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IC61SF6432
Integrated Circuit Solution Inc.
1
SSR017-0A
09/13/2001
Document Title
64K x 32 Flow Through Sync. SRAM
Revision History
Revision No
History
Draft Date
Remark
0A
Initial Draft
September 13,2001
The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and
products. ICSI will answer to your questions about device. If you have any questions, please contact the ICSI offices.
IC61SF6432
2
Integrated Circuit Solution Inc.
SSR017-0A
09/13/2001
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors
which may appear in this publication. Copyright 2000, Integrated Circuit Solution Inc.
FEATURES
Fast access time: 9 ns, 10 ns
Internal self-timed write cycle
Individual Byte Write Control and Global Write
Clock controlled, registered address, data and
control
PentiumTM or linear burst sequence control
using MODE input
Three chip enables for simple depth expansion
and address pipelining
Common data inputs and data outputs
Power-down control by ZZ input
JEDEC 100-Pin LQFP and PQFP package
Single +3.3V power supply
Two Clock enables and one Clock disable to
eliminate multiple bank bus contention.
Control pins mode upon power-up:
FT in pipeline mode
MODE in interleave burst mode
ZZ in normal operation mode
These control pins can be connected to GND
Q
or V
CCQ
to alter their power-up state
Industrial temperature available
DESCRIPTION
The
ICSI
IC61SF6432 is a high-speed, low-power synchronous
static RAM designed to provide a burstable, high-performance,
secondary cache for the PentiumTM, 680X0TM, and PowerPCTM
microprocessors. It is organized as 65,536 words by 32 bits,
fabricated with
ICSI
's advanced CMOS technology. The de-
vice integrates a 2-bit burst counter, high-speed SRAM core,
and high-drive capability outputs into a single monolithic circuit.
All synchronous inputs pass through registers controlled by a
positive-edge-triggered single clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be from one to
four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
BW1
controls DQ1-DQ8,
BW2
controls DQ9-DQ16,
BW3
controls DQ17-DQ24,
BW4
controls DQ25-DQ32, conditioned
by
BWE
being LOW. A LOW on
GW
input would cause all bytes
to be written.
Bursts can be initiated with either
ADSP
(Address Status
Processor) or
ADSC
(Address Status Cache Controller) input
pins. Subsequent burst addresses can be generated internally
by the IC61SF6432 and controlled by the
ADV
(burst address
advance) input pin.
Asynchronous signals include output enable (
OE
), sleep mode
input (ZZ), clock (CLK) and burst mode input (MODE). A HIGH
input on the ZZ pin puts the SRAM in the power-down state.
When ZZ is pulled LOW (or no connect), the SRAM normally
operates after three cycles of the wake-up period. A LOW
input, i.e., GND
Q
, on MODE pin selects LINEAR Burst. A V
CCQ
(or no connect) on MODE pin selects INTERLEAVED Burst.
64K x 32 SYNCHRONOUS
FLOW-THROUGH STATIC RAM
IC61SF6432
Integrated Circuit Solution Inc.
3
SSR017-0A
09/13/2001
BLOCK DIAGRAM
16
BINARY
COUNTER
A15-A0
BW1
GW
CLR
CE
CLK
Q0
Q1
MODE
A0'
A0
A1
A1'
CLK
ADV
ADSC
ADSP
14
16
ADDRESS
REGISTER
CE
D
CLK
Q
DQ32-DQ25
BYTE WRITE
REGISTERS
D
CLK
Q
DQ24-DQ17
BYTE WRITE
REGISTERS
D
CLK
Q
DQ16-DQ9
BYTE WRITE
REGISTERS
D
CLK
Q
DQ8-DQ1
BYTE WRITE
REGISTERS
D
CLK
Q
ENABLE
REGISTER
CE
D
CLK
Q
ENABLE
DELAY
REGISTER
D
CLK
Q
BWE
BW4
CE1
CE3
CE2
BW2
BW3
64K x 32
MEMORY
ARRAY
32
INPUT
REGISTERS
CLK
32
OE
4
32
OE
DATA[32:1]
IC61SF6432
4
Integrated Circuit Solution Inc.
