1
July 1999
FSYC9055D, FSYC9055R
Radiation Hardened, SEGR Resistant
P-Channel Power MOSFETs
Features
59A, -60V, r
DS(ON)
= 0.027
Total Dose
- Meets Pre-RAD Specifications to 100K RAD (Si)
Single Event
- Safe Operating Area Curve for Single Event Effects
- SEE Immunity for LET of 36MeV/mg/cm
2
with
V
DS
up to 80% of Rated Breakdown and
V
GS
of 10V Off-Bias
Dose Rate
- Typically Survives 3E9 RAD (Si)/s at 80% BV
DSS
- Typically Survives 2E12 if Current Limited to I
DM
Photo Current
- 6nA Per-RAD(Si)/s Typically
Neutron
- Maintain Pre-RAD Specifications
for 3E13 Neutrons/cm
2
- Usable to 3E14Neutrons/cm
2
g
Formerly available as type TA17750.
Description
The Discrete Products Operation of Harris Semiconductor
has developed a series of Radiation Hardened MOSFETs
specifically designed for commercial and military space
applications. Enhanced Power MOSFET immunity to Single
Event Effects (SEE), Single Event Gate Rupture (SEGR) in
particular, is combined with 100K RADS of total dose hard-
ness to provide devices which are ideally suited to harsh
space environments. The dose rate and neutron tolerance
necessary for military applications have not been sacrificed.
The Harris portfolio of SEGR resistant radiation hardened
MOSFETs includes N-Channel and P-Channel devices in a
variety of voltage, current and on-resistance ratings. Numer-
ous packaging options are also available.
This MOSFET is an enhancement-mode silicon-gate power
field-effect transistor of the vertical DMOS (VDMOS) struc-
ture. It is specially designed and processed to be radiation
tolerant. The MOSFET is well suited for applications
exposed to radiation environments such as switching regula-
tion, switching converters, motor drives, relay drivers and
drivers for high-power bipolar switching transistors requiring
high speed and low gate drive power. This type can be
operated directly from integrated circuits.
Reliability screening is available as either commercial, TXV
equivalent
of
MIL-S-19500,
or
Space
equivalent
of
MIL-S-19500.
Contact
Harris
Semiconductor
for
any
desired deviations from the data sheet.
Symbol
Package
SMD-2
Ordering Information
RAD LEVEL
SCREENING LEVEL
PART NUMBER/BRAND
10K
Commercial
FSYC9055D1
10K
TXV
FSYC9055D3
100K
Commercial
FSYC9055R1
100K
TXV
FSYC9055R3
100K
Space
FSYC9055R4
G
D
S
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
Harris Corporation 1999
File Number
4525.1
[ /Title
(FSYC
9055D,
FSYC
9055R)
/Sub-
ject
(Radia-
tion
Hard-
ened,
SEGR
Resis-
tant
P-
Chan-
nel
Power
MOS-
FETs)
/Autho
r ()
/Key-
words
(Radia-
tion
Hard-
ened,
SEGR
Resis-
tant P-
Chan-
nel
Power
MOS-
FETs)
/Cre-
ator ()
/DOCI
OBSOLETE PR
ODUCT
POSSIBLE SUBSTITUTE PR
ODUCT
FSTYC9055D
, FSTYC9055R
2
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
FSYC9055D, FSYC9055R
UNITS
Drain to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DS
-60
V
Drain to Gate Voltage (R
GS
= 20k
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DGR
-60
V
Continuous Drain Current
T
C
= 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
D
59
A
T
C
= 100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
D
38
A
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
177
A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
20
V
Maximum Power Dissipation
T
C
= 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
T
162
W
T
C
= 100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
T
65
