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Электронный компонент: X40414V8-B

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1
FN8116.0
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-352-6832
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X40410, X40411, X40414, X40415
4kbit EEPROM
Dual Voltage Monitor with Integrated CPU
Supervisor
FEATURES
Dual voltage detection and reset assertion
--Standard reset threshold settings
See Selection table on page 2.
--Adjust low voltage reset threshold voltages
using special programming sequence
--Reset signal valid to V
CC
= 1V
--Monitor three voltages or detect power fail
Independent Core Voltage Monitor (V2MON)
Fault detection register
Selectable power-on reset timeout (0.05s,
0.2s, 0.4s, 0.8s)
Selectable watchdog timer interval (25ms,
200ms,1.4s, off)
Low power CMOS
--25A typical standby current, watchdog on
--6A typical standby current, watchdog off
4Kbits of EEPROM
--16 byte page write mode
--5ms write cycle time (typical)
Built-in inadvertent write protection
--Power-up/power-down protection circuitry
--Block lock protect none or 1/2 of EEPROM
400kHz 2-wire interface
2.7V to 5.5V power supply operation
Available packages
--8-lead SOIC, TSSOP
Monitor Voltages: 5V to 0.9V
Memory Security
Independent Core Voltage Monitor
APPLICATIONS
Communication Equipment
--Routers, Hubs, Switches
--Disk Arrays, Network Storage
Industrial Systems
--Process Control
--Intelligent Instrumentation
Computer Systems
--Computers
--Network Servers
DESCRIPTION
The X40410/11/14/15 combines power-on reset con-
trol, watchdog timer, supply voltage supervision, and
secondary voltage supervision, and Block Lock
TM
pro-
tect serial EEPROM in one package. This combination
lowers system cost, reduces board space require-
ments, and increases reliability.
Applying voltage to VCC activates the power-on reset
circuit which holds RESET/RESET active for a period of
time. This allows the power supply and system oscilla-
BLOCK DIAGRAM
V2FAIL
WDO
RESET
RESET
X40410/14
X40411/15
Fault Detection
Register
Status
Register
EEPROM
Array
Data
Register
Command
Decode Test
& Control
Logic
Power-on,
Low Voltage
Reset
Generation
V2MON
SDA
SCL
V
CC
(V1MON)
+
-
User Programmable
Threshold
Reset Logic
+
-
V
TRIP1
User Programmable
V
TRIP2
Watchdog Timer
and
Reset Logic
V2MON
V
CC
or
*X40410/11= V2MON*
X40414/15 = V
CC
Data Sheet
March 28, 2005
2
FN8116.0
March 28, 2005
Low V
CC
detection circuitry protects the user's system
from low voltage conditions, resetting the system when
V
CC
falls below the minimum V
TRIP1
point. RESET/RE-
SET is active until V
CC
returns to proper operating level
and stabilizes. A second voltage monitor circuit tracks
the unregulated supply to provide a power fail warning
or monitors different power supply voltage. Three com-
mon low voltage combinations are available, however,
Intersil's unique circuits allows the threshold for either
voltage monitor to be reprogrammed to meet special
needs or to fine-tune the threshold for applications re-
quiring higher precision.
The Watchdog Timer provides an independent protec-
tion mechanism for microcontrollers. When the micro-
controller fails to restart a timer within a selectable
time out interval, the device activates the WDO signal.
The user selects the interval from three preset values.
Once selected, the interval does not change, even
after cycling the power.
The memory portion of the device is a CMOS Serial
EEPROM array with Intersil's Block Lock protection.
The array is internally organized as x 8. The device
features a 2-wire interface and software protocol
allowing operation on an I
2
C
bus.
The device utilizes Intersil's proprietary Direct Write
TM
cell, providing a minimum endurance of 100,000
cycles and a minimum data retention of 100 years.
Triple Voltage Monitors
*Voltage monitor requires V
CC
to operation. Others are independent of V
CC
.
PIN CONFIGURATION
Device
Expected System Voltages
Vtrip1(V)
Vtrip2(V)
POR (system)
X4040/11
-A
-B
-C
5V; 3V or 3.3V
5V; 3V
3V; 3.3V; 1.8V
2.04.75*
4.554.65*
4.354.45*
2.852.95*
1.704.75
2.852.95
2.552.65
1.651.75
RESET = X40410
RESET = X40411
X40414/15
-A
-B
-C
3V; 3.3V; 1.5V
3V; 1.5V
3V or 3.3V; 1.1 or 1.2V
2.04.75*
2.852.95*
2.552.65*
2.852.95*
0.903.50*
1.251.35*
1.251.35*
0.951.05*
RESET = X40414
RESET = X40415
SDA
V
CC
3
2
4
1
6
7
5
8
RESET/RESET
V
SS
V2MON
3
2
4
1
6
7
5
8
SCL
WDO
V2FAIL
RESET/RESET
SCL
V
SS
SDA
V2FAIL
V2MON
WDO
V
CC
X40410/14, X40411/15
X40410/14, X40411/15
8-Pin SOIC
8-Pin TSSOP
PIN DESCRIPTION
Pin
Name
Function
SOIC TSSOP
1
3
V2FAIL V2 Voltage Fail Output. This open drain output goes LOW when V2MON is less than V
TRIP2
and
goes HIGH when V2MON exceeds V
TRIP2
. There is no power-up reset delay circuitry on this pin.
2
4
V2MON V2 Voltage Monitor Input. When the V2MON input is less than the V
TRIP2
voltage, V2FAIL goes
LOW. This input can monitor an unregulated power supply with an external resistor divider or can
monitor a second power supply with no external components. Connect V2MON to V
SS
or
V
CC
when
not used.The V2MON comparator is supplied by V2MON (X40410/11) or by V
CC
Input (X40414/15).
3
5
RESET/
RESET
RESET Output. (X40411/15) This is an active LOW, open drain output which goes active whenever
V
CC
falls below V
TRIP1
. It will remain active until V
CC
rises above V
TRIP1
and for the t
PURST
thereafter.
RESET Output. (X40410/14) This is an active HIGH CMOS output which goes active whenever V
CC
falls below V
TRIP1
. It will remain active until
V
CC
rises above V
TRIP1
and for the t
PURST
thereafter.
