1
HA-2842
80MHz, High Slew Rate, High Output
Current, Video Operational Amplifier
The HA-2842 is a wideband, high slew rate, operational
amplifier featuring an outstanding combination of speed,
bandwidth, and output drive capability. This amplifier's
performance is further enhanced through stable operation
down to closed loop gains of +2, the inclusion of offset null
controls, and by its excellent video performance.
The capabilities of the HA-2842 are ideally suited for high
speed cable driver circuits, where low closed loop gains and
high output drive are required. With a 6MHz full power
bandwidth, this amplifier is well suited for high frequency
signal conditioning circuits and video amplifiers. Gain
flatness of 0.035dB, combined with differential gain and
phase specifications of 0.02%, and 0.03 degrees,
respectively, make the HA-2842 ideal for component and
composite video applications.
A zener/nichrome based reference circuit, coupled with
advanced laser trimming techniques, yields a supply current
with a low temperature coefficient and low lot-to-lot variability.
For example, the average I
CC
variation from 85
o
C to -40
o
C is
<600
A (
2%), while the standard deviation of the I
CC
distribution is <0.1mA (0.8%) at 25
o
C. Tighter I
CC
control
translates to more consistent AC parameters ensuring that
units from each lot perform the same way, and easing the task
of designing systems for wide temperature ranges. Critical AC
parameters, Slew Rate and Bandwidth, each vary by less
than
5% over the industrial temperature range (see Typical
Performance Curves)
Ordering Information.
Features
Stable at Gains of 2 or Greater
Low AC Variability Over Process and Temperature
Gain Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . 80MHz
Gain Flatness to 10MHz. . . . . . . . . . . . . . . . . . . . 0.035dB
High Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . 400V/
s
High Output Current (Min) . . . . . . . . . . . . . . . . . . . 100mA
Differential Gain/Phase . . . . . . . . . . 0.02%/0.03 Degrees
Low Supply Current (Max) . . . . . . . . . . . . . . . . . . . . 15mA
Enhanced Replacement for AD842
Applications
Pulse and Video Amplifiers
Wideband Amplifiers
Coaxial Cable Drivers
Fast Sample-Hold Circuits
High Frequency Signal Conditioning Circuits
Pinout
HA-2842 (SOIC)
TOP VIEW
PART NUMBER
(BRAND)
TEMP.
RANGE (
o
C)
PACKAGE
PKG.
DWG. #
HA9P2842-5
(H2842F5)
0 to 75
8 Ld SOIC
M8.15
BAL
-IN
+IN
V-
1
2
3
4
8
7
6
5
BAL
V+
OUT
NC
-
+
Data Sheet
June 2003
FN2766.6
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2003. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
2
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 35V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V
Output Current (Notes 3, 4) . . . . . . . . . . . . . . . . . . . . . . . . . . 125mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100mA (50% Duty Cycle)
Operating Conditions
Temperature Range
HA-2842-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 75
o
C
Recommended Supply Voltage Range . . . . . . . . . . .
6.5V to
15V
Thermal Resistance (Typical, Note 2)
JA
(
o
C/W)
8 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . .
160
Maximum Junction Temperature (Die). . . . . . . . . . . . . . . . . . . .175
o
C
Maximum Junction Temperature (Plastic Package, Note 1) . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
(Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Maximum power dissipation, including output load, must be designed to maintain the maximum junction temperature below 150
o
C for plastic
packages. By using Application Note AN556 on Safe Operating Area equations, along with the packaging thermal resistances listed in the
Thermal Information section, proper load conditions can be determined.
2.
JA
is measured with the component mounted on an evaluation PC board in free air.
3. V
O
=
5V, R
L
Unconnected, Duty cycle
50%. For information about using high output current amplifiers, please refer to Application Note AN556
(Thermal Safe-Operating-Areas For High Current Op Amps), and the "Power Dissipation Considerations" section in the "Application Information"
section of this datasheet.
