Document Outline
- General Description
- Features
- Block Diagram
- Pin Assignment
- Functional Description
- Parallel & Serial Load Operations Diagram
- Pin Descriptions
- Pin Characteristics
- Parallel & Serial Mode Function Table
- Programmable VCO Frequency Function Table
- Programmable Output Divider Function Table
- Absolute Maximum Ratings
- Power Supply DC Characteristics
- LVCMOS DC Characteristics
- LVPECL DC Characteristics
- Input Characteristics
- Crystal Characteristics
- AC Characteristics
- Parameter Measurement Information
- Application Information
- Power Supply Filtering Techniques
- Crystal Input Interface
- Recommendations for Unused Input and Output Pins
- Termination for LVPECL Outputs
- Layout Guideline
- Schematic of Recommended Layout
- Power & Grounding
- Clock Traces & Termination
- Crystal
- PCB Board Layout
- Power Considerations
- Power Dissipation
- Junction Temperature
- Thermal Resistance
- Calculations & Equations
- LVPECL Driver Circuit & Termination
- Reliability Information
- Transistor Count
- Package Outline
- Package Dimensions
- Ordering Information
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
1
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
G
ENERAL
D
ESCRIPTION
The ICS8430B-71 is a general purpose, dual out-
put Crystal/LVCMOS-to-3.3V Differential LVPECL
High Frequency Synthesizer and a member of the
HiPerClockSTM family of High Performance Clock
Solutions from ICS. The ICS8430B-71 has a se-
lectable crystal oscillator interface or LVCMOS TEST_CLK.
The VCO operates at a frequency range of 250MHz to
700MHz. With the output configured to divide the VCO
frequency by 2, output frequency steps as small as 2MHz
can be achieved using a 16MHz crystal or test clock. Output
frequencies up to 700MHz can be programmed using the
serial or parallel interfaces to the configuration logic. The low
jitter and frequency range of the ICS8430B-71 make it an
ideal clock generator for most clock tree applications.
B
LOCK
D
IAGRAM
P
IN
A
SSIGNMENT
F
EATURES
Dual differential 3.3V LVPECL outputs
Selectable crystal oscillator interface
or LVCMOS TEST_CLK
Output frequency up to 700MHz
Crystal input frequency range: 12MHz to 27MHz
VCO range: 250MHz to 700MHz
Parallel or serial interface for programming counter
and output dividers
RMS period jitter: 9ps (maximum)
Cycle-to-cycle jitter: 25ps (maximum)
3.3V supply voltage
0C to 70C ambient operating temperature
Replaces 8430-71
Available in both standard and lead-free RoHS-compliant
packages
32 31 30 29 28 27 26 25
9 10 11 12 13 14 15 16
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
XTAL_OUT
TEST_CLK
XTAL_SEL
V
CCA
S_LOAD
S_DATA
S_CLOCK
MR
M5
M6
M7
M8
N 0
N 1
N 2
V
EE
V
EE
nFOUT0
FOUT0
V
CCO
nFOUT1
FOUT1
V
CC
TEST
XT
AL_IN
nP_LOAD
VCO_SEL
M0
M1
M2
M3
M4
32-Lead LQFP
7mm x 7mm x 1.4mm package body
Y Package
Top View
ICS8430B-71
HiPerClockSTM
ICS
OSC
VCO_SEL
XTAL_SEL
TEST_CLK
XTAL_IN
XTAL_OUT
S_LOAD
S_DATA
S_CLOCK
nP_LOAD
M0:M8
N0:N2
VCO
PLL
FOUT0
nFOUT0
FOUT1
nFOUT1
TEST
N
CONFIGURATION
INTERFACE
LOGIC
M
0
1
0
1
16
PHASE DETECTOR
MR
2
The Preliminary Information presented herein represents a product in prototyping or pre-production. The noted characteristics are based on initial
product characterization. Integrated Circuit Systems, Incorporated (ICS) reserves the right to change any circuitry or specifications without notice.
