1
Description
The HC4P5509A1R3060 telephone Subscriber Line
Interface Circuit integrates most of the BORSCHT functions
on a monolithic IC. The device is manufactured in a
Dielectric Isolation (DI) process and is designed for use as a
high voltage interface between the traditional telephone
subscriber pair (Tip and Ring) and the low voltage filtering
and coding/decoding functions of the line card. Together with
a secondary protection diode bridge and "feed" resistors, the
device will withstand 1000V lightning induced surges, in
plastic packages. The SLIC also maintains specified
transmission performance in the presence of externally
induced longitudinal currents. The BORSCHT functions that
the SLIC provides are:
Battery Feed with Subscriber Loop Current Limiting
Overvoltage Protection
Ring Relay Driver
Supervisory Signaling Functions
Hybrid Functions (with External Op Amp)
Test (or Battery Reversal) Relay Driver
In addition, the SLIC provides selective denial of power to
subscriber loops, a programmable subscriber loop current
limit from 20mA to 60mA, a thermal shutdown with an alarm
output and line fault protection. Switch hook detection, ring
trip detection and ground key detection functions are also
incorporated in the SLIC device.
The HC4P5509A1R3060 SLIC is ideally suited for line card
designs in PBX and CO systems, replacing traditional
transformer solutions.
Ordering Information
PART NUMBER
TEMP.
RANGE (
o
C)
PACKAGE
PKG.
NO.
HC4P5509A1R3060
0 to 75
28 Ld PLCC
N28.45
June 1997
HC5509A1R3060
SLIC
Subscriber Line Interface Circuit
Features
DI Monolithic High Voltage Process
Compatible with Worldwide PBX and CO Performance
Requirements
Controlled Supply of Battery Feed Current with
Programmable Current Limit
Operates with 5V Positive Supply (V
B+
)
Internal Ring Relay Driver and a Utility Relay Driver
High Impedance Mode for Subscriber Loop
High Temperature Alarm Output
Low Power Consumption During Standby Functions
Switch Hook, Ground Key, and Ring Trip Detection
Selective Power Denial to Subscriber
Voice Path Active During Power Denial
On Chip Op Amp for 2-Wire Impedance Matching
Applications
Solid State Line Interface Circuit for PBX or Central
Office Systems, Digital Loop Carrier Systems
Hotel/Motel Switching Systems
Direct Inward Dialing (DID) Trunks
Voice Messaging PBXs
High Voltage 2-Wire/4-Wire, 4-Wire/2-Wire Hybrid
Related Literature
- AN9607, Impedance Matching Design Equations
- AN9628, AC Voltage Gain
- AN9608, Implementing Pulse Metering
- AN549, The HC-5502S/4X Telephone Subscriber
Line Interface Circuits (SLIC)
File Number
3675.3
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
Intersil Corporation 1999
2
HC5509A1R3060
Absolute Maximum Ratings
T
A
= 25
o
C
Thermal Information
Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +15V
Maximum Supply Voltages
(V
B+
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V
(V
B+
)-(V
B-
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +75V
Junction Temperature Plastic . . . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . 300
o
C
Operating Conditions
Operating Temperature Range
HC4P5509A1R3060 . . . . . . . . . . . . . . . . . . . . . . . . . .0
o
C to 75
o
C
Storage Temperature Range . . . . . . . . . . . . . . . . . . -65
o
C to 150
o
C
Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to +12V
Positive Power Supply (V
B+
) . . . . . . . . . . . . . . . . . . . . . . . +5V
5%
Negative Power Supply (V
B-
) . . . . . . . . . . . . . . . . . . . . -42V to -58V
Loop Resistance (R
L
) . . . . . . . . . . . . . . . . . 200
to 1750
(Note 2)
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
67
Die Characteristics
Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 x 120
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connected
Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
JA
is measured with the component mounted on an evaluation PC board in free air.
2. May be extended to 1900
with application circuit.