4. Maximum continuous (100% Duty Cycle) output current is 50mA. For currents >50mA, Duty Cycle must be derated accordingly.
Electrical Specifications
V
SUPPLY
= 15V, R
L
= 1k
, C
L
10pF, Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP (
o
C)
HA-2842-5
UNITS
MIN
TYP
MAX
INPUT CHARACTERISTICS
Offset Voltage (Note 10)
25
-
1
3
mV
Full
-
-
6
mV
Average Offset Voltage Drift
Full
-
13
-
V/
o
C
Bias Current (Note 10)
25
-
5
10
A
Full
-
-
15
A
Average Bias Current Drift
Full
-
20
-
nA/
o
C
Offset Current
25
-
0.5
1.0
A
Full
-
-
1.5
A
Average Offset Current Drift
Full
-
1.3
-
nA/
o
C
Input Resistance
25
-
170
-
k
Input Capacitance
25
-
1
-
pF
Common Mode Range
Full
10
-
-
V
Input Noise Voltage
10Hz to 1MHz
25
-
16
-
V
RMS
Input Noise Voltage Density
f = 1kHz, R
SOURCE
= 0
25
-
16
-
Input Noise Current (Note 10)
f = 1kHz, R
SOURCE
= 100k
25
-
2
-
TRANSFER CHARACTERISTICS
Large Signal Voltage Gain
V
O
=
10V
25
50
100
-
kV/V
Full
30
60
-
kV/V
Common-Mode Rejection Ratio (Note 10)
V
CM
=
10V
Full
80
110
-
dB
Minimum Stable Gain
25
2
-
-
V/V
Gain Bandwidth Product (Note 10)
A
VCL
= 100
25
-
80
-
MHz
Gain Flatness to 10MHz (Note 10)
R
L
75
25
-
0.035
-
dB
nV Hz
/
pA Hz
/
HA-2842
3
OUTPUT CHARACTERISTICS
Output Voltage Swing (Note, 10)
V
O
=
10V
Full
10
11
-
V
Output Current (Note 10)
(Note 3)
Full
100
-
-
mA
Output Resistance
25
-
8.5
-
Full Power Bandwidth (Note 6)
V
O
=
10V
25
5.2
6
-
MHz
Differential Gain (Note 10)
(Note 5)
25
-
0.02
-
%
Differential Phase (Note 10)
(Note 5)
25
-
0.03
-
Degrees
Harmonic Distortion (Note 10)
V
O
= 2V
P-P
, f = 1MHz, A
V
= 2
25
-
>81
-
dBc
TRANSIENT RESPONSE (Note 7)
Rise Time
25
-
4
-
ns
Overshoot
25
-
25
-
%
Slew Rate (Notes 9, 10)
A
V
= +2
25
325
400
-
V/
s
Settling Time
10V Step to 0.1%
25
-
100
-
ns
POWER REQUIREMENTS
Supply Current (Note 10)
25
-
14.2
-
mA
Full
-
14.3
15
mA
Power Supply Rejection Ratio (Note 10)
(Note 8)
Full
70
80
-
dB
NOTES:
5. Differential gain and phase are measured with a VM700A video tester, using a NTC-7 composite VITS. R
F
= R
1
= 1k
, R
L
= 700
.
6. Full Power Bandwidth guaranteed based on slew rate measurement using
.
7. Refer to Test Circuits section of this data sheet.
8. V
SUPPLY
=
10V to
20V.
9. This parameter is not tested. The limits are guaranteed based on lab characterization and reflect lot-to-lot variation.
10. See "Typical Performance Curves" for more information.
Electrical Specifications
V
SUPPLY
= 15V, R
L
= 1k
, C
L
10pF, Unless Otherwise Specified (Continued)
PARAMETER
TEST CONDITIONS
TEMP (
o
C)
HA-2842-5
UNITS
MIN
TYP
MAX
FPBW
Slew Rate
2
VPEAK
---------------------------
=
VPEAK
;
10V
=
HA-2842
4
Test Circuits and Waveforms
TEST CIRCUIT
LARGE SIGNAL RESPONSE
SMALL SIGNAL RESPONSE
SETTLING TIME TEST CIRCUIT
NOTES:
14. A
V
= -2.
