1 0 G i g a b i t X F P
S e r i a l H o t - P l u g g a b l e
T r a n s c e i v e r
Features
Full-duplex transmission at 9.95 to
11.08 Gbit/s
Transceiver options:
850 nm VCSEL for a range up to 300 m
over multi-mode fiber
1310 nm DFB laser for up to 10 km over
single-mode fiber
Protocol-transparent
2-wire interface for integrated Digital
Optical Monitoring
Serial 10 Gbit/s XFI electrical interface
User-friendly plug-and-play-style "Hot
Swap"
Power consumption less than 2.5 W
5 V, 3.3 V and 1.8 V power supply
Integrated transmit and receive CDR
IEC 60825-1 class 1 and FDA 21 CFR
1040.10 and 1040.11 laser eye safety
ESD class 2 per MIL-STD 883D method
3015.7
FCC 47 CFR class B
T h e I n f i n e o n
10G XFP transceiver series is a family of
high-performance, low-cost modules for serial optical data communication
applications. The modules are protocol-agnostic, ultra-small 10 Gbit/s
optical transceivers that comply with all applicable IEEE 802.3ae 10
Gigabit Ethernet and NCITS 10 Gigabit Fibre Channel standards.
Infineon's small-form-factor 10 Gigabit XFP transceivers are fully
compliant with the specifications of the XFP MSA (Multi-Source
Agreement).
The XFP series includes an 850 nm wavelength version for short-reach
applications of up to 300 m and a 1310 nm version for applications of up
to 10 km in range.
Infineon's XFP modules allow communications equipment manufacturers
to create standard-based, high-bandwidth systems to meet the
requirements of 10GE, 10GFC and OC-192 applications, including server
network interface cards, host bus adapters, target channel adapters
and SAN and enterprise LAN switches.
The modules are designed for high-density applications. Configurations
of up to 16 modules in a 19-inch rack space are possible without
compromising the stringent thermal and EMI management requirements
with 10 Gbit/s optical electronics devices.
Applications
Fibre Channel SAN switches
Ethernet LAN switches
Fibre Channel host bus adapters
Ethernet network interface cards
Hubs, bridges, routers
SONET/SDH/ATM switches
w w w . i n f i n e o n . c o m / f i b e r o p t i c s
N e v e r s t o p t h i n k i n g .
ASIC
SerDes/PHY
Tx Rx timer
Rx CDR
Control &
data management
2 wire
interface
30-pin edge
connector
XFI
9.95-11.08 Gbit/s
Vcc
Hot swap control
Laser
driver
10 G
laser
9.95-11.08
Gbit/s
PIN + TIA/LA
XFP transceiver block diagram
XFP transceiver mechanical package [mm]
Ordering code
V23833-F0005-B101
V23833-F0105-B001
Wave length
850 nm
1310 nm
Optical connect
LC
LC
Reach
300 m*
10 km
Ordering code
V23833-F9909-Z001
a
Product
XFP evaluation board kit
Description
Test board with 30-Pin XFP connector and cage
Products
Accessories
* Using 50 m multi-mode fiber with 2000 MHz*km bandwidth
For more information, please contact:
Infineon Technologies
North America (CA):
Irene Yan
Phone: +1-408-501-5664
irene.yan@infineon.com
Europe (Germany):
Angela Scholl
Phone: +49-30-386-22521
angela.scholl@infineon.com
Asia (Hong Kong):
Owen Chui
Phone: +852-2832-048
owen.chui@infineon.com
Japan (Tokyo):
Kunikazu Watanabe
Phone: +81-3-5449-6705
kunikazu.watanabe@infineon.com
Edition September 2003
Published by Infineon Technologies AG,
St.-Martin-Strae 53,
D-81669 Mnchen
Infineon Technologies AG 2003.
All Rights Reserved.
Please note:
The information herein describes certain components and shall
not be considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not
limited to warranties of non-infringement regarding circuits,
descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and
conditions and prices, please contact your nearest Infineon
Technologies office in Germany or our Infineon Technologies
representatives worldwide (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies office.
Infineon Technologies components may only be used in life-support devices
or systems with the express written approval of Infineon Technologies if a
failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness
of that device or system. Life-support devices or systems are intended to be
implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the
health of the user or other persons may be endangered.
Order no. B159-H8165-G1-X-7600
Printed in Germany
PS 09032.
Z&P
2002921
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