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at T
A
= 25
o
C, Min-Max Parameters are over Oper-
ating Temperature Range, V
B-
= -48V, V
B+
= +5V, AG = BG = 0V. All AC Parameters are specified at
600
2-Wire terminating impedance.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
AC TRANSMISSION PARAMETERS
RX Input Impedance
300Hz to 3.4kHz (Note 3)
-
100
-
k
TX Output Impedance
300Hz to 3.4kHz (Note 3)
-
-
20
4-Wire Input Overload Level
300Hz to 3.4kHz R
L
= 1200
,
600
Reference
+1.5
-
-
V
PEAK
2-Wire Return Loss
Matched for 600
(Note 3)
SRL LO
26
35
-
dB
ERL
30
40
-
dB
SRL HI
30
40
-
dB
2-Wire Longitudinal to Metallic Balance
Off Hook
Per ANSI/IEEE STD 455-1976 (Note 3) 300Hz
to 3400Hz
58
63
-
dB
4-Wire Longitudinal Balance
Off Hook
300Hz to 3400Hz (Note 3)
50
55
-
dB
Low Frequency Longitudinal Balance
R.E.A. Test Circuit
-
-
-67
dBmp
I
LINE
= 40mA T
A
= 25
o
C (Note 3)
-
-
23
dBrnC
Longitudinal Current Capability
I
LINE
= 40mA T
A
= 25
o
C (Note 3)
-
-
30
mA
RMS
Insertion Loss
0dBm at 1kHz, Referenced 600
2-Wire/4-Wire
-6.22
-6.02
-5.82
dB
4-Wire/2-Wire
-
0.05
0.2
dB
4-Wire/4-Wire
-6.22
-6.02
-5.82
dB
3
HC5509A1R3060
Frequency Response
300Hz to 3400Hz (Note 3)
Referenced to Absolute Level at 1kHz,
0dBm Referenced 600
-
0.02
0.05
dB
Level Linearity
Referenced to -10dBm (Note 3)
2-Wire to 4-Wire and 4-Wire to 2-Wire
+3 to -40dBm
-
-
0.05
dB
-40 to -50dBm
-
-
0.1
dB
-50 to -55dBm
-
-
0.3
dB
Absolute Delay
(Note 3)
2-Wire/4-Wire
f
IN
- 1kHz
-
0.7
1.2
s
4-Wire/2-Wire
f
IN
- 1kHz
-
0.3
1.0
s
4-Wire/4-Wire
f
IN
- 1kHz
-
1.5
2.0
s
Transhybrid Loss
V
IN
= 1V
P-P
at 1kHz (Note 3)
32
40
-
dB
Total Harmonic Distortion
2-Wire/4-Wire, 4-Wire/2-Wire, 4-Wire/4-Wire
Reference Level 0dBm at 600
300Hz to 3400Hz (Note 3)
-
-
-52
dB
Idle Channel Noise
2-Wire and 4-Wire
C-Message (Note 3)
-
-
5
dBrnC
Psophometric
-
-
-85
dBmp
3kHz Flat
-
-
15
dBrn
Power Supply Rejection Ratio
(Note 3)
30Hz to 200Hz, R
L
= 600
V
B+
to 2-Wire
25
29
-
dB
V
B+
to 4-Wire
25
29
-
dB
V
B-
to 2-Wire
25
29
-
dB
V
B-
to 4-Wire
25
29
-
dB
V
B+
to 4-Wire
(Note 3)
200Hz to 16kHz, R
L
= 600
25
-
-
dB
V
B+
to 2-Wire
25
-
-
dB
V
B-
to 4-Wire
25
25
-
dB
V
B-
to 2-Wire
25
25
-
dB
Ring Sync Pulse Width
50
-
500
s
DC PARAMETERS
Loop Current Programming
Limit Range
(Note 4)
20
(Note 4)
-
60
mA
Accuracy
10
-
-
%
Loop Current During Power Denial
R
L
= 200
-
3
5
mA
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at T
A
= 25
o
C, Min-Max Parameters are over Oper-
ating Temperature Range, V
B-
= -48V, V
B+
= +5V, AG = BG = 0V. All AC Parameters are specified at
600
2-Wire terminating impedance. (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
4
HC5509A1R3060
Fault Currents
TIP to Ground
-
38
45
mA
RING to Ground
-
54
60
mA
TIP and RING to Ground
-
85
95
mA
Switch Hook Detection Threshold
-
12
15
mA
Ground Key Detection Threshold
9.5
13.5
17.5
mA
Thermal ALARM Output
Safe Operating Die Temperature Exceeded
140
-
160
o
C
Ring Trip Comparator Threshold
See Typical Applications for more information
9.5
13.5
17.5
mA
Dial Pulse Distortion
-
0.1
0.5
ms
Relay Driver Outputs
On Voltage V
OL
I
OL
(PR) = 60mA, I
OL
(RD) = 60mA
-
0.2
0.5
V
Off Leakage Current
V
OH
= 13.2V
-
10
100
A
TTL/CMOS Logic Inputs (RC, PD, RS, TST,
PRI)
Logic `0' V
IL
-
-
0.8
V
Logic `1' V
IH
2.0
-
5.5
V
Input Current (RC, PD, RS, TST, PRI)
0V
V
IN
5V
-
-
100
A
Logic Outputs
Logic `0' V
OL
I
LOAD
= 800
A
-
0.1
0.5
V
Logic `1' V
OH
I
LOAD
= 40
A
2.7
-
-
V
Power Dissipation On Hook
Relay Drivers Off
-
200
-
mW
I
B+
V
B+
= +5.25V, V
B-
= -58V, R
LOOP
=
-
-
6
mA
I
B-
V
B+