4
6
V
SS
Ground
5
7
SDA
Serial Data. SDA is a bidirectional pin used to transfer data into and out of the device. It has an open
drain output and may be wire ORed with other open drain or open collector outputs. This pin requires
a pull up resistor and the input buffer is always active (not gated).
Watchdog Input. A HIGH to LOW transition on the SDA (while SCL is toggled from HIGH to
LOW and followed by a stop condition) restarts the Watchdog timer. The absence of this transi-
tion within the watchdog time out period results in WDO going active.
X40410, X40411, X40414, X40415
3
FN8116.0
March 28, 2005
PRINCIPLES OF OPERATION
Power-On Reset
Application of power to the X40410/11/14/15 activates a
Power-on Reset Circuit that pulls the RESET/RESET
pins active. This signal provides several benefits.
It prevents the system microprocessor from starting to
operate with insufficient voltage.
It prevents the processor from operating prior to stabili-
zation of the oscillator.
It allows time for an FPGA to download its configura-
tion prior to initialization of the circuit.
It prevents communication to the EEPROM, greatly
reducing the likelihood of data corruption on power-up.
When V
CC
exceeds the device V
TRIP1
threshold value for
t
PURST
(selectable) the circuit releases the RESET
(X40411) and RESET (X40410) pin allowing the system
to begin operation.
Low Voltage V
CC
(V1 Monitoring)
During operation, the X40410/11/14/15 monitors the
V
CC
level and asserts RESET/RESET if supply voltage
falls below a preset minimum V
TRIP1
. The
RESET/RESET signal prevents the microprocessor
from operating in a power fail or brownout condition.
The V1FAIL signal remains active until the voltage
drops below 1V. It also remains active until V
CC
returns
and exceeds V
TRIP1
for
t
PURST
.
Low Voltage V2 Monitoring
The X40410/11/14/15 also monitors a second voltage
level and asserts V2FAIL if the voltage falls below a
preset minimum V
TRIP2
. The V2FAIL signal is either
ORed with RESET to prevent the microprocessor from
operating in a power fail or brownout condition or used to
interrupt the microprocessor with notification of an
impending power failure. For the X40410/11 the V2FAIL
signal remains active until the V
CC
drops below 1V (V
CC
falling). It also remains active until V2MON returns and
exceeds V
TRIP2
by 0.2V. This voltage sense circuitry
monitors the power supply connected to the V2MON pin.
If V
CC
= 0, V2MON can still be monitored.
For the X40414/15 devices, the V2FAIL signal remains
actice until V
CC
drops below 1Vx and remains active
until V2MON returns and exceeds V
TRIP2
. This sense
circuitry is powered by V
CC
. If V
CC
= 0, V2MON cannot
be monitored.
Figure 1. Two Uses of Multiple Voltage Monitoring
6
8
SCL
Serial Clock. The Serial Clock controls the serial bus timing for data input and output.
7
1
WDO
WDO Output. WDO is an active LOW, open drain output which goes active whenever the watch-
dog timer goes active.
8
2
V
CC
Supply Voltage
PIN DESCRIPTION
(Continued)
Pin
Name
Function
SOIC TSSOP
610V
V
CC
5V
Reg
V2MON
X40411-A
Resistors selected so 3V appears on V2MON when unregulated
supply reaches 6V.
Unreg.
Supply
V
CC
X40414-C
RESET
V2FAIL
System
V
CC
Reset
RESET
V2FAIL
V
CC
System
Reset
Notice: No external components required to monitor two voltages.
1M
1M
V2MON
3.3V
Reg
1.2V
Reg
V2MON
(2.9V)
X40410, X40411, X40414, X40415
4
FN8116.0
March 28, 2005
Figure 2. V
TRIPX
Set/Reset Conditions
WATCHDOG TIMER
The Watchdog Timer circuit monitors the microprocessor
activity by monitoring the SDA and SCL pins. The micro-
processor must toggle the SDA pin HIGH to LOW period-
ically, while SCL also toggles from HIGH to LOW (this is
a start bit) followed by a stop condition prior to the expira-
tion of the watchdog time out period to prevent a WDO
signal going active. The state of two nonvolatile control
bits in the Status Register determines the watchdog timer
period. The microprocessor can change these watchdog
bits by writing to the X40410/11/14/15 control register
(also refer to page 19).
Figure 3. Watchdog Restart
V1 AND V2 THRESHOLD PROGRAM PROCEDURE
(OPTIONAL)
The X40410/11/14/15is shipped with standard V1 and
V2 threshold (V
TRIP1,
V
TRIP2
) voltages. These values
will not change over normal operating and storage
conditions. However, in applications where the stan-
dard thresholds are not exactly right, or if higher preci-
sion is needed in the threshold value, the
X40410/11/14/15 trip points may be adjusted. The pro-
cedure is described below, and uses the application of
a high voltage control signal.
Setting a V
TRIPx
Voltage (x = 1, 2)
There are two procedures used to set the threshold
voltages (V
TRIPx
), depending if the threshold voltage
to be stored is higher or lower than the present value.
For example, if the present V
TRIPx
is 2.9 V and the
new V
TRIPx
is 3.2 V, the new voltage can be stored
directly into the V
TRIPx
cell. If however, the new setting
is to be lower than the present setting, then it is neces-
sary to "reset" the V
TRIPx
voltage before setting the
new value.
Setting a Higher V
TRIPx
Voltage (x = 1, 2)
To set a V
TRIPx
threshold to a new voltage which is
higher than the present threshold, the user must apply
the desired V
TRIPx
threshold voltage to the corre-
sponding input pin Vcc(V1MON), or V2MON. The
Vcc(V1MON) and V2MON must be tied together dur-
ing this sequence. Then, a programming voltage (Vp)
must be applied to the WDO pin before a START con-
dition is set up on SDA. Next, issue on the SDA pin the
Slave Address A0h, followed by the Byte Address 01h
for V
TRIP1
and 09h for V
TRIP2
, and a 00h Data Byte in
order to program V
TRIPx
. The STOP bit following a
valid write operation initiates the programming
sequence. Pin WDO must then be brought LOW to
complete the operation.
Note: This operation does not corrupt the memory
array.
Setting a Lower V
TRIPx
Voltage (x = 1, 2)
In order to set V
TRIPx
to a lower voltage than the
present value, then V
TRIPx
must first be "reset" accord-
ing to the procedure described below. Once V
TRIPx
has been "reset", then V
TRIPx
can be set to the desired
voltage using the procedure described in "Setting a
Higher V
TRIPx
Voltage".