SSR017-0A
09/13/2001
PIN CONFIGURATION
100-Pin LQFP and PQFP (Top View)
PIN DESCRIPTIONS
A0-A15
Address Inputs
CLK
Clock
ADSP
Processor Address Status
ADSC
Controller Address Status
ADV
Burst Address Advance
BW1
-
BW4
Synchronous Byte Write Enable
BWE
Byte Write Enable
GW
Global Write Enable
CE1
, CE2,
CE3
Synchronous Chip Enable
OE
Output Enable
DQ1-DQ32
Data Input/Output
ZZ
Sleep Mode
MODE
Burst Sequence Mode
V
CC
+3.3V Power Supply
GND
Ground
V
CCQ
Isolated Output Buffer Supply:
+3.3V
GND
Q
Isolated Output Buffer Ground
NC
No Connect
NC
DQ16
DQ15
VCCQ
GNDQ
DQ14
DQ13
DQ12
DQ11
GNDQ
VCCQ
DQ10
DQ9
GND
NC
VCC
ZZ
DQ8
DQ7
VCCQ
GNDQ
DQ6
DQ5
DQ4
DQ3
GNDQ
VCCQ
DQ2
DQ1
NC
A6
A7
CE1
CE2
BW4
BW3
BW2
BW1
CE3
VCC
GND
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A8
A9
NC
DQ17
DQ18
VCCQ
GNDQ
DQ19
DQ20
DQ21
DQ22
GNDQ
VCCQ
DQ23
DQ24
GNDQ
VCC
NC
GND
DQ25
DQ26
VCCQ
GNDQ
DQ27
DQ28
DQ29
DQ30
GNDQ
VCCQ
DQ31
DQ32
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45
MODE
A5
A4
A3
A2
A1
A0
NC
NC
GND
VCC
NC
NC
A10
A11
A12
A13
A14
A15
NC
46 47 48 49 50
IC61SF6432
Integrated Circuit Solution Inc.
5
SSR017-0A
09/13/2001
TRUTH TABLE
ADDRESS
OPERATION
USED
CE1
CE1
CE1
CE1
CE1
CE2
CE3
CE3
CE3
CE3
CE3
ADSP
ADSP
ADSP
ADSP
ADSP ADSC
ADSC
ADSC
ADSC
ADSC ADV
ADV
ADV
ADV
ADV WRITE
WRITE
WRITE
WRITE
WRITE
OE
OE
OE
OE
OE
DQ
Deselected, Power-down
None
H
X
X
X
L
X
X
X
High-Z
Deselected, Power-down
None
L
L
X
L
X
X
X
X
High-Z
Deselected, Power-down
None
L
X
H
L
X
X
X
X
High-Z
Deselected, Power-down
None
L
L
X
H
L
X
X
X
High-Z
Deselected, Power-down
None
L
X
H
H
L
X
X
X
High-Z
Read Cycle, Begin Burst External
L
H
L
L
X
X
X
L
Q
Read Cycle, Begin Burst External
L
H
L
L
X
X
X
H
High-Z
Write Cycle, Begin Burst External
L
H
L
H
L
X
L
X
D
Read Cycle, Begin Burst External
L
H
L
H
L
X
H
L
Q
Read Cycle, Begin Burst External
L
H
L
H
L
X
H
H
High-Z
Read Cycle, Continue Burst
Next
X
X
X
H
H
L
H
L
Q
Read Cycle, Continue Burst
Next
X
X
X
H
H
L
H
H
High-Z
Read Cycle, Continue Burst
Next
H
X
X
X
H
L
H
L
Q
Read Cycle, Continue Burst
Next
H
X
X
X
H
L
H
H
High-Z
Write Cycle, Continue Burst
Next
X
X
X
H
H
L
L
X
D
Write Cycle, Continue Burst
Next
H
X
X
X
H
L
L
X
D
Read Cycle, Suspend Burst Current
X
X
X
H
H
H
H
L
Q
Read Cycle, Suspend Burst Current
X
X
X
H
H
H
H
H
High-Z
Read Cycle, Suspend Burst Current
H
X
X
X
H
H
H
L
Q
Read Cycle, Suspend Burst Current
H
X
X
X
H
H
H
H
High-Z
Write Cycle, Suspend Burst Current
X
X
X
H
H
H
L
X
D
Write Cycle, Suspend Burst Current
H
X
X
X
H
H
L
X
D
Notes:
1. All inputs except
OE
must meet setup and hold times for the Low-to-High transition of clock (CLK).
2. Wait states are inserted by suspending burst.
3. X means don't care.
WRITE
=L means any one or more byte write enable signals (
BW
1-
BW
4) and
BWE
are LOW or
GW
is
LOW.
WRITE
=H means all byte write enable signals are HIGH.
