February 2003

HIP4080A

80V/2.5A Peak, High Frequency Full Bridge
FET Driver

The HIP4080A is a high frequency, medium voltage Full
Bridge N-Channel FET driver IC, available in 20 lead plastic
SOIC and DIP packages. The HIP4080A includes an input
comparator, used to facilitate the "hysteresis" and PWM
modes of operation. Its HEN (high enable) lead can force
current to freewheel in the bottom two external power
MOSFETs, maintaining the upper power MOSFETs off.
Since it can switch at frequencies up to 1MHz, the HIP4080A
is well suited for driving Voice Coil Motors, switching power
amplifiers and power supplies.

HIP4080A can also drive medium voltage brush motors, and
two HIP4080As can be used to drive high performance
stepper motors, since the short minimum "on-time" can
provide fine micro-stepping capability.

Short propagation delays of approximately 55ns maximizes
control loop crossover frequencies and dead-times which
can be adjusted to near zero to minimize distortion, resulting
in precise control of the driven load.

The similar HIP4081A IC allows independent control of all 4
FETs in an Full Bridge configuration.

The Application Note for the HIP4080A is AN9404.

Features

· Drives N-Channel FET Full Bridge Including High Side

Chop Capability

· Bootstrap Supply Max Voltage to 95VDC

· Drives 1000pF Load at 1MHz in Free Air at +50

C with

Rise and Fall Times of Typically 10ns

· User-Programmable Dead Time

· Charge-Pump and Bootstrap Maintain Upper Bias

Supplies

· DIS (Disable) Pin Pulls Gates Low

· Input Logic Thresholds Compatible with 5V to 15V Logic

Levels

· Very Low Power Consumption

· Undervoltage Protection

Applications

· Medium/Large Voice Coil Motors

· Full Bridge Power Supplies

· Switching Power Amplifiers

· High Performance Motor Controls

· Noise Cancellation Systems

· Battery Powered Vehicles

· Peripherals

· U.P.S.

Pinout

Ordering Information

PART

NUMBER

TEMPERATURE

RANGE

PACKAGE

HIP4080AIP

-40

C to +85

20 Lead Plastic DIP

HIP4080AIB -40

C to +85

20 Lead Plastic SOIC (W)

BHB

HEN

DIS

OUT

IN+

HDEL

IN-

LDEL

AHB

BHO

BLO

BLS

BHS

ALS

ALO

AHS

AHO

HIP4080A

(PDIP, SOIC)

TOP VIEW

Data Sheet

FN3658.5

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 321-724-7143

Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

HIP4080A

Absolute Maximum Ratings

Thermal Information

Supply Voltage, V

and V

. . . . . . . . . . . . . . . . . . . . -0.3V to 16V

Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V

+0.3V

Voltage on AHS, BHS. . . . -6.0V (Transient) to 80V (25

C to 125

Voltage on AHS, BHS. . . . -6.0V (Transient) to 70V (-55

C to 125

Voltage on ALS, BLS . . . . . . . -2.0V (Transient) to +2.0V (Transient)
Voltage on AHB, BHB. . . . . . . . . V

AHS, BHS

-0.3V to V

AHS, BHS

Voltage on ALO, BLO . . . . . . . . . . . . . .V

ALS, BLS

-0.3V to V

+0.3V

Voltage on AHO, BHO . . . . . . . .V

AHS, BHS

-0.3V to V

AHB, BHB

+0.3V

Input Current, HDEL and LDEL . . . . . . . . . . . . . . . . . . -5mA to 0mA
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
NOTE: All Voltages relative to V

, unless otherwise specified.

Thermal Resistance

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +85

C/W

DIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +75

C/W

Maximum Power Dissipation at +85

SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470mW
DIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530mW

Storage Temperature Range. . . . . . . . . . . . . . . . . . -65

C to +150

Operating Max. Junction Temperature . . . . . . . . . . . . . . . . . +125

Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300

(For SOIC - Lead Tips Only)

Operating Conditions

Supply Voltage, V

and V

. . . . . . . . . . . . . . . . . . +9.5V to +15V

Voltage on ALS, BLS . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +1.0V
Voltage on AHB, BHB. . . . . . . . . . V

