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Электронный компонент: 810ECHIPSET

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Intel
810/810E Chipsets: GMCH
Electrical and Thermal
Specifications
Datasheet Addendum
January 31, 2000
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Intel
810/810E Chipsets: GMCH Electrical and Thermal Characteristics
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Datasheet Addendum
Order Number:
298180 - 001
Intel
810/810E Chipsets: GMCH Electrical and Thermal Characteristics
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Datasheet Addendum
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Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
810 chipset and Intel
810E chipset may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
I
2
C is a 2-wire communications bus/protocol developed by Philips. SMBus is a subset of the I
2
C bus/protocol and was developed by Intel.
Implementations of the I
2
C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips
Corporation.
Alert on LAN is a result of the Intel-IBM Advanced Manageability Alliance and a trademark of IBM
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
Intel Corporation
www.intel.com
or call 1-800-548-4725
*Third-party brands and names are the property of their respective owners.
Copyright Intel Corporation 2000
Intel
810/810E Chipsets: GMCH Electrical and Thermal Characteristics
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Datasheet Addendum
Contents
1.
Overview .............................................................................................................................7
1.1.
Related Documents and References ..........................................................................7
2.
Electrical Characteristics......................................................................................................8
2.1.
Absolute Maximum DC Ratings .................................................................................8
2.2.
Thermal Characteristics ............................................................................................8
2.3.
Power Characteristics...............................................................................................8
2.4.
Signal Groups ..........................................................................................................9
2.5.
DC Characteristics ................................................................................................. 10
2.6.
AC Characteristics ................................................................................................. 12
2.7.
GMCH Timing Diagrams ......................................................................................... 19
3.
GMCH DAC ...................................................................................................................... 22
3.1.
DAC DC Characteristics ......................................................................................... 22
3.2.
DAC Reference and Output Specifications ................................................................ 22
3.3.
DAC AC Characteristics ......................................................................................... 23
4.
Signal Quality Specifications .............................................................................................. 24
4.1.
3.3V Signal Overshoot/Undershoot Specification ....................................................... 24
4.2.
GTL+ Signal Overshoot/Undershoot Specification...................................................... 24
4.3.
1.8V Signal Overshoot/Undershoot Specification ....................................................... 24
Intel
810/810E Chipsets: GMCH Electrical and Thermal Characteristics
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Datasheet Addendum
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Figures
Figure 1. 2.5V Clocking Interface...................................................................................... 19
Figure 2. 3.3V Clocking Interface...................................................................................... 19
Figure 3. 3.3V Clock Duty Cycle ....................................................................................... 19
Figure 4. Valid Delay From Rising Clock Edge ................................................................... 20
Figure 5. Setup and Hold Time to Clock............................................................................ 20
Figure 6. Float Delay....................................................................................................... 20
Figure 7. Pulse Width ..................................................................................................... 21
Figure 9. Source Synchronous Digital Video Out timings ..................................................... 21
Tables
Table 1. Power Characteristics...........................................................................................8
Table 2. GMCH Signal Groups ...........................................................................................9
Table 3. DC Characteristics ............................................................................................. 10
Table 4. Clock Timings (66/100 MHz) ............................................................................... 12
Table 5. Display Interface Clock Timing............................................................................. 13
Table 6. CPU Interface Timings for 370-pin socket ............................................................. 13
Table 7. CPU Interface Timings for SC242 Connector .......................................................... 14
Table 8. System Memory Timings (100MHz)...................................................................... 15
Table 9. Display Cache Memory Timings (100 MHz) ........................................................... 16
Table 11. Digital Video Out: Flat Panel Timings .................................................................. 17
Table 12. Flat Panel Data Setup and Hold Times from CLKOUT........................................... 17
Table 13. Digital Video Out: TV Out Timings....................................................................... 18
Table 14. TV Out Data Setup and Hold Times from CLKOUT................................................ 18
Table 15. DAC DC Characteristics.................................................................................... 22
Table 16. DAC Reference and output Specifications ............................................................ 22
Table 17. DAC AC Characteristics.................................................................................... 23
Table 18. 3.3V Signal Quality Specification ........................................................................ 24
Table 19. GTL+ Signal Quality Specification....................................................................... 24
Table 20. 1.8V Signal Quality Specification ........................................................................ 24