= +5.25V, V
B
- = -58V, R
LOOP
=
-6
-
-
mA
UNCOMMITTED OP AMP PARAMETERS
Input Offset Voltage
-
5
-
mV
Input Offset Current
-
10
-
nA
Differential Input Resistance
(Note 2)
-
1
-
M
Output Voltage Swing
R
L
= 10k
-
3
-
V
P-P
Small Signal GBW
-
1
-
MHz
NOTES:
3. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Func-
tional operability under any of these conditions is not necessarily implied.
4. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon
initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and spec-
ification compliance.
5. Application limitation based on maximum switch hook detect limit and metallic currents. Not a part limitation.
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at T
A
= 25
o
C, Min-Max Parameters are over Oper-
ating Temperature Range, V
B-
= -48V, V
B+
= +5V, AG = BG = 0V. All AC Parameters are specified at
600
2-Wire terminating impedance. (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
5
HC5509A1R3060
Pin Descriptions
SOIC
SYMBOL
DESCRIPTION
1
AG
Analog Ground - To be connected to zero potential. Serves as a reference for the transmit output and re-
ceive input terminals.
2
VB+
Positive Voltage Source - Most Positive Supply.
3
C1
Capacitor #C1 - An external capacitor to be connected between this terminal and analog ground. Required
for proper operation of the loop current limiting function.
4
PD
Power Denial - A low active TTL-compatible logic input. When enabled, the output of the ring amplifier will
ramp to close to the output voltage of the tip amplifier.
5
RC
Ring Command - A low active TTL-compatible logic input. When enabled, the relay driver (RD) output goes
low on the next high level of the ring sync (RS) input, as long as the SLIC is not in the power down mode
(TST = 0) or the subscriber is not already off-hook (SHD = 0).
6
RS
Ring Synchronization Input - A TTL - compatible clock input. The clock is arranged such that a positive
pulse (50 - 500
s) occurs on the zero crossing of the ring voltage source, as it appears at the RFS terminal.
For Tip side injected systems, the RS pulse should occur on the negative going zero crossing and for Ring
injected systems, on the positive going zero crossing. This ensures that the ring relay activates and deac-
tivates when the instantaneous ring voltage is near zero. If synchronization is not required, the pin should
be tied to +5.
7
SHD
Switch Hook Detection - An active low LS TTL compatible logic output. A line supervisory output.
8
GKD
Ground Key Detection - An active low LS TTL compatible logic output. A line supervisory output.
9
TST
A TTL logic input. A low on this pin will keep the SLIC in a power down mode. The TST pin in conjunction
with the ALM pin can provide thermal shutdown protection for the SLIC. Thermal shutdown is implemented
by a system controller that monitors the ALM pin. When the ALM pin is active (low) the system controller
issues a command to the Test pin (low) to power down the SLIC. The timing of the thermal recovery is con-
trolled by the system controller.
10
ALM
A TTL compatible active low output which responds to the thermal detector circuit when a safe operating
die temperature has been exceeded. Reference the TST pin description for a method to reduce prolonged
thermal overstress that may reduce component life.
11
ILMT
Loop Current Limit - Voltage on this pin sets the short loop current limiting conditions using a resistive volt-
age divider.
12
OUT1
The analog output of the spare operational amplifier.
13
-IN1
The inverting analog input of the spare operational amplifier.