W
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.30
W/
o
C
Single Pulsed Avalanche Current, L = 100
H, (See Test Figure). . . . . . . . . . . . . . . . . . . . I
AS
177
A
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
S
59
A
Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
SM
177
A
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
-55 to 150
o
C
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
(Distance >0.063in (1.6mm) from Case, 10s Max)
300
o
C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications
T
C
= 25
o
C, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Drain to Source Breakdown Voltage
BV
DSS
I
D
= 1mA, V
GS
= 0V
-60
-
-
V
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
,
I
D
= 1mA
T
C
= -55
o
C
-
-
-7.0
V
T
C
= 25
o
C
-2.0
-
-6.0
V
T
C
= 125
o
C
-1.0
-
-
V
Zero Gate Voltage Drain Current
I
DSS
V
DS
= -48V,
V
GS
= 0V
T
C
= 25
o
C
-
-
25
A
T
C
= 125
o
C
-
-
250
A
Gate to Source Leakage Current
I
GSS
V
GS
=
20V
T
C
= 25
o
C
-
-
100
nA
T
C
= 125
o
C
-
-
200
nA
Drain to Source On-State Voltage
V
DS(ON)
V
GS
= -12V, I
D
= 59A
-
-
-1.79
V
Drain to Source On Resistance
r
DS(ON)12
I
D
= 38A,
V
GS
= -12V
T
C
= 25
o
C
-
0.017
0.027
T
C
= 125
o
C
-
-
0.043
Turn-On Delay Time
t
d(ON)
V
DD
= -30V, I
D
= 59A,
R
L
= 0.51
, V
GS
= -12V,
R
GS
= 2.35
-
-
55
ns
Rise Time
t
r
-
-
35
ns
Turn-Off Delay Time
t
d(OFF)
-
-
85
ns
Fall Time
t
f
-
-
35
ns
Total Gate Charge
Q
g(TOT)
V
GS
= 0V to -20V
V
DD
= -30V,
I
D
= 59A
-
-
280
nC
Gate Charge at 12V
Q
g(12)
V
GS
= 0V to -12V
-
140
160
nC
Threshold Gate Charge
Q
g(TH)
V
GS
= 0V to -2V
-
-
17
nC
Gate Charge Source
Q
gs
-
38
49
nC
Gate Charge Drain
Q
gd
-
26
38
nC
Plateau Voltage
V
(PLATEAU)
I
D
= 59A, V
DS
= -15V
-
-6
-
V
Input Capacitance
C
ISS
V
DS
= -25V, V
GS
= 0V,
f = 1MHz
-
6100
-
pF
Output Capacitance
C
OSS
-
2200
-
pF
Reverse Transfer Capacitance
C
RSS
-
300
-
pF
Thermal Resistance Junction to Case
R
JC
-
-
0.77
o
C/W
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Forward Voltage
V
SD
I
SD
= 59A
-0.6
-
-1.8
V
Reverse Recovery Time
t
rr
I
SD
= 59A, dI
SD
/dt = 100A/
s
-
-
120
ns
FSYC9055D, FSYC9055R
3
Electrical Specifications up to 100K RAD
T
C
= 25
o
C, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
MAX
UNITS
Drain to Source Breakdown Volts
(Note 3)
BV
DSS
V
GS
= 0, I
D
= 1mA
-60
-
V
Gate to Source Threshold Volts
(Note 3)
V
GS(TH)
V
GS
= V
DS
, I
D
= 1mA
-2.0
-6.0
V
Gate to Body Leakage
(Notes 2, 3)
I
GSS
V
GS
=
20V, V
DS
= 0V
-
100
nA
Zero Gate Leakage
(Note 3)
I
DSS
V
GS
= 0, V
DS
= -48V
-
25
A
Drain to Source On-State Volts
(Notes 1, 3)
V
DS(ON)
V
GS
= -12V, I
D
= 59A
-
-1.79
V
Drain to Source On Resistance
(Notes 1, 3)
r
DS(ON)12
V
GS
= -12V, I
D
= 38A
-
0.027
NOTES:
1. Pulse test, 300
s Max.
2. Absolute value.
3. Insitu Gamma bias must be sampled for both V
GS
= -12V, V
DS
= 0V and V
GS
= 0V, V
DS
= 80% BV
DSS
.
Single Event Effects (SEB, SEGR)
Note 4
TEST
SYMBOL
ENVIRONMENT (NOTE 5)
APPLIED
V
GS
BIAS
(V)
(NOTE 6)
MAXIMUM
V
DS
BIAS
(V)
ION
SPECIES
TYPICAL LET
(MeV/mg/cm)
TYPICAL
RANGE (
)
Single Event Effects Safe Operating
Area
SEESOA
Ni
26
43
20
-60
Br
37
36
10
-60
Br
37
36
15
-48
Br
37
36
20
-36
I
60
31
0
-60
I
60
31
5
-48
I
60
31
10
-36
I
60
31
15
-24
I
60
31
20
-12
NOTES:
4. Testing conducted at Brookhaven National Labs; sponsored by Naval Surface Warfare Center (NSWC), Crane, IN.
5. Fluence = 1E5 ions/cm
2
(typical), T = 25
o
C.