4. For a Write operation following a Read operation,
OE
must be HIGH before the input data required setup time and held HIGH
throughout the input data hold time.
5.
ADSP
LOW always initiates an internal READ at the Low-to-High edge of clock. A WRITE is performed by setting one or more
byte write enable signals and
BWE
LOW or
GW
LOW for the subsequent L-H edge of clock.
PARTIAL TRUTH TABLE
FUNCTION
GW
BWE
BW1
BW2
BW3 BW4
READ
H
H
X
X
X
X
READ
H
X
H
H
H
H
WRITE Byte 1
H
L
L
H
H
H
WRITE All Bytes
X
L
L
L
L
L
WRITE All Bytes
L
X
X
X
X
X
IC61SF6432
6
Integrated Circuit Solution Inc.
SSR017-0A
09/13/2001
INTERLEAVED BURST ADDRESS TABLE (MODE = V
CCQ
or No Connect)
External Address
1st Burst Address
2nd Burst Address
3rd Burst Address
A1 A0
A1 A0
A1 A0
A1 A0
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
LINEAR BURST ADDRESS TABLE (MODE = GND
Q
)
0,0
1,0
0,1
A1', A0' = 1,1
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
Parameter
Value
Unit
T
BIAS
Temperature Under Bias
10 to +85
C
T
STG
Storage Temperature
55 to +150
C
P
D
Power Dissipation
1.8
W
I
OUT
Output Current (per I/O)
100
mA
V
IN
, V
OUT
Voltage Relative to GND for I/O Pins
0.5 to V
CCQ
+ 0.3
V
V
IN
Voltage Relative to GND for
0.5 to 5.5
V
for Address and Control Inputs
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
2. This device contains circuity to protect the inputs against damage due to high static voltages
or electric fields; however, precautions may be taken to avoid application of any voltage
higher than maximum rated voltages to this high-impedance circuit.
3. This device contains circuitry that will ensure the output devices are in High-Z at power up.
IC61SF6432
Integrated Circuit Solution Inc.
7
SSR017-0A
09/13/2001
OPERATING RANGE
Range
Ambient Temperature
V
CC
Commercial
0C to +70C
3.3V +10%, 5%
Industrial
40C to +85C
3.3V +10%, 5%
DC ELECTRICAL CHARACTERISTICS
(1)
(Over Operating Range)
Symbol Parameter
Test Conditions
Min.
Max.
Unit
V
OH
Output HIGH Voltage
I
OH
= 5.0 mA
2.4
--
V
V
OL
Output LOW Voltage
I
OL
= 5.0 mA
--
0.4
V
V
IH
Input HIGH Voltage
2.0
V
CCQ
+ 0.3
V
V
IL
Input LOW Voltage
0.3
0.8
V
I
LI
Input Leakage Current
GND
V
IN
V
CCQ
(2)
Com.
5
5
A
Ind.
10
10
I
LO
Output Leakage Current
GND
V
OUT
V
CCQ
,
OE
= V
IH
Com.
5
5
A
Ind.
10
10
POWER SUPPLY CHARACTERISTICS
(Over Operating Range)
-9
-10
Symbol Parameter
Test Conditions
Min. Typ. Max.
Min. Typ. Max.
Unit
I
CC
AC Operating
Device Selected,
Com.
--
300 --
-- 290
--
mA
Supply Current
All Inputs = V
IL
or V
IH
Ind.
--
--
--
-- 300
--
OE
= V
IH
, Cycle Time
t
KC
min.
I
SB
Standby Current
Device Deselected,
Com.
--
60
--
--
60
--
mA
V
CC
= Max.,
Ind.
--
--
--
--
70
--
All Inputs = V
IH
or V
IL
CLK Cycle Time
t
KC
min.
I
ZZ
Power-Down Mode
ZZ = V
CCQ
,
Com.
--
10
--
--
10
--
CLK Running
Ind.
--
--
--
--
20
--
mA
Current
All Inputs
GND + 0.2V
or
V
CC
0.2V
Note:
1. MODE pin has an internal pull-up. ZZ pin has an internal pull-down. These pins may be a No Connect, tied to GND, or tied to
V
CCQ
.
2. MODE pin should be tied to Vcc or GND. They exhibit
30 A maximum leakage current when tied to
GND + 0.2V or
Vcc 0.2V.
IC61SF6432
8
Integrated Circuit Solution Inc.
SSR017-0A
09/13/2001
CAPACITANCE
(1,2)
Symbol
Parameter
Conditions
Max.