V
CC
/V2MON
V
TRIPX
V
P
t
WC
A0h
0
7
7
0
7
0
SCL
WDO
SDA
(X = 1, 2)
00h
SCL
SDA
.6s
1.3s
Timer Start
X40410, X40411, X40414, X40415
5
FN8116.0
March 28, 2005
Resetting the V
TRIPx
Voltage
To reset a V
TRIPx
voltage, apply the programming volt-
age (Vp) to the WDO pin before a START condition is
set up on SDA. Next, issue on the SDA pin the Slave
Address A0h followed by the Byte Address 03h for
V
TRIP1
and 0Bh for V
TRIP2
, followed by 00h for the
Data Byte in order to reset V
TRIPx
. The STOP bit fol-
lowing a valid write operation initiates the program-
ming sequence. Pin WDO must then be brought LOW
to complete the operation.
After being reset, the value of V
TRIPx
becomes a nomi-
nal value of 1.7V or lesser.
Note: This operation does not corrupt the memory
array.
CONTROL REGISTER
The Control Register provides the user a mechanism for
changing the Block Lock and Watchdog Timer settings.
The Block Lock and Watchdog Timer bits are nonvolatile
and do not change when power is removed.
The Control Register is accessed with a special pream-
ble in the slave byte (1011) and is located at address
1FFh. It can only be modified by performing a byte write
operation directly to the address of the register and only
one data byte is allowed for each register write operation.
Prior to writing to the Control Register, the WEL and
RWEL bits must be set using a two step process, with
the whole sequence requiring 3 steps. See "Writing to
the Control Registers" on page 7.
The user must issue a stop, after sending this byte to
the register, to initiate the nonvolatile cycle that stores
WD1, WD0, PUP1, PUP0, BP1, and BP0. The
X40410/11/14/15 will not acknowledge any data bytes
written after the first byte is entered.
The state of the Control Register can be read at any
time by performing a random read at address 01Fh,
using the special preamble. Only one byte is read by
each register read operation. The master should sup-
ply a stop condition to be consistent with the bus pro-
tocol, but a stop is not required to end this operation.
RWEL: Register Write Enable Latch (Volatile)
The RWEL bit must be set to "1" prior to a write to the
Control Register.
Figure 4. Sample V
TRIP
Reset Circuit
7
6
5
4
3
2
1
0
PUP1 WD1 WD0
BP
0
RWEL WEL PUP0
1
3
2
4
8
7
6
5
SOIC
V
TRIP1
Adj.
V
P
RESET
4.7K
SDA
SCL
C
Adjust
Run
V2FAIL
V
TRIP2
Adj.
X4041x
X40410, X40411, X40414, X40415
6
FN8116.0
March 28, 2005
Figure 5. V
TRIPX
Set/Reset Sequence (X = 1, 2)
WEL: Write Enable Latch (Volatile)
The WEL bit controls the access to the memory and to
the Register during a write operation. This bit is a vola-
tile latch that powers up in the LOW (disabled) state.
While the WEL bit is LOW, writes to any address,
including any control registers will be ignored (no
acknowledge will be issued after the Data Byte). The
WEL bit is set by writing a "1" to the WEL bit and zeros
to the other bits of the control register.
Once set, WEL remains set until either it is reset to 0
(by writing a "0" to the WEL bit and zeros to the other
bits of the control register) or until the part powers up
again. Writes to the WEL bit do not cause a high volt-
age write cycle, so the device is ready for the next
operation immediately after the stop condition.
V
TRIPX
Programming
Apply V
CC
and Voltage
Decrease V
X
Actual V
TRIPX -
Desired V
TRIPX
DONE
Set Higher V
X
Sequence
Error < MDE
| Error | < | MDE |
YES
NO
Error > MDE
+
> Desired V
TRIPX
to V
X
Desired
Present Value
V
TRIPX
Execute
No
YES
Execute
V
TRIPX
Reset Sequence
Execute
Set Higher V
TRIPX
Sequence
New V
X
applied =
Old V
X
applied + | Error |
New V
X
applied =
Old V
X
applied - | Error |
Execute Reset V
TRIPX
Sequence
Output Switches?
Note: X = 1, 2
Let: MDE = Maximum Desired Error
Vx = V
CC
, VxMON
MDE
+
Desired Value
MDE
Acceptable
Error Range
Error = Actual - Desired
X40410, X40411, X40414, X40415
7
FN8116.0
March 28, 2005
BP: Block Protect Bit (Nonvolatile)
The Block Protect Bit, BP, determines which blocks of
the array are write protected. A write to a protected
block of memory is ignored. The block protect bits will
prevent write operations to half or none of the array.
PUP1, PUP0: Power-up Bits (Nonvolatile)
The Power-up bits, PUP1 and PUP0, determine the
t
PURST
time delay. The nominal power-up times are
shown in the following table.
WD1, WD0: Watchdog Timer Bits (Nonvolatile)
The bits WD1 and WD0 control the period of the
Watchdog Timer. The options are shown below.
Writing to the Control Registers
Changing any of the nonvolatile bits of the control and
trickle registers requires the following steps:
Write a 02H to the Control Register to set the Write
Enable Latch (WEL). This is a volatile operation, so
there is no delay after the write. (Operation pre-
ceded by a start and ended with a stop).
Write a 06H to the Control Register to set the
Register Write Enable Latch (RWEL) and the WEL
bit. This is also a volatile cycle. The zeros in the data
byte are required. (Operation proceeded by a start
and ended with a stop).
Write a one byte value to the Control Register that
has all the control bits set to the desired state. The
Control register can be represented as qxys 001r in
binary, where xy are the WD bits, s isthe BP bit and
qr are the power-up bits. This operation proceeded
by a start and ended with a stop bit. Since this is a
nonvolatile write cycle it will take up to 10ms to
complete. The RWEL bit is reset by this cycle and
the sequence must be repeated to change the non-
volatile bits again. If bit 2 is set to `1' in this third step
(qxys 011r) then the RWEL bit is set, but the WD1,
WD0, PUP1, PUP0, and BP bits remain unchanged.
Writing a second byte to the control register is not
allowed. Doing so aborts the write operation and
returns a NACK.
A read operation occurring between any of the
previous operations will not interrupt the register
write operation.
