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Электронный компонент: ICS508-DPK

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ICS508
PECL to CMOS Converter
MDS 508 C
1
Revision 012400 Printed 11/13/00
Integrated Circuit Systems, Inc. 525 Race Street San Jose CA95126(408) 295-9800tel www.icst.com
PRELIMINARY INFORMATION
Packaged as 8 pin SOIC or die
Separate VDD supplies allow voltage
translation
Clock frequency of 0 - 250 MHz
Duty cycle of 45/55
Operating voltages of 2.375 to 5.5 V
Tri-state output for board level testing
24 mA drive capability
Industrial temperature version available
Advanced, low power CMOS process
The ICS508 is the most cost effective way to
generate a high quality, high frequency CMOS
clock output from a PECL clock input.
The ICS508 has separate VDD supplies for the
PECL input buffer and the output buffer allowing
different voltages to be used. For example, the
input clock could use a 3.3 V supply while the
output operates from 2.5 V.
The device has an Output Enable pin that tri-states
the clock output when the OE pin is taken low.
The ICS508 is a member of the ClockBlocksTM
family of devices.
Description
Features
Block Diagram
PECLIN
PECLIN
VDDP
VDDC
Output
Buffer
GND
OE
CLK
GND
ICS508
PECL to CMOS Converter
MDS 508 C
2
Revision 012400 Printed 11/13/00
Integrated Circuit Systems, Inc. 525 Race Street San Jose CA95126(408) 295-9800tel www.icst.com
PRELIMINARY INFORMATION
Pin Assignment
1
8
2
3
4
7
6
5
VDDP
PECLIN
GND
VDDC
CLK
GND
OE
Number
Name
Type
Description
1
VDDP
O
Connect to 3.3 V or 5 V. Supplies PECL input buffer.
2
I
Complementary PECL clock input.
3
PECLIN
I
PECL clock input.
4
GND
P
Connect to ground.
5
OE
I
Output enable. Tri-states CLK output when low. Internal pull-up to VDDC.
6
GND
P
Connect to ground.
7
CLK
O
Clock output.
8
VDDC
P
Connect to 2.5 V, or 3.3 V or 5 V. Supplies output buffer and OE pin.
Pin Descriptions
Key: I = Input, O = output, P = power supply connection
PECLIN
PECLIN
ICS508
PECL to CMOS Converter
MDS 508 C
3
Revision 012400 Printed 11/13/00
Integrated Circuit Systems, Inc. 525 Race Street San Jose CA95126(408) 295-9800tel www.icst.com
PRELIMINARY INFORMATION
DC CHARACTERISTICS (VDDP = VD
DDC = 3.3 V unless oth
herwise noted)
Operating Voltage, VDDP
Note 1
3
5.5
V
Operating Voltage, VDDC
Note 1
2.375
5.5
V
Peak to Peak Input Voltage, PECLIN
0.3
1
V
Common Mode Range, PECLIN
VDDP = 5 V
VDDP - 3.7
VDDP - 0.6
V
Common Mode Range, PECLIN
VDDP = 3.3 V
VDDP - 2.0
VDDP - 0.6
V
Input High Voltage, VIH
OE only
2
VDDC
V
Input Low Voltage, VIL
OE only
0.8
V
Output High Voltage, VOH
VDDC = 5 V, IOH = -24 mA
VDDC-0.4
V
Output High Voltage, VOL
VDDC = 5 V, IOL = 24 mA
0.4
V
Output High Voltage, VOH
VDDC = 3.3 V, IOH = -18 mA
VDDC-0.4
V
Output High Voltage, VOL
VDDC = 3.3 V, IOL = 18 mA
0.4
V
Output High Voltage, VOH
VDDC = 2.5 V, IOH = -8 mA
VDDC-0.4
V
Output High Voltage, VOL
VDDC = 2.5 V, IOL = 8 mA
0.4
V
On-Chip Pull-up Resistor
OE
250
k
Operating Supply Current, IDDP
100 MHz, no load
1.5
mA
Operating Supply Current, IDDC
100 MHz, no load
8
mA
Note 1: VDDP must alwa s be greater than or equal to VDDC.
