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Электронный компонент: IC41C16100S-60T

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IC41C16100S
IC41LV16100S
Integrated Circuit Solution Inc.
1
DR010-0D 11/26/2004
Document Title
1M x 16 bits Dynamic RAM with EDO Page Mode
Revision History
Revision No
History
Draft Date
Remark
0A
Initial Draft
June 5,2001
0B
Revise for typographic
November 9,2001
0C
Add Pb-free package
May 06,2004
0D
Change t
COH
from 5ns to 4ns
November 26,2004
The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and
products. ICSI will answer to your questions about device. If you have any questions, please contact the ICSI offices.
IC41C16100S
IC41LV16100S
2
Integrated Circuit Solution Inc.
DR010-0D 11/26/2004
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors
which may appear in this publication. Copyright 2000, Integrated Circuit Solution Inc.
FEATURES
Extended Data-Out (EDO) Page Mode access cycle
TTL compatible inputs and outputs; tristate I/O
Refresh Interval:
Refresh Mode: 1,024 cycles /16 ms
RAS-Only, CAS-before-RAS (CBR), and Hidden
Self refresh Mode - 1,024 cycles / 128ms
JEDEC standard pinout
Single power supply:
5V 10% (IC41C16100S)
3.3V 10% (IC41LV16100S)
Byte Write and Byte Read operation via two CAS
Industrail Temperature Range -40C to 85C
DESCRIPTION
The
ICSI
IC41C16100S and IC41LV16100S are 1,048,576 x
16-bit high-performance CMOS Dynamic Random Access
Memories. These devices offer an accelerated cycle access
called EDO Page Mode. EDO Page Mode allows 1,024 ran-
dom accesses within a single row with access cycle time as
short as 20 ns per 16-bit word. The Byte Write control, of upper
and lower byte, makes the IC41C16100S ideal for use in
16-, 32-bit wide data bus systems.
These features make the IC41C16100Sand IC41LV16100S
ideally suited for high-bandwidth graphics, digital signal
processing, high-performance computing systems, and
peripheral applications.
The IC41C16100S and IC41LV16100S are packaged in a
42-pin 400mil SOJ and 400mil 50- (44-) pin TSOP-2.
1M x 16 (16-MBIT) DYNAMIC RAM
WITH EDO PAGE MODE
KEY TIMING PARAMETERS
Parameter
-45
-50
-60
Unit
Max. RAS Access Time (t
RAC
)
45
50
60
ns
Max. CAS Access Time (t
CAC
)
11
13
15
ns
Max. Column Address Access Time (t
AA
)
22
25
30
ns
Min. EDO Page Mode Cycle Time (t
PC
)
16
20
25
ns
Min. Read/Write Cycle Time (t
RC
)
77
84
104
ns
42-Pin SOJ
PIN CONFIGURATIONS
50(44)-Pin TSOP II
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
VCC
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
VCC
GND
I/O15
I/O14
I/O13
I/O12
GND
I/O11
I/O10
I/O9
I/O8
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
GND
PIN DESCRIPTIONS
A0-A9
Address Inputs
I/O0-15
Data Inputs/Outputs
WE
Write Enable
OE
Output Enable
RAS
Row Address Strobe
UCAS
Upper Column Address Strobe
LCAS
Lower Column Address Strobe
Vcc
Power
GND
Ground
NC
No Connection
1
2
3
4
5
6
7
8
9
10
11
15
16
17
18
19
20
21
22
23
24
25
50
49
48
47
46
45
44
43
42
41
40
36
35
34
33
32
31
30
29
28
27
26
VCC
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
NC
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
VCC
GND
I/O15
I/O14
I/O13
I/O12
GND
I/O11
I/O10
I/O9
I/O8
NC
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
GND
IC41C16100S
IC41LV16100S
Integrated Circuit Solution Inc.