The RWEL bit cannot be reset without writing to the
nonvolatile control bits in the control register, power
cycling the device or attempting a write to a write
protected block.
To illustrate, a sequence of writes to the device con-
sisting of [02H, 06H, 02H] will reset all of the nonvola-
tile bits in the Control Register to 0. A sequence of
[02H, 06H, 06H] will leave the nonvolatile bits
unchanged and the RWEL bit remains set.
FAULT DETECTION REGISTER
The Fault Detection Register (FDR) provides the user
the status of what causes the system reset active. The
Manual Reset Fail, Watchdog Timer Fail and three
Low Voltage Fail bits are volatile.
The FDR is accessed with a special preamble in the
slave byte (1011) and is located at address 0FFh. It
can only be modified by performing a byte write
operation directly to the address of the register and
only one data byte is allowed for each register write
operation.
There is no need to set the WEL or RWEL in the
control register to access this fault detection register.
BP
Protected Addresses
(Size)
Array Lock
0
None
None
1
100h 1FFh (256 bytes)
Upper Half of
Memory Array
PUP1 PUP0
Power-on Reset Delay (
t
PURST
)
0
0
50ms
0
1
200ms (factory setting)
1
0
400ms
1
1
800ms
WD1
WD0
Watchdog Time Out Period
0
0
1.4 seconds
0
1
200 milliseconds
1
0
25 milliseconds
1
1
disabled (factory setting)
7
6
5
4
3
2
1
0
LV1F LV2F
0
WDF
0
0
0
0
X40410, X40411, X40414, X40415
8
FN8116.0
March 28, 2005
Figure 6. Valid Data Changes on the SDA Bus
At power-up, the Fault Detection Register is defaulted
to all "0". The system needs to initialize this register to
all "1" before the actual monitoring take place. In the
event of any one of the monitored sources failed. The
corresponding bits in the register will change from a
"1" to a "0" to indicate the failure. At this moment, the
system should perform a read to the register and
noted the cause of the reset. After reading the register
the system should reset the register back to all "1"
again. The state of the Fault Detection Register can be
read at any time by performing a random read at
address 0FFh, using the special preamble.
The FDR can be read by performing a random read at
OFFh address of the register at any time. Only one
byte of data is read by the register read operation.
WDF, Watchdog Timer Fail Bit (Volatile)
The WDF bit will set to "0" when the WDO goes active.
LV1F, Low V
CC
Reset Fail Bit (Volatile)
The LV1F bit will be set to "0" when V
CC
(V1MON)
falls below V
TRIP1
.
LV2F, Low V2MON Reset Fail Bit (Volatile)
The LV2F bit will be set to "0" when V2MON falls
below V
TRIP2
.
SERIAL INTERFACE
Interface Conventions
The device supports a bidirectional bus oriented proto-
col. The protocol defines any device that sends data
onto the bus as a transmitter, and the receiving device
as the receiver. The device controlling the transfer is
called the master and the device being controlled is
called the slave. The master always initiates data
transfers, and provides the clock for both transmit and
receive operations. Therefore, the devices in this fam-
ily operate as slaves in all applications.
Serial Clock and Data
Data states on the SDA line can change only during
SCL LOW. SDA state changes during SCL HIGH are
reserved for indicating start and stop conditions. See
Figure 6.
Serial Start Condition
All commands are preceded by the start condition,
which is a HIGH to LOW transition of SDA when SCL
is HIGH. The device continuously monitors the SDA
and SCL lines for the start condition and will not
respond to any command until this condition has been
met. See Figure 6.
Serial Stop Condition
All communications must be terminated by a stop condi-
tion, which is a LOW to HIGH transition of SDA when
SCL is HIGH. The stop condition is also used to place
the device into the Standby power mode after a read
sequence. A stop condition can only be issued after the
transmitting device has released the bus. (See Figure 6).
SCL
SDA
Data Stable
Data Change
Data Stable
X40410, X40411, X40414, X40415
9
FN8116.0
March 28, 2005
Figure 7. Valid Start and Stop Conditions
Serial Acknowledge
Acknowledge is a software convention used to indi-
cate successful data transfer. The transmitting device,
either master or slave, will release the bus after trans-
mitting eight bits. During the ninth clock cycle, the
receiver will pull the SDA line LOW to acknowledge
that it received the eight bits of data. See Figure 8.
The device will respond with an acknowledge after
recognition of a start condition and if the correct
Device Identifier and Select bits are contained in the
Slave Address Byte. If a write operation is selected,
the device will respond with an acknowledge after the
receipt of each subsequent eight bit word. The device
will acknowledge all incoming data and address bytes,
except for the Slave Address Byte when the Device
Identifier and/or Select bits are incorrect.
In the read mode, the device will transmit eight bits of
data, release the SDA line, then monitor the line for an
acknowledge. If an acknowledge is detected and no
stop condition is generated by the master, the device
will continue to transmit data. The device will terminate
further data transmissions if an acknowledge is not
detected. The master must then issue a stop condition
to return the device to Standby mode and place the
device into a known state.
Serial Write Operations
Byte Write
For a write operation, the device requires the Slave
Address Byte and a Word Address Byte. This gives
the master access to any one of the words in the
array. After receipt of the Word Address Byte, the
device responds with an acknowledge, and awaits the
next eight bits of data. After receiving the 8 bits of the
Data Byte, the device again responds with an
acknowledge. The master then terminates the transfer
by generating a stop condition, at which time the
device begins the internal write cycle to the nonvolatile
memory. During this internal write cycle, the device
inputs are disabled, so the device will not respond to any
requests from the master. The SDA output is at high
impedance. See Figure 9.
A write to a protected block of memory will suppress
the acknowledge bit.
Figure 8. Acknowledge Response From Receiver
SCL
SDA
Start
Stop
Data Output
from
Data Output
from Receiver
8
1
9
Start
Acknowledge
SCL from
Master
X40410, X40411, X40414, X40415
10
FN8116.0
March 28, 2005
Figure 9. Byte Write Sequence
Page Write
The device is capable of a page write operation. It is
initiated in the same manner as the byte write opera-
tion; but instead of terminating the write cycle after the
first data byte is transferred, the master can transmit
an unlimited number of 8-bit bytes. After the receipt of
each byte, the device will respond with an acknowl-
edge, and the address is internally incremented by
one. The page address remains constant. When the
counter reaches the end of the page, it "rolls over" and
goes back to `0' on the same page.