AHS, BHS

+5V to V

AHS, BHS

+15V

Input Current, HDEL and LDEL . . . . . . . . . . . . . . . .-500

A to -50

Operating Ambient Temperature Range . . . . . . . . . -40

C to +85

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Electrical Specifications

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

= 100K, and

= +25

C, Unless Otherwise Specified

PARAMETERS

SYMBOL

TEST CONDITIONS

= +25

= - 40

TO +125

UNITS

MIN

TYP

MAX

MIN

MAX

SUPPLY CURRENTS AND CHARGE PUMPS

Quiescent Current

IN- = 2.5V, Other Inputs = 0V

Operating Current

DDO

Outputs switching f = 500kHz, No Load

Quiescent Current

IN- = 2.5V, Other Inputs = 0V,
I

ALO

= I

BLO

= 0

100

Operating Current

CCO

f = 500kHz, No Load

1.25

2.0

0.8

AHB, BHB Quiescent Current -
Qpump Output Current

AHB

, I

BHB

IN- = 2.5V, Other Inputs = 0V, I

AHO

BHO

= 0, V

= V

AHB

= V

BHB

= 10V

-50

-25

-11

-60

-10

AHB, BHB Operating Current

AHBO

, I

BHBO

f = 500kHz, No Load

0.62

1.2

1.5

0.5

1.9

AHS, BHS, AHB, BHB Leakage Current

HLK

BHS

= V

AHS

= 80V,

AHB

= V

BHB

= 93V

0.02

1.0

AHB-AHS, BHB-BHS Qpump
Output Voltage

AHB

- V

AHS

BHB

- V

BHS

AHB

= I

AHB

= 0, No Load

11.5

12.6

14.0

10.5

14.5

INPUT COMPARATOR PINS: IN+, IN-, OUT

Offset Voltage

Over Common Mode Voltage Range

-10

+10

-15

+15

Input Bias Current

0.5

Input Offset Current

-1

-2

Input Common Mode Voltage Range

CMVR

-1.5

Voltage Gain

AVOL

V/mV

OUT High Level Output Voltage

IN+ > IN-, I

= -250

-0.4

- 0.5

OUT Low Level Output Voltage

IN+ < IN-, I

= +250

0.4

0.5

Low Level Output Current

OUT

= 6V

6.5

High Level Output Current

OUT

= 6V

-17

-10

-3

-20

-2.5

HIP4080A

HIP4080A

INPUT PINS: DIS

Low Level Input Voltage

Full Operating Conditions

1.0

0.8

High Level Input Voltage

Full Operating Conditions

2.5

2.7

Input Voltage Hysteresis

Low Level Input Current

= 0V, Full Operating Conditions

-130

-100

-75

-135

-65

High Level Input Current

= 5V, Full Operating Conditions

-1

-10

+10

INPUT PINS: HEN

Low Level Input Voltage

Full Operating Conditions

1.0

0.8

High Level Input Voltage

Full Operating Conditions

2.5

2.7

Input Voltage Hysteresis

Low Level Input Current

= 0V, Full Operating Conditions

-260

-200

-150

-270

-130

High Level Input Current

= 5V, Full Operating Conditions

-1

-10

+10

TURN-ON DELAY PINS: LDEL AND HDEL

LDEL, HDEL Voltage

HDEL,

HDEL

= I

LDEL

= -100

4.9

5.1

5.3

4.8

5.4

GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, AND BHO

Low Level Output Voltage

OUT

= 100mA

0.7

0.85

1.0

0.5

1.1

High Level Output Voltage

- V

OUT

= -100mA

0.8

0.95

1.1

0.5

1.2

Peak Pullup Current

OUT

= 0V

1.7

2.6

3.8

1.4

4.1

Peak Pulldown Current

OUT

= 12V

1.7

2.4

3.3

1.3

3.6

Under Voltage, Rising Threshold

UV+

8.1

8.8

9.4

8.0

9.5

Under Voltage, Falling Threshold

UV-

7.6

8.3

8.9

7.5

9.0

Under Voltage, Hysteresis

HYS

0.25

0.4

0.65

0.2

0.7

Electrical Specifications

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

= 100K, and

= +25

C, Unless Otherwise Specified (Continued)