14
TIP
An analog input connected to the TIP (more positive) side of the subscriber loop through a feed resistor
and ring relay contact. Functions with the RING terminal to receive voice signals from the telephone and
for loop monitoring purpose.
15
RING
An analog input connected to the RING (more negative) side of the subscriber loop through a feed resistor.
Functions with the TIP terminal to receive voice signals from the telephone and for loop monitoring purposes.
16
RFS
Ring Feed Sense - Senses RING side of the loop for Ground Key Detection. During Ring injected ringing
the ring signal at this node is isolated from RF via the ring relay. For Tip injected ringing, the RF and RFS
pins must be shorted.
17
VRX
Receive Input, 4-Wire Side - A high impedance analog input. AC signals appearing at this input drive the
Tip Feed and Ring Feed amplifiers differentially.
18
LAO
Longitudinal Amplifier Output - A low impedance output to be connected to C2 through a low pass filter.
Output is proportional to the difference in I
TIP
and I
RING
.
6
HC5509A1R3060
Pinout
HC4P5509A1R3060 (PLCC)
TOP VIEW
19
VTX
Transmit Output, 4-Wire Side - A low impedance analog output which represents the differential voltage
across TIP and RING. Transhybrid balancing must be performed beyond this output to completely imple-
ment two to four wire conversion. This output is referenced to analog ground. Since the DC level of this
output varies with loop current, capacitive coupling to the next stage is necessary.
20
PRI
A TTL compatible input used to control PR. PRI active High = PR active low.
21
PR
An active low open collector output. Can be used to drive a Polarity Reversal Relay.
22
BG
Battery Ground - Tube connected to zero potential. All loop current and some quiescent current flows into
this terminal.
23
RD
Ring Relay Driver - An active low open collector output. Used to drive a relay that switches ringing signals
onto the 2-Wire line.
24
VFB
Feedback input to the tip feed amplifier; may be used in conjunction with transmit output signal and the
spare op amp to accommodate 2-Wire line impedance matching.
25
TF
Tip Feed - A low impedance analog output connected to the TIP terminal through a feed resistor. Functions
with the RF terminal to provide loop current, and to feed voice signals to the telephone set and to sink lon-
gitudinal currents.
26
RF
Ring Feed - A low impedance analog output connected to the RING terminal through a feed resistor. Func-
tions with the TF terminal to provide loop current, feed voice signals to the telephone set, and to sink lon-
gitudinal currents.
27
VB-
The battery voltage source. The most negative supply.
28
C2
Capacitor #2 - An external capacitor to be connected between this terminal and ground. It prevents false
ring trip detection from occurring when longitudinal currents are induced onto the subscriber loop from pow-
er lines and other noise sources. This capacitor should be nonpolarized.
Pin Descriptions
(Continued)
SOIC
SYMBOL
DESCRIPTION
TIP
RING
RFS
VRX
LA
O
OUT1
-IN1
VB+
AG
C2
VB-
RF
PD
C1
VFB
RD
BG
PR
TF
VTX
PRI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
RS
SHD
GKD
TST
RC
ILMT
ALM
7
HC5509A1R3060
Functional Diagram
PLCC
R
R
C1
+
R
VRX
OUT 1
2R
R/2
TIP
+
TA
R
2R
2R
R
+
90K
RING
RFS
+
LA
4.5K
25K
25K
100K
100K
4.5K
90K
RF
25
17
12
RF1
TF
14
RF
15
16
26
3
SHD
FAULT
DET
OP AMP
+
VFB
VTX
+
RTD
GKD
GM
28
11
RF2
BIAS
NETWORK
AG
VB+
IIL LOGIC INTERF
A
C
E
TSD
GK
RFC
SW
RC
PD
RS
PRI
PR
ALM
GKD
SHD
RD
TST
VB-
REF
VB/2
-IN 1
13
24
19
2
1
TF
BG
22
27
4
5
6
9
20
21
23
7
8
10
THERM
LTD
R = 108k
R
R
100K
100K
90K
18
C2
LAO
ILMT
Overvoltage Protection and Longitudinal
Current Protection
The SLIC device, in conjunction with an external protection
bridge, will withstand high voltage lightning surges and
power line crosses.
High voltage surge conditions are as specified in Table 1.
The SLIC will withstand longitudinal currents up to a
maximum or 30mA
RMS
, 15mA
RMS
per leg, without any
performance degradation.