This means that the master can write 16 bytes to the
page starting at any location on that page. If the master
begins writing at location 10, and loads 12 bytes, then
the first 6 bytes are written to locations 10 through 15,
and the last 6 bytes are written to locations 0 through 5.
Afterwards, the address counter would point to location
6 of the page that was just written. If the master sup-
plies more than 16 bytes of data, then new data over-
writes the previous data, one byte at a time.
Figure 10. Page Write Operation
Figure 11. Writing 12 bytes to a 16-byte page starting at location 10.
The master terminates the Data Byte loading by issuing
a stop condition, which causes the device to begin the
nonvolatile write cycle. As with the byte write operation,
all inputs are disabled until completion of the internal
write cycle. See Figure 10 for the address, acknowl-
edge, and data transfer sequence.
S
t
a
r
t
S
t
o
p
Slave
Address
Byte
Address
Data
A
C
K
A
C
K
A
C
K
SDA Bus
Signals from
the Slave
Signals from
the Master
0
S
t
a
r
t
S
t
o
p
Slave
Address
Byte
Address
Data
(n)
A
C
K
A
C
K
A
C
K
SDA Bus
Signals from
the Slave
Signals from
the Master
0
Data
(1)
A
C
K
(1
n
16)
1 0 1 0
0
0
address
address
10
5 Bytes
n-1
7 Bytes
address
= 6
address pointer
ends here
Addr = 7
X40410, X40411, X40414, X40415
11
FN8116.0
March 28, 2005
Stops and Write Modes
Stop conditions that terminate write operations must
be sent by the master after sending at least 1 full data
byte plus the subsequent ACK signal. If a stop is
issued in the middle of a data byte, or before 1 full
data byte plus its associated ACK is sent, then the
device will reset itself without performing the write. The
contents of the array will not be effected.
Acknowledge Polling
The disabling of the inputs during high voltage cycles
can be used to take advantage of the typical 5ms write
cycle time. Once the stop condition is issued to indi-
cate the end of the master's byte load operation, the
device initiates the internal high voltage cycle.
Acknowledge polling can be initiated immediately. To
do this, the master issues a start condition followed by
the Slave Address Byte for a write or read operation. If
the device is still busy with the high voltage cycle then
no ACK will be returned. If the device has completed
the write operation, an ACK will be returned and the
host can then proceed with the read or write operation.
See Figure 12.
Serial Read Operations
Read operations are initiated in the same manner as
write operations with the exception that the R/W bit of
the Slave Address Byte is set to one. There are three
basic read operations: Current Address Reads, Ran-
dom Reads, and Sequential Reads.
Current Address Read
Internally the device contains an address counter that
maintains the address of the last word read incre-
mented by one. Therefore, if the last read was to
address n, the next read operation would access data
from address n+1. On power-up, the address of the
address counter is undefined, requiring a read or write
operation for initialization.
Upon receipt of the Slave Address Byte with the R/W
bit set to one, the device issues an acknowledge and
then transmits the eight bits of the Data Byte. The
master terminates the read operation when it does not
respond with an acknowledge during the ninth clock
and then issues a stop condition. See Figure 13 for the
address, acknowledge, and data transfer sequence.
Figure 12. Acknowledge Polling Sequence
It should be noted that the ninth clock cycle of the read
operation is not a "don't care." To terminate a read
operation, the master must either issue a stop condi-
tion during the ninth cycle or hold SDA HIGH during
the ninth clock cycle and then issue a stop condition.
Random Read
Random read operation allows the master to access any
memory location in the array. Prior to issuing the Slave
Address Byte with the R/W bit set to one, the master
must first perform a "dummy" write operation. The master
issues the start condition and the Slave Address Byte,
receives an acknowledge, then issues the Word Address
Bytes. After acknowledging receipts of the Word Address
Bytes, the master immediately issues another start con-
dition and the Slave Address Byte with the R/W bit set to
one. This is followed by an acknowledge from the device
and then by the eight bit word. The master terminates the
read operation by not responding with an acknowledge
and then issuing a stop condition. See Figure 14 for the
address, acknowledge, and data transfer sequence.
ACK
Returned?
Issue Slave Address
Byte (Read or Write)
Byte Load Completed
by Issuing STOP.
Enter ACK Polling
Issue STOP
Issue START
NO
YES
High Voltage Cycle
Complete. Continue
Command Sequence?
Issue STOP
NO
Continue Normal
Read or Write
Command Sequence
PROCEED
YES
X40410, X40411, X40414, X40415
12
FN8116.0
March 28, 2005
A similar operation called "Set Current Address" where
the device will perform this operation if a stop is issued
instead of the second start shown in Figure 15. The
device will go into standby mode after the stop and all
bus activity will be ignored until a start is detected.
This operation loads the new address into the address
counter. The next Current Address Read operation will
read from the newly loaded address. This operation
could be useful if the master knows the next address it
needs to read, but is not ready for the data.
Sequential Read
Sequential reads can be initiated as either a current
address read or random address read. The first Data
Byte is transmitted as with the other modes; however,
the master now responds with an acknowledge, indicat-
ing it requires additional data. The device continues to
output data for each acknowledge received. The master
terminates the read operation by not responding with an
acknowledge and then issuing a stop condition.
The data output is sequential, with the data from
address n followed by the data from address n + 1. The
address counter for read operations increments through
all page and column addresses, allowing the entire
memory contents to be serially read during one opera-
tion. At the end of the address space the counter "rolls
over" to address 0000
H
and the device continues to out-
put data for each acknowledge received. See Figure 15
for the acknowledge and data transfer sequence.
SERIAL DEVICE ADDRESSING
Memory Address Map
CR, Control Register, CR7: CR0
Address: 1FF
hex
FDR, Fault DetectionRegister, FDR7: FDR0
Address: 0FF
hex
General Purpose Memory Organization, A8:A0
Address: 00h to 1FFh
General Purpose Memory Array Configuration
Slave Address Byte
Following a start condition, the master must output a
Slave Address Byte. This byte consists of several parts:
a device type identifier that is always `101x'. Where
x=0 is for Array, x=1 is for Control Register or Fault
Detection Register.
next two bits are `0'.
next bit that becomes the MSB of the address.