PARAMETERS

SYMBOL

TEST CONDITIONS

= +25

= - 40

TO +125

UNITS

MIN

TYP

MAX

MIN

MAX

Switching Specifications

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

= 10K,

= 1000pF, and T

= +25

C, Unless Otherwise Specified

PARAMETERS

SYMBOL

TEST CONDITIONS

= +25

= - 40

TO +125

UNITS

MIN

TYP

MAX

MIN

MAX

Lower Turn-off Propagation Delay (IN+/IN- to ALO/BLO)

LPHL

Upper Turn-off Propagation Delay (IN+/IN- to AHO/BHO)

HPHL

110

Lower Turn-on Propagation Delay (IN+/IN- to ALO/BLO)

LPLH

Upper Turn-on Propagation Delay (IN+/IN- to AHO/BHO)

HPLH

110

140

Rise Time

Fall Time

Turn-on Input Pulse Width

PWIN-ON

Turn-off Input Pulse Width

PWIN-OFF

Disable Turn-off Propagation Delay
(DIS - Lower Outputs)

DISLOW

Disable Turn-off Propagation Delay
(DIS - Upper Outputs)

DISHIGH

105

Disable to Lower Turn-on Propagation Delay
(DIS - ALO and BLO)

DLPLH

Refresh Pulse Width (ALO and BLO)

REF-PW

240

380

500

200

600

Disable to Upper Enable (DIS - AHO and BHO)

UEN

480

630

750

HEN-AHO, BHO Turn-off, Propagation Delay

HEN-PHL

HDEL

= R

LDEL

= 10K

HEN-AHO, BHO Turn-on, Propagation Delay

HEN-PLH

HDEL

= R

LDEL

= 10K

110

Switching Specifications

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

= 10K,

= 1000pF, and T

= +25

C, Unless Otherwise Specified (Continued)

PARAMETERS

SYMBOL

TEST CONDITIONS

= +25

= - 40

TO +125

UNITS

MIN

TYP

MAX

MIN

MAX

TRUTH TABLE

INPUT

OUTPUT

IN+ > IN-

HEN

U/V

DIS

ALO

AHO

BLO

BHO

HIP4080A

Pin Descriptions

PIN

NUMBER

SYMBOL

DESCRIPTION

BHB

B High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30

A out of this pin to

maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.

HEN

High-side Enable input. Logic level input that when low overrides IN+/IN- (Pins 6 and 7) to put AHO and BHO drivers
(Pins 11 and 20) in low output state. When HEN is high AHO and BHO are controlled by IN+/IN- inputs. The pin can
be driven by signal levels of 0V to 15V (no greater than V

DIS

DISable input. Logic level input that when taken high sets all four outputs low. DIS high overrides all other inputs. When
DIS is taken low the outputs are controlled by the other inputs. The pin can be driven by signal levels of 0V to 15V (no
greater than V

Chip negative supply, generally will be ground.

OUT

OUTput of the input control comparator. This output can be used for feedback and hysteresis.

IN+

Noninverting input of control comparator. If IN+ is greater than IN- (Pin 7) then ALO and BHO are low level outputs
and BLO and AHO are high level outputs. If IN+ is less than IN- then ALO and BHO are high level outputs and BLO
and AHO are low level outputs. DIS (Pin 3) high level will override IN+/IN- control for all outputs. HEN (Pin 2) low level
will override IN+/IN- control of AHO and BHO. When switching in four quadrant mode, dead time in a half bridge leg
is controlled by HDEL and LDEL (Pins 8 and 9).

IN-

Inverting input of control comparator. See IN+ (Pin 6) description.

HDEL

High-side turn-on DELay. Connect resistor from this pin to V

to set timing current that defines the turn-on delay of

both high-side drivers. The low-side drivers turn-off with no adjustable delay, so the HDEL resistor guarantees no
shoot-through by delaying the turn-on of the high-side drivers. HDEL reference voltage is approximately 5.1V.

LDEL

Low-side turn-on DELay. Connect resistor from this pin to V

to set timing current that defines the turn-on delay of

both low-side drivers. The high-side drivers turn-off with no adjustable delay, so the LDEL resistor guarantees no
shoot-through by delaying the turn-on of the low-side drivers. LDEL reference voltage is approximately 5.1V.

AHB

A High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30

A out of this pin to

maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.

AHO

A High-side Output. Connect to gate of A High-side power MOSFET.

AHS

A High-side Source connection. Connect to source of A High-side power MOSFET. Connect negative side of bootstrap
capacitor to this pin.