Unit
C
IN
Input Capacitance
V
IN
= 0V
6
pF
C
OUT
Input/Output Capacitance
V
OUT
= 0V
8
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A
= 25C, f = 1 MHz, Vcc = 3.3V.
AC TEST CONDITIONS
Parameter
Unit
Input Pulse Level
0V to 3.0V
Input Rise and Fall Times
1.5 ns
Input and Output Timing
1.5V
and Reference Level
Output Load
See Figures 1 and 2
AC TEST LOADS
Figure 1
Output
Buffer
Z
O
= 50
1.5V
50
30 pF
317
5 pF
Including
jig and
scope
351
OUTPUT
3.3V
Figure 2
IC61SF6432
Integrated Circuit Solution Inc.
9
SSR017-0A
09/13/2001
READ CYCLE SWITCHING CHARACTERISTICS
(Over Operating Range)
-
9
-10
Symbol
Parameter
Min. Max.
Min.
Max.
Unit
t
KC
Cycle Time
13
--
15
--
ns
t
KH
Clock High Time
6
--
6
--
ns
t
KL
Clock Low Time
6
--
6
--
ns
t
KQ
Clock Access Time
--
9
--
10
ns
t
KQX
(2)
Clock High to Output Invalid
2
--
2
--
ns
t
KQLZ
(2,3)
Clock High to Output Low-Z
0
--
0
--
ns
t
KQHZ
(2,3)
Clock High to Output High-Z
2
6
2
6
ns
t
AS
Address Setup Time
2.5
--
2.5
--
ns
t
SS
Address Status Setup Time
2.5
--
2.5
--
ns
t
WS
Write Setup Time
2.5
--
2.5
--
ns
t
CES
Chip Enable Setup Time
2.5
--
2.5
--
ns
t
AVS
Address Advance Setup Time
2.5
--
2.5
--
ns
t
AH
Address Hold Time
1
--
1
--
ns
t
SH
Address Status Hold Time
0.5
--
0.5
--
ns
t
WH
Write Hold Time
0.5
--
0.5
--
ns
t
CEH
Chip Enable Hold Time
0.5
--
0.5
--
ns
t
AVH
Address Advance Hold Time
0.5
--
0.5
--
ns
t
CFG
Configuration Setup
(1)
66.7
--
80
--
ns
Notes:
1. Configuration signal MODE is static and must not change during normal operation.
2. Guaranteed but not 100% tested. This parameter is periodically sampled.
3. Tested with load in Figure 2.
IC61SF6432
10
Integrated Circuit Solution Inc.
SSR017-0A
09/13/2001
READ CYCLE TIMING: FLOW-THROUGH
Single Read
Flow-through
High-Z
High-Z
DATA
OUT
DATA
IN
OE
CE2
CE2
CE
BW4-BW1
BWE
GW
A15-A0
ADV
ADSC
ADSP
CLK
RD1
RD2
1a
2c
2d
3a
Unselected
Burst Read
t
KQX
t
KC
t
KL
t
KH
t
SS
t
SH
t
SS
t
SH
t
AS
t
AH
t
WS
t
WH
t
WS
t
WH
RD3
t
CES
t
CEH
t
CES
t
CEH
t
CES
t
CEH
CE2 and CE2 only sampled with ADSP or ADSC
CE Masks ADSP
Unselected with CE2
t
KQLZ
t
KQ
t
KQHZ
ADSC initiate read
ADSP is blocked by CE inactive
t
AVH
t
AVS
Suspend Burst
2a
2b
IC61SF6432
Integrated Circuit Solution Inc.
11
SSR017-0A
09/13/2001
WRITE CYCLE SWITCHING CHARACTERISTICS
(Over Operating Range)
-9
-10
Symbol
Parameter
Min. Max.
Min.
Max.