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
2
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
specific default state that will automatically occur during
power-up. The TEST output is LOW when operating in the
parallel input mode. The relationship between the VCO fre-
quency, the crystal frequency and the M divider is defined as
follows:
The M value and the required values of M0 through M8 are
shown in Table 3B, Programmable VCO Frequency Function
Table. Valid M values for which the PLL will achieve lock for a
16MHz reference are defined as 125
M 350. The frequency
out is defined as follows:
Serial operation occurs when nP_LOAD is HIGH and S_LOAD
is LOW. The shift register is loaded by sampling the S_DATA
bits with the rising edge of S_CLOCK. The contents of the
shift register are loaded into the M divider and N output di-
vider when S_LOAD transitions from LOW-to-HIGH. The M
divide and N output divide values are latched on the HIGH-
to-LOW transition of S_LOAD. If S_LOAD is held HIGH, data
at the S_DATA input is passed directly to the M divider and N
output divider on each rising edge of S_CLOCK. The serial
mode can be used to program the M and N bits and test bits
T1 and T0. The internal registers T0 and T1 determine the state
of the TEST output as follows:
NOTE: The functional description that follows describes op-
eration using a 16MHz crystal. Valid PLL loop divider values
for different crystal or input frequencies are defined in the In-
put Frequency Characteristics, Table 5, NOTE 1.
The ICS8430B-71 features a fully integrated PLL and there-
fore requires no external components for setting the loop band-
width. A parallel-resonant, fundamental crystal is used as the
input to the on-chip oscillator. The output of the oscillator is
divided by 16 prior to the phase detector. With a 16MHz crys-
tal, this provides a 1MHz reference frequency. The VCO of
the PLL operates over a range of 250MHz to 700MHz. The
output of the M divider is also applied to the phase detector.
The phase detector and the M divider force the VCO output
frequency to be 2M times the reference frequency by adjust-
ing the VCO control voltage. Note that for some values of M
(either too high or too low), the PLL will not achieve lock. The
output of the VCO is scaled by a divider prior to being sent to
each of the LVPECL output buffers. The divider provides a
50% output duty cycle.
The programmable features of the ICS8430B-71 support two
input modes to program the M divider and N output divider.
The two input operational modes are parallel and serial.
Fig-
ure 1
shows the timing diagram for each mode. In parallel
mode, the nP_LOAD input is initially LOW. The data on inputs
M0 through M8 and N0 through N2 is passed directly to the M
divider and N output divider. On the LOW-to-HIGH transition
of the nP_LOAD input, the data is latched and the M divider
remains loaded until the next LOW transition on nP_LOAD or
until a serial event occurs. As a result, the M and N bits can
be hardwired to set the M divider and N output divider to a
F
UNCTIONAL
D
ESCRIPTION
N
fout = fVCO =
16
2M
fxtal x
N
16
fVCO =
fxtal x 2M
T1
T0
TEST Output
0
0
LOW
0
1
S_Data clocked into register
1
0
Output of M divider
1
1
CMOS Fout
F
IGURE
1. P
ARALLEL
& S
ERIAL
L
OAD
O
PERATIONS
Time
S
ERIAL
L
OADING
P
ARALLEL
L
OADING
t
S
t
H
t
S
t
H
t
S
M, N
T1
T0
N2
N1
N0
M8
M7
M6
M5
M4
M3
M2
M1
M0
S_CLOCK
S_DATA
S_LOAD
nP_LOAD
M0:M8, N0:N2
nP_LOAD
S_LOAD
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
3
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
T
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8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
4
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
T
ABLE
3B. P
ROGRAMMABLE
VCO F
REQUENCY
F
UNCTION
T
ABLE
(NOTE 1)
T
ABLE
3A. P
ARALLEL
AND
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8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
5
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
T
ABLE
4A. P
OWER
S
UPPLY
DC C
HARACTERISTICS
,
V
CC
= V
CCA
= V
CCO
= 3.3V5%, T
A
= 0C
TO
70C
T
ABLE
4B. LVCMOS/LVTTL DC C
HARACTERISTICS
,
V
CC
= V
CCA
= V
CCO
= 3.3V5%, T
A
= 0C
TO
70C
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NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions be-
yond those listed in the
DC Characteristics
or
AC Character-
istics
is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
A
BSOLUTE
M
AXIMUM
R
ATINGS
Supply Voltage, V
CC
4.6V
Inputs, V
I
-0.5V to V
CC
+ 0.5V
Outputs, I
O
Continuous Current
50mA
Surge Current
100mA
Package Thermal Impedance,
JA
47.9C/W (0 lfpm)
Storage Temperature, T
STG
-65C to 150C
T
ABLE
4C. LVPECL DC C
HARACTERISTICS
,
V
CC
= V
CCA
= V
CCO
= 3.3V5%, T
A
= 0C
TO
70C
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.
