HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 2001.01.30
Page No. : 1/3
H7808AM, H7808BM
HSMC Product Specification
H7808AM
H7808BM
Low Current Positive Voltage Regulator Of Surface Mount Device
Description
The H7808_M series of surface mount device regulators are easy-
to-use devices suitable for multitude of applications that require a
regulated supply of up to 100mA. These regulators feature internal current limiting and thermal
shutdown making them remarkably rugged. No external components are required with the 780-
8_M devices in many applications.
These devices offer a substantial performance advantage over the traditional zener diode
resistor combination, as output impedance and quiescent current are substantially reduced.
Wide Range Of Available, Fixed Output Voltages
Internal Short-Circuit Current Limiting
Internal Thermal Overload Protection
No External Components Required
Absolute Maximum Ratings
(Ta=25
C)
Input Voltage................................................... 30 V (5V Through 9V), 35 V (12V Through 18V)
Total Power Dissipation ........................................................................................... Internal limit
Operating Temperature Range ............................................................................ 0
C to +70
C
Maximum Junction Temperature...................................................................................... 125
C
Storage Temperature Range .......................................................................... -55
C to +150
C
Lead Temperature (Soldering 10S).................................................................................. 260
C
Typical Application
Schematic Diagram
H7808_M
Vout
Vin
1
3
2
C1
C2
A common ground is required between the input
and the output voltages. The input voltage must
remain typically 2.0V above the output voltage
even during the low point on the input ripple
voltage.
Note : C1 and C2 are required if regulator is
located far from power supply filter and load, or
oscillation may induced on the loop
576
3.41K
3.89K
7.8K
2.84K
13K
5pF
2.23K
GND
1.5K
1.9K
100
100
5K
5.7K
Vout
Vin
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 2001.01.30
Page No. : 2/3
H7808AM, H7808BM
HSMC Product Specification
Electrical Characteristics
Vin=14V, Io=40mA, Tj=25
C Cin=0.33uF, Cout=0.1uF (unless otherwise noted)
H7808AM
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Tj=25
C
7.76
8
8.24
10.5V
Vin
23V
1mA
Io
40mA
7.76
8
8.24
Vo
Output Voltage
1mA
Io
70mA
7.76
8
8.24
V
Tj=25
C, 10.5V
Vin
23V
-
80
175
Vo
Line Regulation
Tj=25
C, 11V
Vin
23V
-
70
125
mV
Tj=25
C, 1mA
Io
40mA
-
8
40
Vo
Load Regulation
Tj=25
C, 1mA
Io
100mA
-
15
80
mV
IQ
Quiescent Current
Tj=25
C
-
2
5.5
mA
1mA
Io
40mA
-
-
0.1
IQ
Quiescent Current
Change
11V
Vin
23V
-
1.5
mA
Vn
Output Noise Voltage Ta=25
C, 10Hz
f
10KHz
-
60
-
uV
Vin /
Vout Ripple Rejection
11V
Vin
21V, f=120Hz
39
45
-
dB
Isc
Peak Output / Short -
Circuit Current
Tj=25
C
-
140
-
mA
VD
Dropout Voltage
Tj=25
C
-
1.7
-
V
H7808BM
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Tj=25
C
7.7
8
8.3
10.5V
Vin
23V
1mA
Io
40mA
7.6
8
8.4
Vo
Output Voltage
1mA
Io
70mA
7.6
8
8.4
V
Tj=25
C, 10.5V
Vin
23V
-
-
175
Vo
Line Regulation
Tj=25
C, 11V
Vin
23V
-
-
125
mV
Tj=25
C, 1mA
Io
40mA
-
-
40
Vo
Load Regulation
Tj=25
C, 1mA
Io
100mA
-
-
80
mV
IQ
Quiescent Current
Tj=25
C
-
-
5.5
mA
1mA
Io
40mA
-
-
0.1
IQ
Quiescent Current
Change
11V
Vin
23V
-
-
1.5
mA
Vn
Output Noise Voltage Ta=25
C, 10Hz
f
10KHz
-
60
-
uV
Vin /
Vout Ripple Rejection
11V
Vin
21V, f=120Hz
39
45
-
dB
Isc
Peak Output / Short -
Circuit Current
Tj=25
C
-
140
-
mA
VD
Dropout Voltage
Tj=25
C
-
1.7
-
V
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 2001.01.30
Page No. : 3/3
H7808AM, H7808BM
HSMC Product Specification
SOT-89 Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1732
0.1811
4.40
4.60
F
0.0583
0.0598
1.48
1.52
B
0.1594
0.1673
4.05
4.25
G
0.1165
0.1197
2.96
3.04
C
0.0591
0.0663
1.50
1.70
H
0.0551
0.0630
1.40
1.60
D
0.0945
0.1024
2.40
2.60
I
0.0138
0.0161
0.35
0.41
E
0.0141
0.0201
0.36
0.51
Notes :
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
3
2
1
A
B
C
D
E
F
G
H
I
Style : Pin 1.Vout 2.Ground 3.Vin
Marking :
Part Number
Date Code
HSMC Logo
Package Code
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code : M
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