Unit
t
KC
Cycle Time
13
--
15
--
ns
t
KH
Clock High Time
6
--
6
--
ns
t
KL
Clock Low Time
6
--
6
--
ns
t
AS
Address Setup Time
2.5
--
2.5
--
ns
t
SS
Address Status Setup Time
2.5
--
2.5
--
ns
t
WS
Write Setup Time
2.5
--
2.5
--
ns
t
DS
Data In Setup Time
2.5
--
2.5
--
ns
t
CES
Chip Enable Setup Time
2.5
--
2.5
--
ns
t
AVS
Address Advance Setup Time
2.5
--
2.5
--
ns
t
AH
Address Hold Time
1
--
1
--
ns
t
SH
Address Status Hold Time
0.5
--
0.5
--
ns
t
DH
Data In Hold Time
0.5
--
0.5
--
ns
t
WH
Write Hold Time
0.5
--
0.5
--
ns
t
CEH
Chip Enable Hold Time
0.5
--
0.5
--
ns
t
AVH
Address Advance Hold Time
0.5
--
0.5
--
ns
t
CFG
Configuration Setup
(1)
52
--
60
--
ns
Notes:
1. Configuration signal MODE is static and must not change during normal operation.
IC61SF6432
12
Integrated Circuit Solution Inc.
SSR017-0A
09/13/2001
WRITE CYCLE TIMING: PIPELINE
Single Write
DATA
OUT
DATA
IN
OE
CE3
CE2
CE1
BW4-BW1
BWE
GW
A15-A0
ADV
ADSC
ADSP
CLK
WR1
WR2
Unselected
Burst Write
t
KC
t
KL
t
KH
t
SS
t
SH
t
AS
t
AH
t
WS
t
WH
t
WS
t
WH
WR3
t
CES
t
CEH
t
CES
t
CEH
t
CES
t
CEH
CE2 and CE3 only sampled with ADSP or ADSC
CE1 Masks ADSP
Unselected with CE2
ADSC initiate Write
ADSP is blocked by CE1 inactive
t
AVH
t
AVS
ADV must be inactive for ADSP Write
WR1
WR2
t
WS
t
WH
WR3
t
WS
t
WH
High-Z
High-Z
1a
3a
t
DS
t
DH
BW4-BW1 only are applied to first cycle of WR2
Write
2c
2d
2b
2a
IC61SF6432
Integrated Circuit Solution Inc.
13
SSR017-0A
09/13/2001
READ/WRITE CYCLE SWITCHING CHARACTERISTICS
(Over Operating Range)
-9
-10
Symbol
Parameter
Min. Max.
Min.
Max.
Unit
t
KC
Cycle Time
13
--
15
--
ns
t
KH
Clock High Time
6
--
6
--
ns
t
KL
Clock Low Time
6
--
6
--
ns
t
KQ
Clock Access Time
--
9
--
10
ns
t
KQX
(2)
Clock High to Output Invalid
2
--
2
--
ns
t
KQLZ
(2,3)
Clock High to Output Low-Z
0
--
0
--
ns
t
KQHZ
(2,3)
Clock High to Output High-Z
2
6
2
6
ns
t
OEQX
(2)
Output Disable to Output Invalid
0
--
0
--
ns
t
OEHZ
(2,3)
Output Disable to Output High-Z
--
6
--
6
ns
t
AS
Address Setup Time
2.5
--
2.5
--
ns
t
SS
Address Status Setup Time
2.5
--
2.5
--
ns
t
WS
Write Setup Time
2.5
--
2.5
--
ns
t
CES
Chip Enable Setup Time
2.5
--
2.5
--
ns
t
AH
Address Hold Time
0.5
--
0.5
--
ns
t
SH
Address Status Hold Time
0.5
--
0.5
--
ns
t
WH
Write Hold Time
0.5
--
0.5
--
ns
t
CEH
Chip Enable Hold Time
0.5
--
0.5
--
ns
Notes:
1. Configuration signal MODE is static and must not change during normal operation.
2. Guaranteed but not 100% tested. This parameter is periodically sampled.
3. Tested with load in Figure 2.
IC61SF6432
14
Integrated Circuit Solution Inc.
SSR017-0A
09/13/2001
READ/WRITE CYCLE TIMING: FLOW-THROUGH
Single Read
Flow-through
Single Write
High-Z
High-Z
DATA
OUT
DATA
IN
OE
CE2
CE2
CE
BW4-BW1
BWE
GW
A15-A0
ADV
ADSC
ADSP
CLK
RD1
WR1
WR1
1a
1a
2a
2b
2c
2d
Unselected
Burst Read
t
KQX
t
KC
t
KL
t
KH
t
SS
t
SH
ADSP is blocked by CE inactive
t
SS
t
SH
t
AS
t
AH
t
WS
t
WH
t
WS
t
WH
t
WS
t
WH
RD2
RD3
t
CES
t
CEH
t
CES
t
CEH
t
CES
t
CEH
CE2 and CE2 only sampled with ADSP or ADSC
CE Masks ADSP
Unselected with CE2
t
OEQX
t
KQ
t
OEHZ
t
KQX
t
KQHZ
t
DS
t
DH
t
KQHZ
t
KQLZ
IC61SF6432
Integrated Circuit Solution Inc.