Figure 13. X40410/11 Addressing
Figure 14. Current Address Read Sequence
Memory Address
A8:A0
000h
0FFh
100h
1FFh
Lower 256 bytes
Upper 256 bytes
Block Protect Option
General Purpose Memory
Control Register
Fault Detection Register
1
1
0
0
1
1
0
1
A8 R/W
Word Address
Slave Byte
1
0
1
0
1
1
0
0
0
0
0
0
R/W
R/W
General Purpose Memory
Control Register
Fault Detection Register
A7
1
A6 A5 A4
A1 A0
1
A3 A2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
S
t
a
r
t
S
t
o
p
Slave
Address
Data
SDA Bus
Signals from
the Slave
Signals from
the Master
1
1 0 1 0
0
0
X40410, X40411, X40414, X40415
13
FN8116.0
March 28, 2005
Figure 15. Random Address Read Sequence
One bit of the slave command byte is a R/W bit. The
R/W bit of the Slave Address Byte defines the oper-
ation to be performed. When the R/W bit is a one,
then a read operation is selected. A zero selects a
write operation.
Word Address
The word address is either supplied by the master or
obtained from an internal counter. The internal counter
is undefined on a power-up condition.
Operational Notes
The device powers-up in the following state:
The device is in the low power standby state.
The WEL bit is set to `0'. In this state it is not possi-
ble to write to the device.
SDA pin is the input mode.
RESET/RESET Signal is active for
t
PURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
The WEL bit must be set to allow write operations.
The proper clock count and bit sequence is required
prior to the stop bit in order to start a nonvolatile
write cycle.
A three step sequence is required before writing into
the Control Register to change Watchdog Timer or
Block Lock settings.
Figure 16. Sequential Read Sequence
0
Slave
Address
Byte
Address
A
C
K
A
C
K
S
t
a
r
t
S
t
o
p
Slave
Address
Data
A
C
K
1
S
t
a
r
t
SDA Bus
Signals from
the Slave
Signals from
the Master
1 0 1
0
0
Data
(2)
S
t
o
p
Slave
Address
Data
(n)
A
C
K
A
C
K
SDA Bus
Signals from
the Slave
Signals from
the Master
1
Data
(n-1)
A
C
K
A
C
K
(n is any integer greater than 1)
Data
(1)
X40410, X40411, X40414, X40415
14
FN8116.0
March 28, 2005
ABSOLUTE MAXIMUM RATINGS
Temperature under bias .................... -65C to +135C
Storage temperature ......................... -65C to +150C
Voltage on any pin with
respect to V
SS
...................................... -1.0V to +7V
D.C. output current ............................................... 5mA
Lead temperature (soldering, 10 seconds)........ 300C
COMMENT
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device (at these or any other conditions above those
listed in the operational sections of this specification) is
not implied. Exposure to absolute maximum rating con-
ditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
*See Ordering Info
Temperature
Min.
Max.
Commercial
0C
70C
Industrial
-40C
+85C
Version
Chip Supply
Voltage
Monitored*
Voltages
X40410/11
-A or -B
2.7V to 5.5V
2.6V to 5V
X40410/11-
C, X40414/15
2.7V to 5.5V
1V to 3.6V
D.C. OPERATING CHARACTERISTICS
(Over the recommended operating conditions unless otherwise specified)
Symbol
Parameter
Min.
Typ.
(4)
Max.
Unit
Test Conditions
I
CC1
(1)
Active Supply Current (
V
CC
) Read
1.5
mA
V
IL
=
V
CC
x 0.1
V
IH
=
V
CC
x 0.9,
f
SCL
= 400kHz
I
CC2
(1)
Active Supply Current (
V
CC
) Read
3.0
mA
I
SB1
(1)(6)
Standby Current (
V
CC
) AC (WDT off)
6
10
A
V
IL
=
V
CC
x 0.1
VIH =
V
CC
x 0.9
f
SCL
, f
SDA
= 400kHz
I
SB2
(2)(6)
Standby Current (
V
CC
) DC (WDT on)
25
30
A
V
SDA
= V
SCL
= V
CC
Others = GND or V
CC
I
LI
Input Leakage Current (SCL)
10
A
V
IL
= GND to
V
CC
I
LO
Output Leakage Current (SDA,
V2FAIL, WDO, RESET)
10
A
V
SDA
= GND to
V
CC
Device is in Standby
(2)
V
IL
(3)
Input LOW Voltage (SDA, SCL)
-0.5
V
CC
x 0.3
V
V
IH
(3)
Input HIGH Voltage (SDA, SCL)
V
CC
x 0.7
V
CC
+ 0.5
V
V
HYS
(6)
Schmitt Trigger Input Hysteresis
Fixed input level
V
CC
related level
0.2
.05 x
V
CC
V
V
V
OL
Output LOW Voltage (SDA, RE-
SET/RESET, V2FAIL, WDO)
0.4
V
I
OL
= 3.0mA (2.7-5.5V)
I
OL
= 1.8mA (2.7-3.6V)
V
OH
Output (RESET) HIGH Voltage
V
CC
- 0.8
V
CC
- 0.4
V
I
OH
= -1.0mA (2.7-5.5V)
I
OH
= -0.4mA (2.7-3.6V)
X40410, X40411, X40414, X40415
15
FN8116.0
March 28, 2005
Notes: (1) The device enters the Active state after any start, and remains active until: 9 clock cycles later if the Device Select Bits in the Slave
Address Byte are incorrect; 200ns after a stop ending a read operation; or t
WC
after a stop ending a write operation.
(2) The device goes into Standby: 200ns after any stop, except those that initiate a high voltage write cycle; t
WC
after a stop that initiates a
high voltage cycle; or 9 clock cycles after any start that is not followed by the correct Device Select Bits in the Slave Address Byte.
(3) V
IL
Min. and V
IH
Max. are for reference only and are not tested.
(4) At 25C, V
CC
= 5V.
(5) See Ordering Information for standard programming levels. For custom programmed levels, contact factory.
(6) Based on characterization data.
EQUIVALENT INPUT CIRCUIT FOR VxMON (x = 1, 2)
CAPACITANCE
Note:
(1) This parameter is not 100% tested.