15. Feedback and summing resistors must be matched (0.1%).
16. HP5082-2810 clipping diodes recommended.
17. Tektronix P6201 FET probe used at settling point.
18. For 0.01% settling time, heat sinking is suggested to reduce
thermal effects and an analog ground plane with supply
decoupling is suggested to minimize ground loop errors.
SUGESTED OFFSET VOLTAGE ADJUSTMENT
IN
OUT
+
500
500
-
NOTES:
11. V
S
=
15V.
12. A
V
= +2.
13. C
L
10pF
INPUT
OUTPUT
Input = 5V/Div., Output = 5V/Div., 50ns/Div.
INPUT
OUTPUT
Input = 100mV/Div., Output = 100mV/Div., 50ns/Div.
+
V-
V+
SETTLING
POINT
V
OUT
V
IN
2.5k
-
5k
500
1k
+
-
V-
5k
V+
OUT
BAL
HA-2842
5
Application Information
The Intersil HA-2842 is a state of the art monolithic device
which also approaches the "ALL-IN-ONE" amplifier concept.
This device features an outstanding set of AC parameters
augmented by excellent output drive capability providing for
suitable application in both high speed and high output drive
circuits.
Primarily intended to be used in balanced 50
and 75
coaxial cable systems as a driver, the HA-2842 could also
be used as a power booster in audio systems as well as a
power amp in power supply circuits. This device would also
be suitable as a small DC motor driver.
Prototyping Guidelines
For best overall performance in any application, it is
recommended that high frequency layout techniques be
used. This should include:
1. Mounting the device through a ground plane.
2. Connecting unused pins (NC) to the ground plane.
3. Mounting feedback components on Teflon standoffs
and/or locating these components as close to the device
as possible.
4. Placing power supply decoupling capacitors from device
supply pins to ground.
Power Dissipation Considerations
At high output currents, especially with the 8 lead SOIC
package, care must be taken to ensure that the Maximum
Junction Temperature (T
J
, see "Absolute Maximum Ratings"
table) isn't exceeded. As an example consider the HA-2842 in
the SOIC package, with a required output current of 50mA at
V
OUT
= 10V with
15V supplies. The power dissipation is the
quiescent power (450mW = 30V x 15mA) plus the power
dissipated in the output stage
(P
OUT
= 250mW = 50mA x (15V - 10V)), or a total of 700mW.
The thermal resistance (
JA
) of the SOIC package is 157
o
C/W,
which increases the junction temperature by 110
o
C over the
ambient temperature (T
A
). Remaining below T
JMAX
requires
that T
A
be restricted to
40
o
C (150
o
C - 110
o
C). Heatsinking
would be required for operation at ambient temperatures
greater than 40
o
C.
Allowable output power can be increased by decreasing the
quiescent dissipation via lower supply voltages.
For more information please refer to Application Note AN556,
Thermal Safe Operating Areas for High Current Op Amps.
