A variety of packaging options
including QFP, PGA, BGA and Known-Good-
Die (KGD) are available. Honeywell has had
a leading role in the development and
application of space qualified multichip
modules for the last two decades.
The HX3000 family of ASICS are the right
choice for your high reliability space
applications demanding high density, high
speed and low power. To learn more about
Honeywell's variety of space components, call
us at 1-800-323-8295.
H X 3 0 0 0 C h a ra c te ris tic s
H X 3 0 3 G H X 3 0 6 G H X 3 1 1 G H X 3 1 4 G
U s a b le G a te C o u n t (G a te A rra y)
2 4 0 K 4 4 0 K 7 7 0 K 1 .0 M
U s a b le G a te C o u n t (H ig h P e rfo rm a n c e S C )
3 0 0 K 6 2 5 K 1 .0 M 1 .4 M
U s a b le G a te C o u n t (L o w P o w e r S C )
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D riv e r, R e c e iv e r, B i-D ire c tio n a l, T h re e -S ta te
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O p e ra tin g T e m p e ra tu re
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P ro c e s s T e c h n o lo g y
R IC M O S
T M
V S O I
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< 1 E -1 1 c e ll u p s e ts /b it-d a y; R A M s < 1 E -1 0 c e ll
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T o ta l D o s e H a rd n e s s
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