2
/
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
6
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
T
ABLE
7. AC C
HARACTERISTICS
,
V
CC
= V
CCA
= V
CCO
= 3.3V5%, T
A
= 0C
TO
70C
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NPUT
C
HARACTERISTICS
,
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CC
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CCA
= V
CCO
= 3.3V5%, T
A
= 0C
TO
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m
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
7
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
P
ARAMETER
M
EASUREMENT
I
NFORMATION
P
ERIOD
J
ITTER
O
UTPUT
S
KEW
3.3V O
UTPUT
L
OAD
AC T
EST
C
IRCUIT
SCOPE
Qx
nQx
LVPECL
C
YCLE
-
TO
-C
YCLE
J
ITTER
t
jit(cc) =
t
cycle n
t
cycle n+1
1000 Cycles
t
cycle n
t
cycle n+1
O
UTPUT
R
ISE
/F
ALL
T
IME
V
OH
V
REF
V
OL
Mean Period
(First edge after trigger)
Reference Point
(Trigger Edge)
1
contains 68.26% of all measurements
2
contains 95.4% of all measurements
3
contains 99.73% of all measurements
4
contains 99.99366% of all measurements
6
contains (100-1.973x10
-7
)% of all measurements
Histogram
O
UTPUT
D
UTY
C
YCLE
/P
ULSE
W
IDTH
/P
ERIOD
t
sk(o)
nFOUTx
FOUTx
nFOUTy
FOUTy
nFOUTx
FOUTx
Clock
Outputs
20%
80%
80%
20%
t
R
t
F
V
SW I N G
t
PW
t
PERIOD
t
PW
t
PERIOD
odc =
x 100%
FOUTx
nFOUTx
2V
-1.3V 0.165V
V
CC
,
V
CCA
, V
CCO
V
EE
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
8
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS8430B-71 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. V
CC
, V
CCA
, and V
CCO
should be individually connected to the power supply
plane through vias, and bypass capacitors should be
used for each pin. To achieve optimum jitter performance,
power supply isolation is required.
Figure 1
illustrates how
a 10
resistor along with a 10F and a .01F bypass
capacitor should be connected to each V
CCA
pin.
P
OWER
S
UPPLY
F
ILTERING
T
ECHNIQUES
F
IGURE
1. P
OWER
S
UPPLY
F
ILTERING
10
V
CCA
10
F
.01
F
3.3V
.01
F
V
CC
A
PPLICATION
I
NFORMATION
Figure 2. C
RYSTAL
I
NPU
t I
NTERFACE
C
RYSTAL
I
NPUT
I
NTERFACE
A crystal can be characterized for either series or parallel
mode operation. The ICS8430B-71 has a built-in crystal
oscillator circuit. This interface can accept either a series or
parallel crystal without additional components and generate
frequencies with accuracy suitable for most applications.
Additional accuracy can be achieved by adding two small
capacitors C1 and C2 as shown in
Figure 2
.
C1
18p
X1
18pF Parallel Crystal
C2
22p
XTAL_OUT
XTAL_IN
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
9
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
V
CC
- 2V
50
50
RTT
Z
o
= 50
Z
o
= 50
FOUT
FIN
RTT =
Z
o
1
((V
OH
+ V
OL
) / (V
CC
2)) 2
3.3V
125
125
84
84
Z
o
= 50
Z
o
= 50
FOUT
FIN
The clock layout topology shown below is a typical termina-
tion for LVPECL outputs. The two different layouts mentioned
are recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, termi-
nating resistors (DC current path to ground) or current sources
must be used for functionality. These outputs are designed to
drive 50
transmission lines. Matched impedance tech-
F
IGURE
3B. LVPECL O
UTPUT
T
ERMINATION
F
IGURE
3A. LVPECL O
UTPUT
T
ERMINATION
niques should be used to maximize operating frequency
and minimize signal distortion. There are a few simple ter-
mination schemes.
Figures 3A and 3B
show two different
layouts which are recommended only as guidelines. Other
suitable clock layouts may exist and it would be recom-
mended that the board designers simulate to guarantee
compatibility across all printed circuit and clock component
process variations.
T
ERMINATION
FOR
LVPECL O
UTPUTS
I
NPUTS
:
C
RYSTAL
I
NPUT
:
For applications not requiring the use of the crystal oscillator
input, both XTAL_IN and XTAL_OUT can be left floating.
Though not required, but for additional protection, a 1k
resistor can be tied from XTAL_IN to ground.
TEST_CLK I
NPUT
:
For applications not requiring the use of the test clock, it can
be left floating. Though not required, but for additional
protection, a 1k
resistor can be tied from the TEST_CLK to
ground.
LVCMOS C
ONTROL
P
INS
:
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1k
resistor can be used.