3
DR010-0D 11/26/2004
FUNCTIONAL BLOCK DIAGRAM
OE
WE
LCAS
UCAS
CAS
WE
OE
DATA I/O BUS
COLUMN DECODERS
SENSE AMPLIFIERS
MEMORY ARRAY
1,048,576 x 16
ROW DECODER
DATA I/O BUFFERS
CAS
CLOCK
GENERATOR
WE
CONTROL
LOGICS
OE
CONTROL
LOGIC
I/O0-I/O15
RAS
RAS
A0-A9
RAS
CLOCK
GENERATOR
REFRESH
COUNTER
ADDRESS
BUFFERS
IC41C16100S
IC41LV16100S
4
Integrated Circuit Solution Inc.
DR010-0D 11/26/2004
TRUTH TABLE
Function
RAS
RAS
RAS
RAS
RAS
LCAS
LCAS
LCAS
LCAS
LCAS UCAS
UCAS
UCAS
UCAS
UCAS
WE
WE
WE
WE
WE
OE
OE
OE
OE
OE
Address t
R
/t
C
I/O
Standby
H
H
H
X
X
X
High-Z
Read: Word
L
L
L
H
L
ROW/COL
D
OUT
Read: Lower Byte
L
L
H
H
L
ROW/COL
Lower Byte, D
OUT
Upper Byte, High-Z
Read: Upper Byte
L
H
L
H
L
ROW/COL
Lower Byte, High-Z
Upper Byte, D
OUT
Write: Word (Early Write)
L
L
L
L
X
ROW/COL
D
IN
Write: Lower Byte (Early Write)
L
L
H
L
X
ROW/COL
Lower Byte, D
IN
Upper Byte, High-Z
Write: Upper Byte (Early Write)
L
H
L
L
X
ROW/COL
Lower Byte, High-Z
Upper Byte, D
IN
Read-Write
(1,2)
L
L
L
H
L
L
H
ROW/COL
D
OUT
, D
IN
EDO Page-Mode Read
(2)
1st Cycle:
L
H
L
H
L
H
L
ROW/COL
D
OUT
2nd Cycle:
L
H
L
H
L
H
L
NA/COL
D
OUT
Any Cycle:
L
L
H
L
H
H
L
NA/NA
D
OUT
EDO Page-Mode Write
(1)
1st Cycle:
L
H
L
H
L
L
X
ROW/COL
D
IN
2nd Cycle:
L
H
L
H
L
L
X
NA/COL
D
IN
EDO Page-Mode
(1,2)
1st Cycle:
L
H
L
H
L
H
L
L
H
ROW/COL
D
OUT
, D
IN
Read-Write
2nd Cycle:
L
H
L
H
L
H
L
L
H
NA/COL
D
OUT
, D
IN
Hidden Refresh
Read
(2)
L
HL
L
L
H
L
ROW/COL
D
OUT
Write
(1,3)
L
HL
L
L
L
X
ROW/COL
D
OUT
RAS-Only Refresh
L
H
H
X
X
ROW/NA
High-Z
CBR Refresh
(4)
H
L
L
L
X
X
X
High-Z
Notes:
1. These WRITE cycles may also be BYTE WRITE cycles (either LCAS or UCAS active).
2. These READ cycles may also be BYTE READ cycles (either LCAS or UCAS active).
3. EARLY WRITE only.
4. At least one of the two CAS signals must be active (LCAS or UCAS).
IC41C16100S
IC41LV16100S
Integrated Circuit Solution Inc.
5
DR010-0D 11/26/2004
Functional Description
The IC41C16100S and IC41LV16100S is a CMOS DRAM
optimized for high-speed bandwidth, low power
applications. During READ or WRITE cycles, each bit is
uniquely addressed through the 16 address bits. These
are entered ten bits (A0-A9) at a time. The row address is
latched by the Row Address Strobe (RAS). The column
address is latched by the Column Address Strobe (CAS).
RAS is used to latch the first ten bits and CAS is used the
latter ten bits.
The IC41C16100S and IC41LV16100S has two CAS
controls, LCAS and UCAS. The LCAS and UCAS inputs
internally generates a CAS signal functioning in an iden-
tical manner to the single CAS input on the other 1M x 16
DRAMs. The key difference is that each CAS controls its
corresponding I/O tristate logic (in conjunction with OE
and WE and RAS). LCAS controls I/O0 through I/O7 and
UCAS controls I/O8 through I/O15.