V
CC
Supply
V
TRIP1
(5)
V
CC
Trip Point Voltage Range
2.0
4.75
V
4.55
4.6
4.65
V
X40410/11-A
4.35
4.4
4.45
V
X40410/11-B
2.85
2.9
2.95
V
X40410/11-C,
X40414/15-A&C
2.55
2.6
2.65
V
X40414/15-B
t
RPD2
(6)
V
TRIP2
to V2FAIL
5
S
Second Supply Monitor
I
V2
V2MON Current
15
A
V
TRIP2
V2MON Trip Point Voltage Range
1.7
0.9
4.75
3.5
V
V
X40410/11
X40414/15
2.85
2.9
2.95
V
X40410/11-A
2.55
2.6
2.65
V
X40410/11-B
1.65
1.7
1.75
V
X40410/11-C
1.25
1.3
1.35
V
X40414/15-A&B
0.95
1.0
1.05
V
X40414/15-C
D.C. OPERATING CHARACTERISTICS
(Continued)
(Over the recommended operating conditions unless otherwise specified)
Symbol
Parameter
Min.
Typ.
(4)
Max.
Unit
Test Conditions
+
V
REF
t
RPDX
= 5s worst case
Output Pin
VxMON
R
C
V = 100mV
V
V
ref
Symbol
Parameter
Max.
Unit
Test Conditions
C
OUT
(1)
Output Capacitance (SDA, RESET, RESET, V2FAIL,
WDO)
8
pF
V
OUT
= 0V
C
IN
(1)
Input Capacitance (SCL)
6
pF
V
IN
= 0V
X40410, X40411, X40414, X40415
16
FN8116.0
March 28, 2005
EQUIVALENT A.C. OUTPUT LOAD CIRCUIT FOR
V
CC
= 5V
A.C. TEST CONDITIONS
SYMBOL TABLE
Input pulse levels
V
CC
x 0.1 to
V
CC
x 0.9
Input rise and fall times
10ns
Input and output timing levels
V
CC
x 0.5
Output load
Standard output load
5V
SDA
30pF
V2MON
4.6k
RESET
30pF
2.06k
V2FAIL
V
OUT
4.6k
30pF
WDO
Must be
steady
Will be
steady
May change
from LOW
Will change
from LOW
to HIGH
May change
from HIGH
to LOW
Will change
from HIGH
to LOW
Don't Care:
Changes
Allowed
Changing:
State Not
Known
N/A
Center Line
is High
Impedance
WAVEFORM
INPUTS
OUTPUTS
X40410, X40411, X40414, X40415
17
FN8116.0
March 28, 2005
A.C. CHARACTERISTICS
Note:
(1) Cb = total capacitance of one bus line in pF.
TIMING DIAGRAMS
Bus Timing
Symbol
Parameter
400kHz
Unit
Min.
Max.
f
SCL
SCL Clock Frequency
0
400
kHz
t
IN
Pulse width Suppression Time at inputs
50
ns
t
AA
SCL LOW to SDA Data Out Valid
0.1
0.9
s
t
BUF
Time the bus free before start of new transmission
1.3
s
t
LOW
Clock LOW Time
1.3
s
t
HIGH
Clock HIGH Time
0.6
s
t
SU:STA
Start Condition Setup Time
0.6
s
t
HD:STA
Start Condition Hold Time
0.6
s
t
SU:DAT
Data In Setup Time
100
ns
t
HD:DAT
Data In Hold Time
0
s
t
SU:STO
Stop Condition Setup Time
0.6
s
t
DH
Data Output Hold Time
50
ns
t
R
SDA and SCL Rise Time
20 +.1Cb
(1)
300
ns
t
F
SDA and SCL Fall Time
20 +.1Cb
(1)
300
ns
Cb
Capacitive load for each bus line
400
pF
t
SU:STO
t
HIGH
t
SU:STA
t
HD:STA
t
HD:DAT
t
SU:DAT
SCL
SDA IN
SDA OUT
t
F
t
LOW
t
BUF
t
R
t
DH
t
AA
X40410, X40411, X40414, X40415
18
FN8116.0
March 28, 2005
Write Cycle Timing
Nonvolatile Write Cycle Timing
Note:
(1) t
WC
is the time from a valid stop condition at the end of a write sequence to the end of the self-timed internal nonvolatile write cycle. It is
the minimum cycle time to be allowed for any nonvolatile write by the user, unless Acknowledge Polling is used.
Power Fail Timings
Symbol
Parameter
Min.
Typ.
(1)
Max.
Unit
t
WC
(1)
Write Cycle Time
5
10
ms
SCL
SDA
t
WC
8
th
Bit of Last Byte
ACK
Stop
Condition
Start
Condition
V2MON
V2FAIL or
t
R
t
F
t
RPDX
V
RVALID
V3FAIL
LOWLINE or
V
CC
or
V
TRIPX
t
RPDX
t
RPDX
t
RPDL
t
RPDL
t
RPDL
X = 2, 3
[
]
[
]
X40410, X40411, X40414, X40415
19
FN8116.0
March 28, 2005
RESET/RESET Timings
LOW VOLTAGE AND WATCHDOG TIMING PARAMETERS
Notes: (1) V
CC
= 5V at 25C.
(2) Values based on characterization data only.
Symbol
Parameters
Min.
Typ.
(1)
Max.
Unit
t
RPD1
(2)
V
TRIP1
to RESET/RESET (Power-down only)
5
s
t
RPDX
(2)
V
TRIP2
to V2FAIL
5
s
t
PURST
Power-on Reset delay:
PUP1=0, PUP0=0
PUP1=0, PUP0=1 (factory setting)
PUP1=1, PUP0=0
PUP1=1, PUP0=1
50
200
(2)
400
(2)
800
(2)
ms
ms
ms
ms
t
F
V
CC,
V2MON
,
Fall Time
20
mV
/
s
t
R
V
CC,
V2MON
,
Rise Time
20
mV
/
s
V
RVALID
Reset Valid V
CC
1
V
t
WDO
Watchdog Timer Period:
WD1=0, WD0=0
WD1=0, WD0=1
WD1=1, WD0=0
WD1=1, WD0=1 (factory setting)
1.4
(2)
200
(2)
25
OFF
s
ms
ms
t
RST1
Watchdog Reset Time Out Delay
WD1=0, WD0=0
WD1=0, WD0=1
100
200
300
ms
t
RST2
Watchdog Reset Time Out Delay WD1=1, WD0=0
12.5
25
37.5
ms
t
RSP
Watchdog timer restart pulse width
1
s
V
CC
V
TRIP1
RESET
RESET
t
PURST
t
PURST
t
R
t
F
t
RPD1
V
RVALID
X40410, X40411, X40414, X40415
20
FN8116.0
March 28, 2005
Watchdog Time Out For 2-Wire Interface
V
TRIPX
Set/Reset Conditions
< t
WDO
t
RST
WDO
SDA
Start
t
WDO
t
RST
SCL
Start
t
RSP
WDT
Restart
Start
SDA
SCL
Minimum Sequence to Reset WDT
Clockin (0 or 1)
SCL
SDA
V
CC
/V2MON
(V
TRIPX
)
WDO
t
TSU
t
THD
t
VPH
t
VPS
V
P
t
WC
t
VPO
A0h
0
7
7
0
7
sets V
TRIP1
sets V
TRIP2
01h*
09h*
03h*
0Bh*
resets V
TRIP2
resets V
TRIP1
0
Start
* all others reserved
00h
X40410, X40411, X40414, X40415
21
FN8116.0
March 28, 2005
V
TRIP1
, V
TRIP2
, Programming Specifications: V
CC
= 2.05.5V; Temperature = 25C
Parameter
Description
Min.