MAX P
OUT
WITHOUT HEATSINK (V
S
=
15V)
T
A
8 LEAD SOIC
(
JA
= 157
o
C/W)
85
o
C
Heatsink Required
70
o
C
60mW
25
o
C
350mW
Typical Performance Curves
T
A
= 25
o
C, V
SUPPLY
=
15V, R
L
= 1k
,
C
L
< 10pF, Unless Otherwise Specified
FIGURE 1. FREQUENCY RESPONSE FOR VARIOUS GAINS
FIGURE 2. GAIN BANDWIDTH PRODUCT vs SUPPLY VOLTAGE
10
100
1K
10K
100K
1M
10M
100M
FREQUENCY (Hz)
GA
IN (
d
B)
120
100
80
60
40
20
0
0
90
180
P
H
A
S
E (
D
EG
R
E
E
)
OPEN LOOP
A
VCL
= 1000
A
VCL
= 100
A
VCL
= 10
A
VCL
= 2
OPEN LOOP
A
VCL
= 1000
A
VCL
= 100
A
VCL
= 10
A
VCL
= 2
GAIN
BANDWIDT
H
PRODUCT (MHz
)
5
6
7
8
9
10
11
12
13
14
15
SUPPLY VOLTAGE (
V)
90
80
70
60
50
40
30
100
HA-2842
6
FIGURE 3. GAIN BANDWIDTH PRODUCT vs TEMPERATURE
FIGURE 4. CMRR vs FREQUENCY
FIGURE 5. PSRR vs FREQUENCY
FIGURE 6. INPUT NOISE vs FREQUENCY
FIGURE 7. SLEW RATE vs TEMPERATURE
FIGURE 8. SLEW RATE vs SUPPLY VOLTAGE
Typical Performance Curves
T
A
= 25
o
C, V
SUPPLY
=
15V, R
L
= 1k
,
C
L
< 10pF, Unless Otherwise Specified (Continued)
60
50
40
30
90
-60
-40
-20
0
20
40
60
80
100
120
140
TEMPERATURE (
o
C)
80
70
100
GAIN
BANDWIDTH PRODUCT
(
M
H
z
)
110
100
90
80
70
60
50
CMRR
(dB)
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
90
80
70
60
50
40
30
PS
RR (dB)
1K
10K
100K
1M
10M
FREQUENCY (Hz)
20
10
20
16
12
8
4
0
50
40
30
20
10
0
NO
IS
E VOL
T
A
GE
(n
V
/
Hz
)
10
100
1K
10K
100K
FREQUENCY (Hz)
NOISE
CURRENT
(pA
/
Hz
)
NOISE VOLTAGE
NOISE CURRENT
425
400
375
350
SL
EW
R
A
T
E
(
V
/
s)
-60
-40
-20
0
20
40
60
80
100 120
140
TEMPERATURE (
o
C)
450
400
350
300
250
200
SLEW RATE
(
V
/
s)
5
6
7
8
9
10
11
12
13
14
15
SUPPLY VOLTAGE (
V)
HA-2842
7
FIGURE 9. INPUT OFFSET VOLTAGE AND INPUT BIAS
CURRENT vs TEMPERATURE
FIGURE 10. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 11. POSITIVE OUTPUT SWING vs TEMPERATURE
FIGURE 12. NEGATIVE OUTPUT SWING vs TEMPERATURE
FIGURE 13. MAXIMUM UNDISTORTED OUTPUT SWING
vs FREQUENCY
FIGURE 14. TOTAL HARMONIC DISTORTION vs FREQUENCY
Typical Performance Curves
T
A
= 25
o
C, V
SUPPLY
=
15V, R
L
= 1k
,
C
L
< 10pF, Unless Otherwise Specified (Continued)
8
7
6
5
4
3
INPUT B
I
AS CURRENT
(
A)
3
2
1
0
-1
-2
I
N
PU
T O
FFSET
VOLT
AGE (m
V)
OFFSET VOLTAGE
BIAS CURRENT
-60 -40
-20
0
20
40
60
80
100 120 140
TEMPERATURE (
o
C)
16
14
12
10
8
6
4
SUPP
L
Y
CURRENT
(m
A)
5
6
7
8
9
10
11
12
13
14
15
SUPPLY VOLTAGE (
V)
125
o
C
-55
o
C
25
o
C
15
10
5
2.5
PO
SI
TI
VE
O
U
TP
UT SWI
N
G (V)
-60
-40
-20
0
20
40
60
80
100 120
140
TEMPERATURE (
o
C)
7.5
12.5
8V, 150