.
TABLE 1.
PARAMETER
TEST
CONDITION
PERFORMANCE
(MAX)
UNITS
Longitudinal
Surge
10
s Rise/
1000 (Plastic)
V
PEAK
1000
s Fall
Metallic Surge
10
s Rise/
1000 (Plastic)
V
PEAK
1000
s Fall
T/GND
10
s Rise/
1000 (Plastic)
V
PEAK
R/GND
1000
s Fall
50/60Hz Current
T/GND
11 Cycles
700 (Plastic)
V
RMS
R/GND
Limited to
10A
RMS
8
HC5509A1R3060
Logic Diagram
NOTE:
PRI and PD are independent switch driven by TTL input levels.
RD
GKD
SH
TST
RC
GK
RS
I
2
L TO TTL
KEY
A
B
C
INJ
A
B
C
RELAY
DRIVER
TTL TO I
2
L
PD = 0, I
PD
= ACTIVE
SHD
BN
ALM
TSD
PD
I
PD
9
HC5509A1R3060
Applications Diagram
FIGURE 1. TYPICAL LINE CIRCUIT APPLICATION WITH THE MONOLITHIC SLIC
SYSTEM CONTROLLER
SLIC
HC4P5509A1R3060
SHD GKD PRI
RS
TST
PD
ALM
RC
RD
PR
TIP
TF
RF
RFS
RING
VB-
BG
C2
AG
VB+
C1
LAO
OUT1
-IN1
VTX
VFB
VRX+
I
LIMIT
K
1
K
2
R
S1
C
S1
K
1A
SECONDARY
PROTECTION
R
B1
R
B2
VB-
C
5
K
1B
R
S2
C
S2
R
B4
V
RING
150V
PEAK
(MAX)
R
B3
PTC
Z
1
RING
TIP
PRIMARY
PROTECTION
C
3
C
F2
C
4
+5V
R
F2
R
F1
C
F1
TO HYBRID
BALANCE
NETWORK
KZ
0
KR
F
C
AC
R
L2
FROM PCM
FILTER/CODER
R
L1
(NOTE)
NOTE: Secondary protection diode
bridge recommended is 3A,
200V type.
TYPICAL COMPONENT VALUES
C
1
= 0.5
F, 30V
R
F1
= R
F2
= 210k
, 1%
C
F1
= C
F2
= 0.22
F, 10%, 20V Nonpolarized
C
3
= 0.01
F, 100V,
20%
C
4
= 0.01
F, 100V,
20%
C
5
= 0.01
F, 100V,
20%
C
AC
= 0.5
F, 20V
KZ
0
= 30k
, (Z
0
= 600
)
R
L1
, R
L2
; Current Limit Setting Resistors:
I
LIMIT
= (0.6) (R
L1
+ R
L2
)/(200 x R
L2
), R
L1
typically 100k
KR
F
= 20k
R
B1
= R
B2
= R
B3
= R
B4
= 50
0.1% absolute matching
R
S1
= R
S2
= 1k
typically
C
S1
= C
S2
= 0.1
F, 200V typically, depending on V
Ring
and
line length.
Z
1
= 150V to 200V transient protector. PTC used as ring
generator ballast.
NOTES:
1. All grounds (AG, BG) must be applied before V
B
+ or V
B
-. Failure to do so may result in premature failure of the part. If a user wishes to
run separate grounds off a line card, the AG must be applied first.
2. Application shows Ring Injected Ringing, a Balanced or Tip injected configuration may be used.
10
HC5509A1R3060
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allow-
able mold protrusion is 0.010 inch (0.25mm) per side.
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. "N" is the number of terminal positions.
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW "A"
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
L
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW "A" TYP.
0.004 (0.10)
C
-C-
D2/E2
C
L
-C-
Plastic Leaded Chip Carrier Packages (PLCC)
N28.45
(JEDEC MS-018AB ISSUE A)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.485
0.495
12.32
12.57
-
D1
0.450
0.456
11.43
11.58
3
D2
0.191
0.219
4.86
5.56
4, 5
E
0.485
0.495
12.32
12.57
-
E1
0.450
0.456
11.43
11.58
3
E2
0.191
0.219
4.86
5.56
4, 5
N
28
28
6
Rev. 1 3/95
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