ALO

A Low-side Output. Connect to gate of A Low-side power MOSFET.

ALS

A Low-side Source connection. Connect to source of A Low-side power MOSFET.

Positive supply to gate drivers. Must be same potential as V

(Pin 16). Connect to anodes of two bootstrap diodes.

Positive supply to lower gate drivers. Must be same potential as V

(Pin 15). De-couple this pin to V

(Pin 4).

BLS

B Low-side Source connection. Connect to source of B Low-side power MOSFET.

BLO

B Low-side Output. Connect to gate of B Low-side power MOSFET.

BHS

B High-side Source connection. Connect to source of B High-side power MOSFET. Connect negative side of bootstrap
capacitor to this pin.

BHO

B High-side Output. Connect to gate of B High-side power MOSFET.

HIP4080A

HIP4080A

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

100K, and T

= +25

C, Unless Otherwise Specified

FIGURE 4. QUIESCENT I

SUPPLY CURRENT vs V

SUPPLY VOLTAGE

FIGURE 5. I

DDO

NO-LOAD I

SUPPLY CURRENT vs FRE-

QUENCY (kHz)

FIGURE 6. SIDE A, B FLOATING SUPPLY BIAS CURRENT vs

FREQUENCY (LOAD = 1000pF)

FIGURE 7. I

CCO

, NO-LOAD I

SUPPLY CURRENT vs FRE-

QUENCY (kHz) TEMPERATURE

FIGURE 8. I

AHB

, I

BHB

NO-LOAD FLOATING SUPPLY BIAS

CURRENT vs FREQUENCY

FIGURE 9. COMPARATOR INPUT CURRENT I

vs TEMPERA-

TURE AT V

= 5 V

2.0

4.0

6.0

8.0

10.0

12.0

14.0

SUP

RRE

(mA

)

SUPPLY VOLTAGE (V)

12.5

12.0

11.5

11.0

10.5

200

400

600

800

1000

PPL

CURRENT (mA)

SWITCHING FREQUENCY (kHz)

100

200

300

400

500

600

700

800

900 1000

0.0

5.0

10.0

15.0

20.0

TING S

PPL

BIAS

CURRENT (

SWITCHING FREQUENCY (kHz)

100

200

300

400

500

600

700

800

900 1000

0.0

1.0

2.0

3.0

4.0

5.0

SUP

RRE

(mA)

SWITCHING FREQUENCY (kHz)

+75

+25

+125

-40

0.5

1.5

2.5

200

600

800

1000

400

TIN

PPL

BIAS

CURRENT

SWITCHING FREQUENCY (kHz)

-40

-20

100

120

0.5

1.0

COMP

ARA

R IN

CURRENT

(

JUNCTION TEMPERATURE (

HIP4080A

FIGURE 10. DIS LOW LEVEL INPUT CURRENT I

vs TEMPERA-

TURE

FIGURE 11. HEN LOW LEVEL INPUT CURRENT I

vs TEMPER-

ATURE

FIGURE 12. AHB - AHS, BHB - BHS NO-LOAD CHARGE PUMP

VOLTAGE vs TEMPERATURE

FIGURE 13. UPPER DISABLE TURN-OFF PROPAGATION

DELAY T

DISHIGH

vs TEMPERATURE

FIGURE 14. DISABLE TO UPPER ENABLE T

UEN

PROPAGATION

DELAY vs TEMPERATURE

FIGURE 15. LOWER DISABLE TURN-OFF PROPAGATION

DELAY T

DISLOW

vs TEMPERATURE

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

100K, and T

= +25

C, Unless Otherwise Specified (Continued)

-50

-25

100

125

-120

-110

-100

-90

W LEVEL INPUT

RREN

(

JUNCTION TEMPERATURE (

-40

-20

100

120

-230

-220

-210

-200

-190

-180

W LEVEL I

CURRENT

(

JUNCTION TEMPERATURE (

-40

-20

100

120

10.0

11.0

12.0

13.0

14.0

15.0

NO-LO

TING CHARGE

PUMP

(

)

JUNCTION TEMPERATURE (

-40

-20

100

120

ION DELA

Y (ns)

JUNCTION TEMPERATURE (

425

450

475

500

525

-50

-25

100

125

150

JUNCTION TEMPERATURE (

ION DELA

Y (ns)