8V, 1k
8V, 75
15V, 1k
15V, 150
15V, 75
-60
-40
-20
0
20
40
60
80
100
120 140
TEMPERATURE (
o
C)
NEGATI
VE OUTPUT SWI
N
G (V)
-2.5
-5
-10
-15
-7.5
-12.5
8V, 150
8V, 1k
8V, 75
15V, 1k
15V, 150
15V, 75
30
25
20
15
10
5
0
1K
10K
100K
1M
10M
100M
FREQUENCY (Hz)
V
SUPPLY
=
15V
V
SUPPLY
=
8V
O
U
TPUT
VO
LTAG
E
SWING
(V
P-P
)
100K
1M
10M
-40
-50
-60
-70
-80
-90
FREQUENCY (Hz)
T
HD (dBc)
V
O
= 2V
P-P
V
O
= 1V
P-P
V
O
= 0.5V
P-P
V
O
= 10V
P-P
HA-2842
8
FIGURE 15. INTERMODULATION DISTORTION vs
FREQUENCY (TWO TONE)
FIGURE 16. DIFFERENTIAL GAIN vs LOAD RESISTANCE
FIGURE 17. DIFFERENTIAL PHASE vs LOAD RESISTANCE
FIGURE 18. GAIN FLATNESS vs FREQUENCY (A
VCL
= 2)
FIGURE 19. GAIN BANDWIDTH PRODUCT vs LOAD RESISTANCE
Typical Performance Curves
T
A
= 25
o
C, V
SUPPLY
=
15V, R
L
= 1k
,
C
L
< 10pF, Unless Otherwise Specified (Continued)
-40
-50
-60
-70
-80
-90
THIRD INTERMOD
PRODUCT (
d
Bc
)
1M
10M
FREQUENCY (Hz)
V
O
= 1V
P-P
V
O
= 5V
P-P
500K
V
O
= 2V
P-P
V
O
= 0.25V
P-P
V
O
= 0.50V
P-P
0.025
0.020
0.015
0.010
0.005
0
DIFF
ERENTI
AL G
A
IN
(%)
100
200
300
400
500
600
700
800
900 1000
LOAD RESISTANCE (
)
V
SUPPLY
=
8V
V
SUPPLY
=
15V
V
SUPPLY
=
10V
0.14
0.12
0.10
0.08
0.06
0.04
0.02
DIFFERENTIAL
PHASE
(
D
EGREE
S
)
0
100
200 300
400 500
600
700 800 900 1000
LOAD RESISTANCE (
)
V
SUPPLY
=
8V
V
SUPPLY
=
10V
V
SUPPLY
=
15V
0.04
0.03
0.02
0.01
0
G
A
IN FLATNESS (
dB)
0
1M
2M
3M
4M
5M
6M
7M
8M
9M 10M
FREQUENCY (Hz)
R
L
= 75
R
L
= 150
R
L
= 500
R
L
= 1000
80
75
70
65
GAIN BAN
DWIDTH
P
R
ODUCT
(MHz)
0
100 200
300
400
500 600
700 800
900 1000
LOAD RESISTANCE (
)
85
HA-2842
9
Die Characteristics
DIE DIMENSIONS:
77 mils x 81 mils x 19 mils
1960
m x 2060
m x 483
m
METALLIZATION:
Type: Aluminum, 1% Copper
Thickness: 16k
2k
PASSIVATION:
Type: Nitride over Silox
Silox Thickness: 12k
2k
Nitride thickness: 3.5k
1k
SUBSTRATE POTENTIAL (POWERED UP):
V-
TRANSISTOR COUNT:
58
PROCESS:
High Frequency Bipolar Dielectric Isolation
Metallization Mask Layout
HA-2842
V+
OUT
BAL
BAL
-IN
+IN
V-
COMP
HA-2842
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
HA-2842
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
NOTES:
1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension "E" does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width "B", as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15
(JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
8
8
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
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