Parameter
Conditions
Minimum
Typical
Maximum
Units
ABSOLUTE MAXIMUM RATINGS (sttresses beyond these can permanentlly damage tthe device)
Supply Voltage, VDDP and VDDC
Referenced to GND
7
V
PECL Inputs
Referenced to GND
-0.5
VDDP+0.5
V
Clock Output and OE Pin
Referenced to GND
-0.5
VDDC+0.5
V
Ambient Operating Temperature
0
70
C
ICS508MI only
-40
85
C
Soldering Temperature
Max of 10 seconds
260
C
Storage temperature
-65
150
C
Electrical Specifications
ICS508
PECL to CMOS Converter
MDS 508 C
4
Revision 012400 Printed 11/13/00
Integrated Circuit Systems, Inc. 525 Race Street San Jose CA95126(408) 295-9800tel www.icst.com
PRELIMINARY INFORMATION
Parameter
Conditions
Minimum
Typical
Maximum
Units
AC CHARACTERISTICS (VDDP = VD
DDC = 3.3V unless oth
herwise noteed)
Input Frequency
0
250
M H z
Output Clock Rise Time, 0.8 to 2 V
VDDC = 5 V
0.4
ns
VDDC = 3.3 V
0.6
ns
VDDC = 2.5 V
1
ns
Output Clock Fall Time, 2 V to 0.8 V
VDDC = 5 V
0.4
ns
VDDC = 3.3 V
0.6
ns
VDDC = 2.5 V
1
ns
Output Enable Time, OE high to ouput on
7
20
ns
Output Disable Time, OE low to tri-state
7
20
ns
Propagation Delay
VDDP=5 V, VDDC=5 V
4
6
ns
VDDP=5 V, VDDC=3.3 V
4.5
7
ns
VDDP=5 V, VDDC=2.5 V
5.5
9
ns
VDDP=3.3 V, VDDC=3.3 V
4.5
7
ns
VDDP=3.3 V, VDDC=2.5 V
5.5
9
ns
Output Clock Duty Cycle, 0-100 MHz
Any VDD combination
45
55
%
Output Clock Duty Cycle, 100-166 MHz
VDDP=5 V, VDDC=5 V
45
55
%
VDDP=5 V, VDDC=3.3 V
45
55
%
VDDP=5 V, VDDC=2.5 V
40
60
%
VDDP=3.3 V, VDDC=3.3 V
40
60
%
VDDP=3.3 V, VDDC=2.5 V
45
55
%
Output Clock Duty Cycle, 166-250 MHz
VDDP=5 V, VDDC=5 V
40
60
%
VDDP=5 V, VDDC=3.3 V
40
60
%
VDDP=5 V, VDDC=2.5 V
35
65
%
VDDP=3.3 V, VDDC=3.3 V
35
65
%
VDDP=3.3 V, VDDC=2.5 V
40
60
%
Electrical Specifications
ICS508
PECL to CMOS Converter
MDS 508 C
5
Revision 012400 Printed 11/13/00
Integrated Circuit Systems, Inc. 525 Race Street San Jose CA95126(408) 295-9800tel www.icst.com
PRELIMINARY INFORMATION
While the information presented herein has been checked for both accuracy and reliability, ICS assumes no responsibility for either its use or for the infringement of any patents or
other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications.
Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without
additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support
devices or critical medical instruments.
Ordering Information
Part/Order Number
Marking
Package
Temperature
ICS508M
ICS508M
8 pin SOIC
0 to 70 C
ICS508MT
ICS508M
8 pin SOIC on tape and reel
0 to 70 C
ICS508MI
ICS508I
8 pin SOIC
-40 to +85 C
ICS508MIT
ICS508I
8 pin SOIC on tape and reel
-40 to +85 C
ICS508-DWF
-
Die on uncut, probed wafers
0 to 70 C
ICS508-DPK
-
Tested die in waffle pack
0 to 70 C
External Components
The ICS508 requires two 0.01F decoupling capacitors to be connected between VDDP and GND and
between VDDC and GND. They must be connected close to the ICS508 to minimize lead inductance. A
33
series terminating resistor can be used next to the CLK pin.
Package Outline and Package Dimensions
(
For current dimensional specifications, see JEDEC Publication No. 95.)
B
D
E
H
e
A1
C
A
h x 45
L
INDEX
AREA
1
2
8 pin SOIC
Inch
hes
Millim
meters
Symbol
Min
Max
Min
Max
A
0.0532
0.0688
1.35
1.75
A1
0.0040
0.0098
0.10
0.24
B
0.0130
0.0200
0.33
0.51
C
0.0075
0.0098
0.19
0.24
D
0.1890
0.1968
4.80
5.00
E
0.1497
0.1574
3.80
4.00
e
.050 BSSC
1.27 BSSC
H
0.2284
0.2440
5.80
6.20
h
0.0099
0.0195
0.25
0.50
L
0.0160
0.0500
0.41
1.27