6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).
Typical Performance Curves
Unless Otherwise Specified
FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA
FIGURE 2. DRAIN INDUCTANCE REQUIRED TO LIMIT
GAMMA DOT CURRENT TO I
AS
LET = 37MeV/mg/cm
2
, RANGE = 36
LET = 26MeV/mg/cm
2
, RANGE = 43
LET = 60MeV/mg/cm
2
, RANGE = 31
-40
0
0
10
15
20
25
5
V
GS
(V)
V
DS
(V)
-10
-20
-30
-50
-60
-70
TEMP = 25
o
C
FLUENCE = 1E5 IONS/cm
2
(TYPICAL)
1
2
3
1 -
2 -
3 -
-300
-100
-10
LIMITING INDUCT
ANCE (HENR
Y)
DRAIN SUPPLY (V)
-1000
ILM = 10A
300A
1E-4
1E-5
1E-6
-30
100A
30A
1E-7
1E-3
FSYC9055D, FSYC9055R
4
FIGURE 3. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
FIGURE 5. BASIC CHARGE WAVEFORM
FIGURE 6. NORMALIZED r
DS(ON)
vs JUNCTION TEMPERATURE
FIGURE 7. NORMALIZED MAXIMUM TRANSIENT THERMAL RESPONSE
Typical Performance Curves
Unless Otherwise Specified (Continued)
I
D
, DRAIN (A)
T
C
, CASE TEMPERATURE (
o
C)
150
100
50
0
-50
0
20
40
30
10
70
60
50
100
10
1
-1
I
D
,
DRAIN CURRENT (A)
V
DS
, DRAIN-TO-SOURCE VOLTAGE (V)
-10
-100
500
100
s
1ms
10ms
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
-200
T
C
= 25
o
C
CHARGE
Q
GD
Q
G
V
G
Q
GS
-12V
2.5
2.0
1.5
1.0
0.5
0.0
-80
-40
0
40
80
120
160
T
J
, JUNCTION TEMPERATURE (
o
C)
NORMALIZED r
DS(ON)
PULSE DURATION = 250ms, V
GS
= 12V, I
D
= 38A
1
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
THERMAL RESPONSE (Z
JC
)
0.001
0.01
0.1
NORMALIZED
P
DM
t
1
t
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
JC
+ T
C
SINGLE PULSE
0.01
0.02
0.2
0.1
0.05
0.5
10
t, RECTANGULAR PULSE DURATION (s)
FSYC9055D, FSYC9055R
5
FIGURE 8. UNCLAMPED INDUCTIVE SWITCHING
Test Circuits and Waveforms
FIGURE 9. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 10. UNCLAMPED ENERGY WAVEFORMS
FIGURE 11. RESISTIVE SWITCHING TEST CIRCUI
FIGURE 12. RESISTIVE SWITCHING WAVEFORMS
Typical Performance Curves
Unless Otherwise Specified (Continued)
100
10
0.1
1
t
AV
, TIME IN AVALANCHE (ms)
I
AS
,
A
V
ALANCHE CURRENT (A)
10
STARTING T
J
= 150
o
C
STARTING T
J
= 25
o
C
IF R = 0
t
AV
= (L) (I
AS
) / (1.3 RATED BV
DSS
- V
DD
)
t
AV
= (L/R) ln [(I
AS
*R) / (1.3 RATED BV
DSS
- V
DD
) + 1]
IF R
0
300
0.01
t
P
V
GS
20V
L
+
-
V
DS
V
DD
DUT
VARY t
P
TO OBTAIN
REQUIRED PEAK I
AS
0V
50
50
50V-150V
I
AS
+
-
ELECTRONIC SWITCH OPENS
WHEN I
AS
IS REACHED
CURRENT
TRANSFORMER
V
DD
V
DS
BV
DSS
t
P
I
AS
t
AV
V
DD
R
L
V
DS
DUT
R
GS
0V
V
GS
= -12V
t
d(ON)
t
r
90%
10%
V
DS
90%
10%
t
f
t
d(OFF)
t
OFF
90%
50%
50%
10%
PULSE WIDTH
V
GS
t
ON
FSYC9055D, FSYC9055R
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