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Электронный компонент: IDT70P258

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1
2004 Integrated Device Technology, Inc.
APRIL 2004
DSC-5675/4
I/O
Control
Address
Decoder
A
12L
(1)
A
0L
MEMORY
ARRAY
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
OE
L
R/
W
L
CE
L
5675 drw 01
OE
R
R/
W
R
CE
R
SEM
L
INT
L
M/
S
SEM
R
INT
R
(3)
(3)
13
13
A
12R
(1)
A
0R
Address
Decoder
I/O
Control
BUSY
L
I/O
8L
-I/O
15L
I/O
0L
-I/O
7L
BUSY
R
I/O
8R
-I/O
15R
I/O
0R
-I/O
7R
(2,3)
(2,3)
,
INPUT
READ REGISTER
AND
OUTPUT
DRIVE REGISTER
OE
L
R/
W
L
CE
L
OE
R
R/
W
R
CE
R
IRR
0
,IRR
1
OD R
0
-
ODR
4
R/
W
L
UB
L
LB
L
CE
L
OE
L
R/
W
R
UB
R
LB
R
CE
R
OE
R
SFEN
IDT70P258/248L
VERY LOW POWER 1.8V
8K/4K x 16 DUAL-PORT
STATIC RAM
Features
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
Industrial: 55ns (max.)
Low-power operation
IDT70P258/248L
Active: 27mW (typ.)
Standby: 3.6
W (typ.)
Separate upper-byte and lower-byte control for multiplexed
bus compatibility
IDT70P258/248 easily expands data bus width to 32 bits or
more using the Master/Slave select when cascading more
than one device
M/
S = V
DD
for
BUSY output flag on Master
M/
S = V
SS
for
BUSY input on Slave
Input Read Register
Output Drive Register
BUSY and Interrupt Flag
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
LVTTL-compatible, single 1.8V (100mV) power supply
Available in 100 Ball 0.5mm-pitch BGA
Industrial temperature range (-40C to +85C)
Functional Block Diagram
NOTES:
1. A
12X
is a NC for IDT70P248.
2. (MASTER):
BUSY is output; (SLAVE): BUSY is input.
3.
BUSY outputs and INT outputs are non-tri-stated push-pull.
Supports 3.0V, 2.5V and 1.8V I/O's
6.42
IDT70P258/248L
Low Power 1.8V 8K/4K x 16 Dual-Port Static RAM Industrial Temperature Range
2
Description
The IDT70P258/248 is a very low power 8K/4K x 16 Dual-Port
Static RAM. The IDT70P258/248 is designed to be used as a stand-alone
128/64K-bit Dual-Port SRAM or as a combination MASTER/SLAVE Dual-
Port SRAM for 32-bit-or-more word systems. Using the IDT MASTER/
SLAVE Dual-Port SRAM approach in 32-bit or wider memory system
applications results in full-speed, error-free operation without the need for
additional discrete logic.
This device provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access for
reads or writes to any location in memory. An automatic power down
feature controlled by
CE permits the on-chip circuitry of each port to enter
a very low standby power mode.
Fabricated using IDT's CMOS high-performance technology,
these devices typically operate on only 27mW of power.
The IDT70P258/248 is packaged in a 100 ball 0.5mm- pitch Ball
Grid Array. The package is a 1mm thick and designed to fit in wireless
handset applications.