R
ECOMMENDATIONS
FOR
U
NUSED
I
NPUT
AND
O
UTPUT
P
INS
O
UTPUTS
:
LVPECL O
UTPUT
All unused LVPECL outputs can be left floating. We
recommend that there is no trace attached. Both sides of the
differential output pair should either be left floating or
terminated.
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
10
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
F
IGURE
5A. S
CHEMATIC
OF
R
ECOMMENDED
L
AYOUT
L
AYOUT
G
UIDELINE
The schematic of the ICS8430B-71 layout example used in
this layout guideline is shown in
Figure 5A.
The ICS8430B-71
recommended PCB board layout for this example is shown in
Figure 5B
. This layout example is used as a general guideline.
The layout in the actual system will depend on the selected
component types, the density of the components, the density
of the traces, and the stack up of the P.C. board.
S_LOAD
TL1
Zo = 50 Ohm
R7
10
C14
0.1u
C2
S_CLOCK
VCC
VC
C
C16
10u
X1
R1
125
FO
U
T
REF_IN
TL2
Zo = 50 Ohm
R4
84
C1
U1
ICS8430B-71
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
32
31
30
29
28
27
26
25
M5
M6
M7
M8
N0
N1
N2
VEE
TE
S
T
VC
C
FO
UT1
nF
O
U
T
1
V
CCO
FO
UT0
nF
O
U
T
0
VEE
MR
S_CLOCK
S_DATA
S_LOAD
VCCA
XTAL_SEL
TEST_CLK
X_OUT
M4
M3
M2
M1
M0
VC
O_SEL
nP
_
LO
A
D
X_
I
N
R3
125
R2
84
C11
0.01u
IN+
XTAL_SEL
C15
0.1u
IN-
+
-
FO
U
TN
VCC
VCCA
VC
C
S_DATA
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
11
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
The following component footprints are used in this layout
example: All the resistors and capacitors are size 0603.
P
OWER
AND
G
ROUNDING
Place the decoupling capacitors C14 and C15 as close as pos-
sible to the power pins. If space allows, placing the decoupling
capacitor at the component side is preferred. This can reduce
unwanted inductance between the decoupling capacitor and the
power pin generated by the via.
Maximize the pad size of the power (ground) at the decoupling
capacitor. Maximize the number of vias between power (ground)
and the pads. This can reduce the inductance between the power
(ground) plane and the component power (ground) pins.
If V
CCA
shares the same power supply with V
CC
, insert the RC
filter R7, C11, and C16 in between. Place this RC filter as close
to the V
CCA
as possible.
C
LOCK
T
RACES
AND
T
ERMINATION
The component placements, locations and orientations should be
arranged to achieve the best clock signal quality. Poor clock signal
quality can degrade the system performance or cause system fail-
ure. In the synchronous high-speed digital system, the clock signal
is less tolerable to poor signal quality than other signals. Any ring-
ing on the rising or falling edge or excessive ring back can cause
system failure. The trace shape and the trace delay might be re-
stricted by the available space on the board and the component
location. While routing the traces, the clock signal traces should be
routed first and should be locked prior to routing other signal traces.
The traces with 50
transmission lines TL1 and TL2
at FOUT and nFOUT should have equal delay and run
adjacent to each other. Avoid sharp angles on the clock
trace. Sharp angle turns cause the characteristic
impedance to change on the transmission lines.
Keep the clock trace on the same layer. Whenever pos-
sible, avoid any vias on the clock traces. Any via on the
trace can affect the trace characteristic impedance and
hence degrade signal quality.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow more space between the clock trace
and the other signal trace.
Make sure no other signal trace is routed between the
clock trace pair.
The matching termination resistors R1, R2, R3 and R4 should
be located as close to the receiver input pins as possible.
Other termination schemes can also be used but are not
shown in this example.
C
RYSTAL
The crystal X1 should be located as close as possible to the
pins 24 (XTAL_OUT) and 25 (XTAL_IN). The trace length be-
tween the X1 and U1 should be kept to a minimum to avoid
unwanted parasitic inductance and capacitance. Other signal
traces should not be routed near the crystal traces.
F
IGURE
5B. PCB B
OARD
L
AYOUT
FOR
ICS8430B-71
TL1N
C14
R1
TL1, TL21N are 50 Ohm
traces and equal length
TL1
C1
Close to the input
pins of the
receiver
GND
TL1N
C2
VCC
R7
PIN 1
X1
R3
VIA
VCCA
C11
C15
C16
R4
TL1
U1
R2
8430BY-71
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REV. A SEPTEMBER 20, 2005
12
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8430B-71.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8430B-71 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 140mA = 485mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power
_MAX
(3.465V, with all outputs switching) = 485mW + 60mW = 545mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125C.