The IC41C16100S and IC41LV16100S CAS function is
determined by the first CAS (LCAS or UCAS) transitioning
LOW and the last transitioning back HIGH. The two CAS
controls give the IC41C16100S and IS41LV16100S both
BYTE READ and BYTE WRITE cycle capabilities.
Memory Cycle
A memory cycle is initiated by bring RAS LOW and it is
terminated by returning both RAS and CAS HIGH. To
ensures proper device operation and data integrity any
memory cycle, once initiated, must not be ended or
aborted before the minimum t
RAS
time has expired. A new
cycle must not be initiated until the minimum precharge
time t
RP
, t
CP
has elapsed.
Read Cycle
A read cycle is initiated by the falling edge of CAS or OE,
whichever occurs last, while holding WE HIGH. The
column address must be held for a minimum time specified
by t
AR
. Data Out becomes valid only when t
RAC
, t
AA
, t
CAC
and t
OEA
are all satisfied. As a result, the access time is
dependent on the timing relationships between these
parameters.
Write Cycle
A write cycle is initiated by the falling edge of CAS and
WE, whichever occurs last. The input data must be valid
at or before the falling edge of CAS or WE, whichever
occurs first.
Refresh Cycle
To retain data, 1,024 refresh cycles are required in each
16 ms period. There are two ways to refresh the memory.
1. By clocking each of the 1,024 row addresses (A0
through A9) with RAS at least once every 16 ms. Any
read, write, read-modify-write or RAS-only cycle re-
freshes the addressed row.
2. Using a CAS-before-RAS refresh cycle. CAS-before-
RAS refresh is activated by the falling edge of RAS,
while holding CAS LOW. In CAS-before-RAS refresh
cycle, an internal 10-bit counter provides the row
addresses and the external address inputs are ignored.
CAS-before-RAS is a refresh-only mode and no data
access or device selection is allowed. Thus, the output
remains in the High-Z state during the cycle.
Self Refresh Cycle
The Self Refresh allows the user a dynamic refresh, data
retention mode at the extended refresh period of 128 ms.
i.e., 125 s per row when using distributed CBR refreshes.
The feature also allows the user the choice of a fully static,
low power data retention mode. The optional Self Refresh
feature is initiated by performing a CBR Refresh cycle and
holding RAS LOW for the specified t
RAS
.
The Self Refresh mode is terminated by driving RAS HIGH
for a minimum time of t
RP
. This delay allows for the
completion of any internal refresh cycles that may be in
process at the time of the RAS LOW-to-HIGH transition.
If the DRAM controller uses a distributed refresh sequence,
a burst refresh is not required upon exiting Self Refresh.
However, if the DRAM controller utilizes a RAS-only or
burst refresh sequence, all 1,024 rows must be refreshed
within the average internal refresh rate, prior to the re-
sumption of normal operation.
Extended Data Out Page Mode
EDO page mode operation permits all 1,024 columns
within a selected row to be randomly accessed at a high
data rate.
In EDO page mode read cycle, the data-out is held to the
next CAS cycle's falling edge, instead of the rising edge.
For this reason, the valid data output time in EDO page
mode is extended compared with the fast page mode. In
the fast page mode, the valid data output time becomes
shorter as the CAS cycle time becomes shorter. Therefore,
in EDO page mode, the timing margin in read cycle is
larger than that of the fast page mode even if the CAS
cycle time becomes shorter.
In EDO page mode, due to the extended data function, the
CAS cycle time can be shorter than in the fast page mode
if the timing margin is the same.
The EDO page mode allows both read and write opera-
tions during one RAS cycle, but the performance is
equivalent to that of the fast page mode in that case.
Power-On
After application of the V
CC
supply, an initial pause of
200 s is required followed by a minimum of eight initial-
ization cycles (any combination of cycles containing a
RAS signal).
During power-on, it is recommended that RAS track with
V
CC
or be held at a valid V
IH
to avoid current surges.