Max.
Unit
t
VPS
WDO Program Voltage Setup time
10
s
t
VPH
WDO Program Voltage Hold time
10
s
t
TSU
V
TRIPX
Level Setup time
10
s
t
THD
V
TRIPX
Level Hold (stable) time
10
s
t
WC
V
TRIPX
Program Cycle
10
ms
t
VPO
Program Voltage Off time before next cycle
1
ms
V
P
Programming Voltage
15
18
V
V
TRAN1
V
TRIP1
Set Voltage Range
2.0
4.75
V
V
TRAN2
V
TRIP2
Set Voltage Range X40410/11
1.7
4.75
V
V
TRAN2A
V
TRIP2
Set to Voltage Range X40414/15
0.9
3.5
V
V
tv
V
TRIPX
Set Voltage variation after programming (-40 to +85C).
-25
+25
mV
t
VPS
WDO Program Voltage Setup time
10
s
X40410, X40411, X40414, X40415
22
FN8116.0
March 28, 2005
PACKAGING INFORMATION
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
0.014 (0.35)
0.019 (0.49)
Pin 1
Pin 1 Index
0.010 (0.25)
0.020 (0.50)
0.050 (1.27)
0.188 (4.78)
0.197 (5.00)
0.004 (0.19)
0.010 (0.25)
0.053 (1.35)
0.069 (1.75)
(4X) 7
0.016 (0.410)
0.037 (0.937)
0.0075 (0.19)
0.010 (0.25)
0 - 8
X 45
8-Lead Plastic, SOIC, Package Code S8
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
0.250"
0.050" Typical
0.050"
Typical
0.030"
Typical
8 Places
FOOTPRINT
X40410, X40411, X40414, X40415
23
FN8116.0
March 28, 2005
PACKAGING INFORMATION
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
8-Lead Plastic, TSSOP, Package Code V8
See Detail "A"
.031 (.80)
.041 (1.05)
.169 (4.3)
.177 (4.5)
.252 (6.4) BSC
.025 (.65) BSC
.114 (2.9)
.122 (3.1)
.002 (.05)
.006 (.15)
.047 (1.20)
.0075 (.19)
.0118 (.30)
0 8
.010 (.25)
.019 (.50)
.029 (.75)
Gage Plane
Seating Plane
Detail A (20X)
(4.16) (7.72)
(1.78)
(0.42)
(0.65)
All Measurements Are Typical
X40410, X40411, X40414, X40415
24
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8116.0
March 28, 2005
ORDERING INFORMATION
PART MARK INFORMATION
V
CC
Range
V
TRIP1
Range V
TRIP2
Range
Package
Operating
Temperature
Range
Part Number
with RESET
Part Number
with RESET
2.9-5.5
4.6V50mV
2.9V50mV
8L SOIC
0
o
C - 70
o
C
X40410S8-A
X40411S8-A
-40
o
C - 85
o
C
X40410S8I-A
X40411S8I-A
8L TSSOP
0
o
C - 70
o
C
X40410V8-A
X40411V8-A
-40
o
C - 85
o
C
X40410V8I-A
X40411V8I-A
2.6-5.5
4.4V50mV
2.6V50mV
8L SOIC
0
o
C - 70
o
C
X40410S8-B
X40411S8-B
-40
o
C - 85
o
C
X40410S8I-B
X40411S8I-B
8L TSSOP
0
o
C - 70
o
C
X40410V8-B
X40411V8-B
-40
o
C - 85
o
C
X40410V8I-B
X40411V8I-B
1.7-3.6
2.9V50mV
1.7V50mV
8L SOIC
0
o
C - 70
o
C
X40410S8-C
X40411S8-C
-40
o
C - 85
o
C
X40410S8I-C
X40411S8I-C
8L TSSOP
0
o
C - 70
o
C
X40410V8-C
X40411V8-C
-40
o
C - 85
o
C
X40410V8I-C
X40411V8I-C
1.3-3.6
2.9V50mV
1.3V50mV
8L SOIC
0
o
C - 70
o
C
X40414S8-A
X40415S8-A
-40
o
C - 85
o
C
X40414S8I-A
X40415S8I-A
8L TSSOP
0
o
C - 70
o
C
X40414V8-A
X40415V8-A
-40
o
C - 85
o
C
X40414V8I-A
X40415V8I-A
1.3-3.6
2.6V50mV
1.3V50mV
8L SOIC
0
o
C - 70
o
C
X40414S8-B
X40415S8-B
-40
o
C - 85
o
C
X40414S8I-B
X40415S8I-B
8L TSSOP
0
o
C - 70
o
C
X40414V8-B
X40415V8-B
-40
o
C - 85
o
C
X40414V8I-B
X40415V8I-B
1.0-3.6
2.9V50mV
1.0V50mV
8L SOIC
0
o
C - 70
o
C
X40414S8-C
X40415S8-C
-40
o
C - 85
o
C
X40414S8I-C
X40415S8I-C
8L TSSOP
0
o
C - 70
o
C
X40414V8-C
X40415V8-C
-40
o
C - 85
o
C
X40414V8I-C
X40415V8I-C
8-Lead Package
X4041XX
YYWWXX
I Industrial
0/1/4/5
Package - S/V
Blank Commercial
WW Workweek
YY Year
A, B, or C
X40410, X40411, X40414, X40415