Pin Configurations
(2,3,4)
C10
D8
C8
A9
D9
C9
B9
D10
C7
B8
A8
A10
D7
B7
A7
B6
C6
D6
A5
B5
C5
D5
A4
B4
C4
D4
A3
B3
C3
D3
D2
C2
B2
A2
A1
B1
C1
D1
E1
E2
E3
E4
F1
F2
F3
F4
G1
G2
G3
G4
H1
H2
H3
H4
J1
J2
J3
J4
K1
K2
K3
K4
A6
B10
E5
E6
E7
E8
E9
E10
F5
F6
F8
F9
F10
G5
G6
G7
G8
G9
G10
H5
H6
H7
H8
H9
H10
J5
J6
J7
J8
J9
J10
K5
K6
K7
K8
K9
K10
F7
5675 drw 02b
,
09/04/03
A
5R
A
8R
A
11R
UB
R
Vss
Vss
SEM
R
I/O
15R
I/O
12R
I/O
10R
Vss
Vss
A
6R
I/O
7R
I/O
11R
I/O
14R
A
2R
A
1R
A
0R
LB
R
Vss
Vss
SFEN
Vss
Vss
V
DD
A
3R
A
7R
A
9R
CE
R
R/
W
R
OE
R
I/O
9R
I/O
6R
A
4R
V
DD
V
DD
A
12R
(1)
A
10R
INT
R
I/O
13R
I/O
5R
BUSY
R
I/O
2R
ODR
2
ODR
4
I/O
8R
M/
S
ODR
3
INT
L
IRR
1
I/O
4R
I/O
1R
ODR
1
BUSY
L
A
1L
NC
NC
OE
L
I/O
0R
I/O
3R
I/O
15L
V
DDQL
ODR
0
A
2L
A
5L
A
12L
(1)
V
DD
I/O
3L
I/O
11L
I/O
12L
I/O
14L
I/O
13L
A
0L
A
4L
A
9L
LB
L
CE
L
I/O
1L
V
DDQL
I/O
10L
A
3L
A
7L
A
10L
IRR
0
I/O
4L
I/O
6L
I/O
8L
I/O
9L
A
6L
A
8L
A
11L
UB
L
SEM
L
R/
W
L
I/O
0L
I/O
2L
I/O
5L
I/O
7L
Vss
70P258/248BY
BY-100
100-Ball 0.5mm Pitch BGA
Top View
(5)
NOTES:
1. A
12X
is a NC for IDT70P248.
2. All V
DD
pins must be connected to power supply.
3. All V
SS
pins must be connected to ground supply.
4. BY100-1 package body is approximately 6mm x 6mm x 1mm, ball pitch 0.5mm.
5. This package code is used to reference the package diagram.
6. This text does not indicate orientation of the actual part-marking.
6.42
IDT70P258/248L
Low Power 1.8V 8K/4K x 16 Dual-Port Static RAM Industrial Temperature Range
3
Pin Names
Left Port
Right Port
Names
CE
L
CE
R
Chip Enable (Input)
R/
W
L
R/
W
R
Read/Write Enable (Input)
OE
L
OE
R
Output Enable (Input)
A
0L
- A
12L
(1)
A
0R
- A
12R
(1)
Address (Input)
I/O
0L
- I/O
15L
I/O
0R
- I/O
15R
Data Input/Output
SEM
L
SEM
R
Semaphore Enable (Input)
UB
L
UB
R
Upper Byte Select (Input)
LB
L
LB
R
Lower Byte Select (Input)
INT
L
INT
R
Interrupt Flag (Output)
BUSY
L
BUSY
R
Busy Flag
IRR
0
, IRR
1
Input Read Register (Input)
ODR
0
- ODR
4
Output Drive Register (Output)
SFEN
(2)
Special Function Enable (Input)
M/
S
Master or Slave Select (Input)
V
DD
Power (1.8V) (Input)
V
DDQL
Left Port I/O Supply Voltage
(3.0V) (Input)
V
SS
Ground (0V) (Input)
5675 tbl 01
NOTE:
1. A
12X
is a NC for IDT70P248.
2.
SFEN is active when either CE
L
= V
IL
or
CE
R
= V
IL
.
SFEN is inactive when CE
L
=
CE
R
= V
IH
.
NOTE:
1. A
0L
-- A
12L
A
0R
-- A
12R
Truth Table I: Non-Contention Read/Write Control
Inputs
(1)
Outputs
Mode
CE
R/
W
OE
UB
LB
SEM
I/O
8-15
I/O
0-7
H
X
X
X
X
H
High-Z
High-Z
Deselected: Power Down
X
X
X
H
H
H
High-Z
High-Z
Both Bytes Deselected
L
L
X
L
H
H
DATA
IN
High-Z
Write to Upper Byte Only
L
L
X
H
L
H
High-Z
DATA
IN
Write to Lower Byte Only
L
L
X
L
L
H
DATA
IN
DATA
IN
Write to Both Bytes
L
H
L
L
H
H
DATA
OUT
High-Z
Read Upper Byte Only
L
H
L
H
L
H
High-Z
DATA
OUT
Read Lower Byte Only
L
H
L
L
L
H
DATA
OUT
DATA
OUT
Read Both Bytes
X
X
H
X
X
X
High-Z
High-Z
Outputs Disabled
5675 tbl 02
6.42
IDT70P258/248L
Low Power 1.8V 8K/4K x 16 Dual-Port Static RAM Industrial Temperature Range
4
Truth Table II: Semaphore Read/Write Control
(1)
NOTE:
1. There are eight semaphore flags written to via I/O
0
and read from all of the I/O's (I/O
0
-I/O
15
). These eight semaphores are addressed by A
0
-A
2
.