15
SSR017-0A
09/13/2001
SNOOZE AND RECOVERY CYCLE SWITCHING CHARACTERISTICS
(Over Operating Range)
-9
-10
Symbol
Parameter
Min. Max.
Min.
Max.
Unit
t
KC
Cycle Time
13
--
15
--
ns
t
KH
Clock High Time
6
--
6
--
ns
t
KL
Clock Low Time
6
--
6
--
ns
t
KQ
Clock Access Time
--
9
--
10
ns
t
KQX
(4)
Clock High to Output Invalid
2
--
2
--
ns
t
KQLZ
(4,5)
Clock High to Output Low-Z
0
--
0
--
ns
t
KQHZ
(4,5)
Clock High to Output High-Z
2
6
2
6
ns
t
OEQ
Output Enable to Output Valid
--
6
--
6
ns
t
OEQX
(4)
Output Disable to Output Invalid
0
--
0
--
ns
t
OELZ
(4,5)
Output Enable to Output Low-Z
0
--
0
--
ns
t
OEHZ
(4,5)
Output Disable to Output High-Z
--
6
--
6
ns
t
AS
Address Setup Time
2.5
--
2.5
--
ns
t
SS
Address Status Setup Time
2.5
--
2.5
--
ns
t
CES
Chip Enable Setup Time
2.5
--
2.5
--
ns
t
AH
Address Hold Time
0.5
--
0.5
--
ns
t
SH
Address Status Hold Time
0.5
--
0.5
--
ns
t
CEH
Chip Enable Hold Time
0.5
--
0.5
--
ns
t
ZZS
ZZ Standby
(1)
2
--
2
--
cyc
t
ZZREC
ZZ Recovery
(2)
2
--
2
--
cyc
t
CFG
Configuration Setup
(3)
52
--
60
--
ns
Notes:
1. The assertion of ZZ allows the SRAM to enter a lower power state than when deselected within the time specified. Data
retention is guaranteed when ZZ is asserted and clock remains active.
2. ADSC and ADSP must not be asserted for at least 2 cyc after leaving ZZ state.
3. Configuration signal MODE is static and must not change during normal operation.
4. Guaranteed but not 100% tested. This parameter is periodically sampled.
5. Tested with load in Figure 2.
IC61SF6432
16
Integrated Circuit Solution Inc.
SSR017-0A
09/13/2001
SNOOZE AND RECOVERY CYCLE TIMING
Single Read
High-Z
High-Z
DATA
OUT
DATA
IN
OE
CE3
CE2
CE1
BW4-BW1
BWE
GW
A15-A0
ADV
ADSC
ADSP
CLK
RD1
1a
Read
Snooze with Data Retention
t
KC
t
KL
t
KH
t
SS
t
SH
t
AS
t
AH
RD2
t
CES
t
CEH
t
CES
t
CEH
t
CES
t
CEH
t
OEQ
t
OEQX
t
OELZ
t
KQLZ
t
KQ
t
OEHZ
t
KQX
t
KQHZ
ZZ
t
ZZS
t
ZZREC
IC61SF6432
Integrated Circuit Solution Inc.
17
SSR017-0A
09/13/2001
ORDERING INFORMATION
Commercial Range: 0C to +70C
Speed (ns)
Order Part Number
Package
9
IC61SF6432-9TQ
14*20*1.4mm LQFP
9
IC61SF6432-9PQ
14*20*2.7mm PQFP
10
IC61SF6432-10TQ
14*20*1.4mm LQFP
10
IC61SF6432-10PQ
14*20*2.7mm PQFP
ORDERING INFORMATION
Industrial Range: 40C to +85C
Speed (ns)
Order Part Number
Package
10
IC61SF6432-10TQI
14*20*1.4mm LQFP
10
IC61SF6432-10PQI
14*20*2.7mm PQFP
Integrated Circuit Solution Inc.
HEADQUARTER:
NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,
HSIN-CHU, TAIWAN, R.O.C.
TEL: 886-3-5780333
Fax: 886-3-5783000
BRANCH OFFICE:
7F, NO. 106, SEC. 1, HSIN-TAI 5
TH
ROAD,
HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.
TEL: 886-2-26962140
FAX: 886-2-26962252
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