-40

-20

100

120

N DEL

Y (n

JUNCTION TEMPERATURE (

HIP4080A

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

10K, and T

= +25

C, Unless Otherwise Specified

FIGURE 16. T

REF-PW

REFRESH PULSE WIDTH vs TEMPERA-

TURE

FIGURE 17. DISABLE TO LOWER ENABLE TDLPLH PROPAGA-

TION DELAY vs TEMPERATURE

FIGURE 18. UPPER TURN-OFF PROPAGATION DELAY T

HPHL

vs TEMPERATURE

FIGURE 19. UPPER TURN-ON PROPAGATION DELAY THPLH

vs TEMPERATURE

FIGURE 20. LOWER TURN-OFF PROPAGATION DELAY T

LPHL

vs TEMPERATURE

FIGURE 21. LOWER TURN-ON PROPAGATION DELAY T

LPLH

TEMPERATURE

350

375

400

425

450

-50

-25

100

125 150

H PULSE WIDTH (ns)

JUNCTION TEMPERATURE (

-40

-20

100

120

ION DELA

(
n

)

JUNCTION TEMPERATURE (

-40

-20

100

120

40.0

50.0

60.0

70.0

80.0

90.0

N D

(
n

JUNCTION TEMPERATURE (

-40

-20

100

120

40.0

50.0

60.0

70.0

80.0

90.0

N DEL

Y (n

JUNCTION TEMPERATURE (

-40

-20

100

120

40.0

50.0

60.0

70.0

80.0

90.0

N DEL

JUNCTION TEMPERATURE (

-40

-20

100

120

40.0

50.0

60.0

70.0

80.0

90.0

ION DELA

Y (ns)

JUNCTION TEMPERATURE (

HIP4080A

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

100K, and T

= +25

C, Unless Otherwise Specified

FIGURE 22. GATE DRIVE FALL TIME T

vs TEMPERATURE

FIGURE 23. GATE DRIVE RISE TIME T

vs TEMPERATURE

FIGURE 24. V

LDEL

, V

HDEL

VOLTAGE vs TEMPERATURE

FIGURE 25. HIGH LEVEL OUTPUT VOLTAGE, V

- V

vs BIAS

SUPPLY AND TEMPERATURE AT 100

FIGURE 26. LOW LEVEL OUTPUT VOLTAGE V

vs BIAS

SUPPLY AND TEMPERATURE AT 100

FIGURE 27. PEAK PULLDOWN CURRENT I

O-

BIAS SUPPLY

VOLTAGE

-40

-20

100

120

8.5

9.5

10.5

11.5

12.5

13.5

DRI

(
n

)

JUNCTION TEMPERATURE (

-40

-20

100

120

8.5

9.5

10.5

11.5

12.5

13.5

TURN-ON RISE

TIME

(ns

)

JUNCTION TEMPERATURE (

-40

-20

100

120

4.0

4.5

5.0

5.5

6.0

EL IN

T V

(
V

)

JUNCTION TEMPERATURE (

250

500

750

1000

1250

1500

- V

(mV

)

BIAS SUPPLY VOLTAGE (V)

+75

+25

+125

-40

250

500

750

1000

1250

1500

(mV)

BIAS SUPPLY VOLTAGE (V)

+75

+25

+125

-40

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TE DRIV

SINK CURR

(A)

, V

AHG

, V

BHB

(V)

HIP4080A

FIGURE 28. PEAK PULLUP CURRENT I

O+

vs SUPPLY VOLTAGE

FIGURE 29. LOW VOLTAGE BIAS CURRENT I

AND I

(LESS

QUIESCENT COMPONENT) vs FREQUENCY AND
GATE LOAD CAPACITANCE

FIGURE 30. HIGH VOLTAGE LEVEL-SHIFT CURRENT vs

FREQUENCY AND BUS VOLTAGE

FIGURE 31. UNDERVOLTAGE LOCKOUT vs TEMPERATURE

FIGURE 32. MINIMUM DEAD-TIME vs DEL RESISTANCE

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

100K, and T

= +25

C, Unless Otherwise Specified (Continued)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TE DRIVE

SINK CURRENT

(A)

, V

ABH

, V

BHB

(V)

100

1000

500

200

0.1

100

500

0.5

200

0.2

W V

GE BIAS

CUR

(mA)

SWITCHING FREQUENCY (kHz)

