Intel
Advanced Boot Block Flash
Memory (B3)
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Datasheet
Product Features
The Intel
Advanced Boot Block Flash Memory (B3) device, manufactured on Intel's latest 0.13
m and 0.18
m technologies, represents a feature-rich solution at overall lower system cost.
The B3 device in x16 will be available in 48-lead TSOP and 48-ball CSP packages. The x8
option of this product family is available only in 40-lead TSOP and 48-ball BGA* packages.
Additional information on this product family can be obtained by accessing Intel's website at:
http://www.intel.com/design/flash.
Flexible SmartVoltage Technology
--2.7 V3.6 V Read/Program/Erase
--12 V V
PP
Fast Production Programming
1.65 V2.5 V or 2.7 V3.6 V I/O Option
--Reduces Overall System Power
High Performance
--2.7 V3.6 V: 70 ns Max Access Time
Optimized Block Sizes
--Eight 8-KB Blocks for Data,Top or
Bottom Locations
--Up to One Hundred Twenty-Seven 64-
KB Blocks for Code
Block Locking
--V
CC
-Level Control through WP#
Low Power Consumption
--9 mA Typical Read Current
Absolute Hardware-Protection
--V
PP
= GND Option
--V
CC
Lockout Voltage
Extended Temperature Operation
--40 C to +85 C
Automated Program and Block Erase
--Status Registers
Intel
Flash Data Integrator Software
--Flash Memory Manager
--System Interrupt Manager
--Supports Parameter Storage, Streaming
Data (e.g., Voice)
Extended Cycling Capability
--Minimum 100,000 Block Erase Cycles
Guaranteed
Automatic Power Savings Feature
--Typical I
CCS
after Bus Inactivity
Standard Surface Mount Packaging
--48-Ball CSP Packages
--40- and 48-Lead TSOP Packages
Density and Footprint Upgradeable for
common package
--8-, 16-, 32- and 64-Mbit Densities
ETOXTM VIII (0.13
m
)
Flash
Technology
--16 and 32-Mbit Densities
ETOXTM VII (0.18
m
)
Flash Technology
--16-, 32- and 64-Mbit Densities
ETOX TM VI (0.25
m
)
Flash Technology
--8-, 16-, and 32-Mbit Densities
The x8 option not recommended for new
designs
Order Number: 290580-017
May 2003
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
2
Datasheet
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://developer.intel.com/design/flash.
Copyright Intel Corporation 2003.
*Other names and brands may be claimed as the property of others.
Datasheet
3
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Contents
1.0
Introduction
..................................................................................................................7
1.1
Product Overview ..................................................................................................8
2.0
Product Description
..................................................................................................9
2.1
Package Pinouts ...................................................................................................9
2.2
Block Organization ..............................................................................................13
2.2.1
Parameter Blocks ...................................................................................14
2.2.2
Main Blocks ............................................................................................14
3.0
Principles of Operation
..........................................................................................14
3.1
Bus Operation .....................................................................................................14
3.1.1
Read.......................................................................................................15
3.1.2
Output Disable........................................................................................15
3.1.3
Standby ..................................................................................................15
3.1.4
Deep Power-Down / Reset.....................................................................15
3.1.5
Write .......................................................................................................16
3.2
Modes of Operation.............................................................................................16
3.2.1
Read Array .............................................................................................16
3.2.2
Read Identifier ........................................................................................17
3.2.3
Read Status Register .............................................................................18
3.2.3.1 Clearing the Status Register .....................................................18
3.2.4
Program Mode........................................................................................19
3.2.4.1 Suspending and Resuming Program ........................................19
3.2.5
Erase Mode ............................................................................................19
3.2.5.1 Suspending and Resuming Erase.............................................20
3.3
Block Locking ......................................................................................................21
3.3.1
WP# = V
IL
for Block Locking ..................................................................21
3.3.2
WP# = V
IH
for Block Unlocking ..............................................................22
3.4
V
PP
Program and Erase Voltages .......................................................................22
3.4.1
V
PP
= V
IL
for Complete Protection .........................................................22
3.5
Power Consumption ............................................................................................22
3.5.1
Active Power ..........................................................................................23
3.5.2
Automatic Power Savings (APS)............................................................23
3.5.3
Standby Power .......................................................................................23
3.5.4
Deep Power-Down Mode .......................................................................23
3.6
Power and Reset Considerations........................................................................23