Inputs
Outputs
Mode
CE
R/
W
OE
UB
LB
SEM
I/O
8-15
I/O
0-7
H
H
L
X
X
L
DATA
OUT
DATA
OUT
Read Data in Semaphore Flag
X
H
L
H
H
L
DATA
OUT
DATA
OUT
Read Data in Semaphore Flag
H
X
X
X
L
DATA
IN
DATA
IN
Write D
IN0
into Semaphore Flag
X
X
H
H
L
DATA
IN
DATA
IN
Write D
IN0
into Semaphore Flag
L
X
X
L
X
L
____
____
Not Allowed
L
X
X
X
L
L
____
____
Not Allowed
5675 tbl 03
Absolute Maximum Ratings
(1)
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. V
TERM
must not exceed V
DD
+ 0.3V for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period over V
TERM
= V
DD
+ 0.3V
.
3. Ambient Temperature under DC Bias. No AC Conditions. Chip Deselected.
4. V
DDQLMAX
+ 0.3V for left port.
Symbol
Rating
Commercial
& Industrial
Unit
V
TERM
(2)
Terminal Voltage with
Respect to GND
-0.5 to V
DDMAX
+0.3V
(4)
V
T
BIAS
(3)
Temperature Under Bias
-55 to +125
o
C
T
STG
Storage Temperature
-65 to +150
o
C
T
JN
Junction Temperature
+150
o
C
I
OUT
(for
V
DDQL
=
3.0V)
DC Output Current
20
mA
I
OUT
(for
V
DDQL
=
1.8V)
DC Output Current
20
mA
5675 tbl 04
6.42
IDT70P258/248L
Low Power 1.8V 8K/4K x 16 Dual-Port Static RAM Industrial Temperature Range
5
Capacitance
(TA = +25C, f = 1.0MHz)
NOTES:
1.
This parameter is determined by device characterization but is not production
tested.
2.
3dV references the interpolated capacitance when the input and output signals
switch from 0V to 3V or from 3V to 0V.
Symbol
Parameter
Conditions
(2)
Max.
Unit
C
IN
Input Capacitance
V
IN
= 3dV
9
pF
C
OUT
Output Capacitance
V
OUT
= 3dV
11
pF
5675 tbl 07
Maximum Operating Temperature
and Supply Voltage
(1)
NOTES:
1. This is the parameter T
A
. This is the "instant on" case temperature.
Grade
Ambient
Temperature
GND
V
DD
Industrial
-40
O
C to +85
O
C
0V
1.8V
+
100mV
5675 tbl 05
Recommended DC Operating Conditions
(V
DDQL
= 3.0V300mV)
NOTES:
1. V
IL
> -1.5V for pulse width less than 10ns.
2. V
TERM
must not exceed V
DD
+ 0.3V.
3.
SFEN operates at the 1.8V V
IH
and V
IL
voltage levels.
4. M/
S operates at the V
DD
and V
SS
voltage levels.
Symbol
Parameter
Min.
Typ.
Max.
Unit
V
DD
Supply Voltage
(4)
1.7
1.8
1.9
V
V
DDQL
Left Port Supply Voltage
2.7
3.0
3.3
V
V
SS
Ground
0
0
0
V
V
IHL
Input High Voltage (V
DDQL
= 3.0V)
2.0
___
V
DDQL
+ 0.2
V
V
ILL
Input Low Voltage (V
DDQL
= 3.0V)
-0.2
___
0.6
V
V
IHR
Input High Voltage
(3)
1.2
___
V
DD
+ 0.2
V
V
ILR
Input Low Voltage
(3)
-0.2
___
0.4
V
5675 tbl 06
Symbol
Parameter
Min.
Typ.
Max.
Unit
V
DD
Supply Voltage
(4)
1.7
1.8
1.9
V
V
DDQL
Left Port Supply Voltage
2.4
2.5
2.6
V
V
SS
Ground
0
0
0
V
V
IHL
Input High Voltage (V
DDQL
= 2.5V)
1.7
___
V
DDQL
+ 0.3
V
V
ILL
Input Low Voltage (V
DDQL
= 2.5V)
-0.3
___
0.7
V
V
IHR
Input High Voltage
(3)
1.2
___
V
DD
+ 0.2
V
V
ILR
Input Low Voltage
(3)
-0.2
___
0.4
V
5675 tbl 06_5
Recommended DC Operating Conditions
(V
DDQL
= 2.5V100mV)