3,000

1,000

10,000

100

1000

200

500

100

1000

200

500

LEV

L-SHIFT CURRENT (

SWITCHING FREQUENCY (kHz)

8.2

8.4

8.6

8.8

100

125

150

UV+

UV-

TEMPERATURE (

BIAS

, V

(V)

100

150

200

250

120

150

HDEL/LDEL RESISTANCE (k

)

DEAD-TIME

(ns

)

HIP4080A

FIGURE 33. HIP4080A EVALUATION PC BOARD SCHEMATIC

R21

R22

R23

JMPR1

R24

R30

R31

R34

CR2

CR1

JMPR5

JMPR3

JMPR2

JMPR4

R33

B+

IN2

IN1

OUT/BLI

IN-/AHI

COM

IN+/ALI

+12V

BLS

HEN/BHI

ALS

CD4069UB

HIP4080A/81A

SECTION

CONTROL LOGIC

POWER SECTION

DRIVER SECTION

AHO

AHB

AHS

LDEL

ALO

HDEL

ALS

IN-/AHI

IN+/ALI

OUT/BLI

BLS

BLO

DIS

BHS

HEN/BHI

BHO

BHB

R29

NOTES:

1. DEVICE CD4069UB PIN 7 = COM. PIN 14 = +12V.

2. COMPONENTS L1, L2, C1, C2, CX, CY, R30, R31, ARE NOT

SUPPLIED. REFER TO APPLICATION NOTE FOR HELP IN
DETERMINING JMPR1 - JMPR4 JUMPER LOCATIONS.

HIP4080A

E20.3

(JEDEC MS-001-AD ISSUE D)

20 LEAD DUAL-IN-LINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

0.210

5.33

0.015

0.39

0.115

0.195

2.93

4.95

0.014

0.022

0.356

0.558

0.045

0.070

1.55

1.77

0.008

0.014

0.204

0.355

0.980

1.060

24.89

26.9

0.005

0.13

0.300

0.325

7.62

8.25

0.240

0.280

6.10

7.11

0.100 BSC

2.54 BSC

0.300 BSC

7.62 BSC

0.430

10.92

0.115

0.150

2.93

3.81

Rev. 0 12/93

NOTES:

1. Controlling Dimensions: INCH. In case of conflict between

English and Metric dimensions, the inch dimensions control.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Symbols are defined in the "MO Series Symbol List" in Section

2.2 of Publication No. 95.

4. Dimensions A, A1 and L are measured with the package seated

in JEDEC seating plane gauge GS-3.

5. D, D1, and E1 dimensions do not include mold flash or

protrusions. Mold flash or protrusions shall not exceed 0.010
inch (0.25mm).

6. E and

are measured with the leads constrained to be

perpendicular to datum

7. e

and e

are measured at the lead tips with the leads

unconstrained. e

must be zero or greater.

8. B1 maximum dimensions do not include dambar protrusions.

Dambar protrusions shall not exceed 0.010 inch (0.25mm).

9. N is the maximum number of terminal positions.

10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,

E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).

-B-

INDEX

1 2 3

N/2

AREA

SEATING

BASE

PLANE

-C-

-A-

0.010 (0.25)

B S

-C-

Dual-In-Line Plastic Packages (PDIP)

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

HIP4080A

NOTES:

1. Symbols are defined in the "MO Series Symbol List" in Section

2.2 of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension "D" does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.

4. Dimension "E" does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. "L" is the length of terminal for soldering to a substrate.

7. "N" is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width "B", as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch

dimensions are not necessarily exact.

INDEX
AREA

-B-

0.25(0.010)

C A

B S

-A-

-C-

SEATING PLANE

0.10(0.004)

h x 45

0.25(0.010)

M20.3

(JEDEC MS-013-AC ISSUE C)

20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

0.0926

0.1043

2.35

2.65

0.0040

0.0118

0.10

0.30

0.013

0.0200

0.33

0.51

0.0091

0.0125

0.23

0.32

0.4961

0.5118

12.60

13.00

0.2914

0.2992

7.40

7.60

0.050 BSC

1.27 BSC

0.394

0.419

10.00

10.65

0.010

0.029

0.25

0.75

0.016

0.050

0.40

1.27

Rev. 0 12/93

Small Outline Plastic Packages (SOIC)

HIP4080A

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