3.6.1
Power-Up/Down Characteristics ............................................................23
3.6.2
RP# Connected to System Reset...........................................................24
3.6.3
V
CC
, V
PP
and RP# Transitions ...............................................................24
3.7
Power Supply Decoupling ...................................................................................24
4.0
Thermal and DC Characteristics
........................................................................25
4.1
Absolute Maximum Ratings.................................................................................25
4.2
Operating Conditions...........................................................................................26
4.3
DC Current Characteristics .................................................................................26
4.4
DC Voltage Characteristics .................................................................................29
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
4
Datasheet
5.0
AC Characteristics
................................................................................................... 30
5.1
AC Read Characteristics..................................................................................... 30
5.2
AC Write Characteristics ..................................................................................... 34
5.3
Erase and Program Timings ............................................................................... 38
5.4
Reset Specifications............................................................................................ 39
5.5
AC I/O Test Conditions ....................................................................................... 40
5.6
Device Capacitance ............................................................................................ 40
6.0
Reset Operations
..................................................................................................... 41
7.0
Ordering Information
.............................................................................................. 42
8.0
Additional Information
........................................................................................... 44
Appendix A
Write State Machine Current/Next States
................................................. 45
Appendix B
Architecture Block Diagram
........................................................................... 46
Appendix C
Word-Wide Memory Map Diagrams
............................................................. 47
Appendix D
Byte-Wide Memory Map Diagrams
.............................................................. 53
Appendix E
Program and Erase Flowcharts
.................................................................... 56
Appendix F
Mechanical Specifications
.............................................................................. 60
Datasheet
5
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Revision History
Number
Description
-001
Original version
-002
Section 3.4, V
PP
Program and Erase Voltages, added
Updated Figure 9: Automated Block Erase Flowchart
Updated Figure 10: Erase Suspend/Resume Flowchart (added program to table)
Updated Figure 16: AC Waveform: Program and Erase Operations (updated notes)
I
PPR
maximum specification change from 25
A to 50
A
Program and Erase Suspend Latency specification change
Updated Appendix A: Ordering Information (included 8 M and 4 M information)
Updated Figure, Appendix D: Architecture Block Diagram (Block info. in words not bytes)
Minor wording changes
-003
Combined byte-wide specification (previously 290605) with this document
Improved speed specification to 80 ns (3.0 V) and 90 ns (2.7 V)
Improved 1.8 V I/O option to minimum 1.65 V (Section 3.4)
Improved several DC characteristics (Section 4.4)
Improved several AC characteristics (Sections 4.5 and 4.6)
Combined 2.7 V and 1.8 V DC characteristics (Section 4.4)
Added 5 V V
PP
read specification (Section 3.4)
Removed 120 ns and 150 ns speed offerings
Moved Ordering Information from Appendix to Section 6.0; updated information
Moved Additional Information from Appendix to Section 7.0
Updated figure Appendix B, Access Time vs. Capacitive Load
Updated figure Appendix C, Architecture Block Diagram
Moved Program and Erase Flowcharts to Appendix E
Updated Program Flowchart
Updated Program Suspend/Resume Flowchart
Minor text edits throughout
-004
Added 32-Mbit density
Added 98H as a reserved command (Table 4)
A
1
A
20
= 0 when in read identifier mode (Section 3.2.2)
Status register clarification for SR3 (Table 7)
V
CC
and V
CCQ
absolute maximum specification = 3.7 V (Section 4.1)
Combined I
PPW
and I
CCW
into one specification (Section 4.4)
Combined I
PPE
and I
CCE
into one specification (Section 4.4)
Max Parameter Block Erase Time (t
WHQV2
/t
EHQV2
) reduced to 4 sec (Section 4.7)
Max Main Block Erase Time (t
WHQV3
/t
EHQV3
) reduced to 5 sec (Section 4.7)
Erase suspend time @ 12 V (t
WHRH2
/t
EHRH2
) changed to 5 s typical and 20 s maximum
(Section 4.7)
Ordering Information updated (Section 6.0)
Write State Machine Current/Next States Table updated (Appendix A)
Program Suspend/Resume Flowchart updated (Appendix F)
Erase Suspend/Resume Flowchart updated (Appendix F)
Text clarifications throughout
-005
BGA package diagrams corrected (Figures 3 and 4)
I
PPD
test conditions corrected (Section 4.4)
32-Mbit ordering information corrected (Section 6)
BGA package top side mark information added (Section 6)
-006
V
IH
and V
IL
Specification change (Section 4.4)
I
CCS
test conditions clarification (Section 4.4)
Added Command Sequence Error Note (Table 7)
Data sheet renamed from Smart 3 Advanced Boot Block 4-Mbit, 8-Mbit, 16-Mbit Flash
Memory Family.
Added device ID information for 4-Mbit x8 device
Removed 32-Mbit x8 to reflect product offerings
Minor text changes
-007
Corrected RP# pin description in Table 2, 3 Volt Advanced Boot Block Pin Descriptions
Corrected typographical error fixed in Ordering Information
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