The equation for Tj is as follows: Tj =
JA
* Pd_total + T
A
Tj = Junction Temperature
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
JA
must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1C/W per Table 8 below.
Therefore, Tj for an ambient temperature of 70C with all outputs switching is:
70C + 0.545W * 42.1C/W = 93C. This is well below the limit of 125C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
67.8C/W
55.9C/W
50.1C/W
Multi-Layer PCB, JEDEC Standard Test Boards
47.9C/W
42.1C/W
39.4C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
T
ABLE
8. T
HERMAL
R
ESISTANCE
JA
FOR
32-
PIN
LQFP, F
ORCED
C
ONVECTION
8430BY-71
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REV. A SEPTEMBER 20, 2005
13
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in
Figure 6.
T
o calculate worst case power dissipation into the load, use the following equations which assume a 50
load, and a termination
voltage of V
CCO
- 2V.
For logic high, V
OUT
= V
OH_MAX
= V
CCO_MAX
0.9V
(V
CCO_MAX
- V
OH_MAX
) = 0.9V
For logic low, V
OUT
= V
OL_MAX
= V
CCO_MAX
1.7V
(V
CCO_MAX
- V
OL_MAX
) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
(V
CCO_MAX
- 2V))/R
L
] * (V
CCO_MAX
- V
OH_MAX
) = [(2V - (V
CCO_MAX
- V
OH_MAX
))/R
L
] * (V
CCO_MAX
- V
OH_MAX
) =
[(2V - 0.9V)/50
] * 0.9V = 19.8mW
Pd_L = [(V
OL_MAX
(V
CCO_MAX
- 2V))/R
L
] * (V
CCO_MAX
- V
OL_MAX
) = [(2V - (V
CCO_MAX
- V
OL_MAX
))/R
L
] * (V
CCO_MAX
- V
OL_MAX
) =
[(2V - 1.7V)/50
] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
F
IGURE
6. LVPECL D
RIVER
C
IRCUIT
AND
T
ERMINATION
Q1
V
OUT
V
CCO
R L
50
V
CCO
- 2V
8430BY-71
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REV. A SEPTEMBER 20, 2005
14
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
R
ELIABILITY
I
NFORMATION
T
RANSISTOR
C
OUNT
The transistor count for ICS8430B-71 is: 3948
T
ABLE
9.
JA
VS
. A
IR
F
LOW
T
ABLE
FOR
32 L
EAD
LQFP
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
67.8C/W
55.9C/W
50.1C/W
Multi-Layer PCB, JEDEC Standard Test Boards
47.9C/W
42.1C/W
39.4C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
8430BY-71
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REV. A SEPTEMBER 20, 2005
15
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
P
ACKAGE
O
UTLINE
- Y S
UFFIX
FOR
32 L
EAD
LQFP
T
ABLE
10. P
ACKAGE
D
IMENSIONS
N
O
I
T
A
I
R
A
V
C
E
D
E
J
S
R
E
T
E
M
I
L
L
I
M
N
I
S
N
O
I
S
N
E
M
I
D
L
L
A
L
O
B
M
Y
S
A
B
B
M
U
M
I
N
I
M
L
A
N
I
M
O
N
M
U
M
I
X
A
M
N
2
3
A
0
6
.
1
1
A
5
0
.
0
5
1
.
0
2
A
5
3
.
1
0
4
.
1
5
4
.
1
b
0
3
.
0
7
3
.
0
5
4
.
0
c
9
0
.
0
0
2
.
0
D
C
I
S
A
B
0
0
.
9
1
D
C
I
S
A
B
0
0
.
7
2
D
0
6
.
5
E
C
I
S
A
B
0
0
.
9
1
E
C
I
S
A
B
0
0
.
7
2
E
0
6
.
5
e
C
I
S
A
B
0
8
.
0
L
5
4
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0
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6
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0
5
7
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0
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7
c
c
c
0
1
.
0
Reference Document: JEDEC Publication 95, MS-026
8430BY-71
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 20, 2005
16
Integrated
Circuit
Systems, Inc.
ICS8430B-71
700MH
Z
, L
OW
J
ITTER
, C
RYSTAL
I
NTERFACE
/
LVCMOS-
TO
-3.3V LVPECL F
REQUENCY
S
YNTHESIZER
PRELIMINARY
T
ABLE
11. O
RDERING
I
NFORMATION
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements
are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS
product for use in life support devices or critical medical instruments.
The aforementioned trademark, HiPerClockS is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
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