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Электронный компонент: X5165S8I-2.7T1

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1
FN8128.1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-352-6832
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Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X5163, X5165
CPU Supervisor with 16Kbit SPI EEPROM
Description
These devices combine four popular functions, Power-on
Reset Control, Watchdog Timer, Supply Voltage Supervision,
and Block Lock Protect Serial EEPROM Memory in one
package. This combination lowers system cost, reduces
board space requirements, and increases reliability.
Applying power to the device activates the power-on reset
circuit which holds RESET/RESET active for a period of
time. This allows the power supply and oscillator to stabilize
before the processor can execute code.
The Watchdog Timer provides an independent protection
mechanism for microcontrollers. When the microcontroller
fails to restart a timer within a selectable time out interval, the
device activates the RESET/RESET signal. The user selects
the interval from three preset values. Once selected, the
interval does not change, even after cycling the power.
The device's low V
CC
detection circuitry protects the user's
system from low voltage conditions, resetting the system when
V
CC
falls below the minimum V
CC
trip point. RESET/RESET is
asserted until V
CC
returns to proper operating level and
stabilizes. Five industry standard V
TRIP
thresholds are
available, however, Intersil's unique circuits allow the
threshold to be reprogrammed to meet custom requirements
or to fine-tune the threshold for applications requiring higher
precision.
Features
Selectable watchdog timer
Low V
CC
detection and reset assertion
- Five standard reset threshold voltages
- Re-program low V
CC
reset threshold voltage using
special programming sequence
- Reset signal valid to V
CC
= 1V
Determine watchdog or low voltage reset with a volatile
flag bit
Long battery life with low power consumption
- <50A max standby current, watchdog on
- <1A max standby current, watchdog off
- <400A max active current during read
16Kbits of EEPROM
Built-in inadvertent write protection
- Power-up/power-down protection circuitry
- Protect 0, 1/4, 1/2 or all of EEPROM array with Block
Lock
TM
protection
- In circuit programmable ROM mode
2MHz SPI interface modes (0,0 & 1,1)
Minimize EEPROM programming time
- 32-byte page write mode
- Self-timed write cycle
- 5ms write cycle time (typical)
2.7V to 5.5V and 4.5V to 5.5V power supply operation
Available packages
- 14-lead TSSOP, 8-lead SOIC
Pinouts
8-LEAD SOIC/PDIP
CS/WDI
WP
SO
1
2
3
4
RESET/RESET
8
7
6
5
V
CC
14-LEAD TSSOP
SO
WP
V
SS
1
2
3
4
5
6
7
RESET/RESET
SCK
SI
14
13
12
11
10
9
8
NC
V
CC
NC
X5163, X5165
V
SS
SCK
CS/WDI
NC
NC
NC
NC
SI
X5163, X5165
X5163, X5165
Data Sheet
May 16, 2005
2
FN8128.1
May 16, 2005
Block Diagram
Watchdog
Timer Reset
Data
Register
Command
Decode &
Control
Logic
SI
SO
SCK
CS/WDI
V
CC
Reset &
Watchdog
Timebase
Power-on and
Generation
V
TRIP
+
-
RESET/RESET
Reset
Low Voltage
Status
Register
Protect Logic
4K Bits
4K Bits
8K Bits
EEPRO
M
A
r
ray
Watchdog Transition
Detector
WP
X5163 = RESET
X5165 = RESET
V
CC
Threshold
Reset Logic
Pin Description
PIN
(SOIC/PDIP)
PIN TSSOP
NAME
FUNCTION
1
1
CS/WDI
Chip Select Input.
CS HIGH, deselects the device and the SO output pin is at a high impedance
state. Unless a nonvolatile write cycle is underway, the device will be in the standby power mode.
CS LOW enables the device, placing it in the active power mode. Prior to the start of any
operation after power-up, a HIGH to LOW transition on CS is required
Watchdog Input. A HIGH to LOW transition on the WDI pin restarts the Watchdog timer. The
absence of a HIGH to LOW transition within the watchdog time out period results in
RESET/RESET going active.
2
2
SO
Serial Output. SO is a push/pull serial data output pin. A read cycle shifts data out on this pin. The
falling edge of the serial clock (SCK) clocks the data out.
3
6
WP
Write Protect. The WP pin works in conjunction with a nonvolatile WPEN bit to "lock" the setting
of the Watchdog Timer control and the memory write protect bits.
4
7
V
SS
Ground
5
8
SI
Serial Input. SI is a serial data input pin. Input all opcodes, byte addresses, and memory data on this
pin. The rising edge of the serial clock (SCK) latches the input data. Send all opcodes (Table 1),
addresses and data MSB first.
6
9
SCK
Serial Clock. The Serial Clock controls the serial bus timing for data input and output. The rising edge
of SCK latches in the opcode, address, or data bits present on the SI pin. The falling edge of SCK
changes the data output on the SO pin.
7
13
RESET/
RESET
Reset Output.
RESET/RESET is an active LOW/HIGH, open drain output which goes active
whenever V
CC
falls below the minimum V
CC
sense level. It will remain active until V
CC
rises above
the minimum V
CC
sense level for 200ms. RESET/
RESET goes active if the Watchdog Timer is enabled and CS remains either HIGH or LOW longer
than the selectable Watchdog time out period. A falling edge of CS will reset the Watchdog Timer.
RESET/RESET goes active on power-up at 1V and remains active for 200ms after the power
supply stabilizes.
8
14
V
CC
Supply Voltage
3-5,10-12
NC
No internal connections
X5163, X5165
3
FN8128.1
May 16, 2005
Principles Of Operation
Power-on Reset
Application of power to the X516, /X5165 activates a Power-
on Reset Circuit. This circuit goes active at 1V and pulls the
RESET/RESET pin active. This signal prevents the system
microprocessor from starting to operate with insufficient
voltage or prior to stabilization of the oscillator. When V
CC
exceeds the device V
TRIP
value for 200ms (nominal) the
circuit releases RESET/RESET, allowing the processor to
begin executing code.
Low Voltage Monitoring
During operation, the X5163, X5165 monitors the V
CC
level
and asserts RESET/RESET if supply voltage falls below a
preset minimum V
TRIP
. The RESET/RESET signal prevents
the microprocessor from operating in a power fail or
brownout condition. The RESET/RESET signal remains
active until the voltage drops below 1V. It also remains active
until V
CC
returns and exceeds V
TRIP
for 200ms.
Watchdog Timer
The Watchdog Timer circuit monitors the microprocessor
activity by monitoring the WDI input. The microprocessor
must toggle the CS/WDI pin periodically to prevent a
RESET/RESET signal. The CS/WDI pin must be toggled
from HIGH to LOW prior to the expiration of the watchdog
time out period. The state of two nonvolatile control bits in
the Status Register determine the watchdog timer period.
The microprocessor can change these watchdog bits, or
they may be "locked" by tying the WP pin LOW and setting
the WPEN bit HIGH.
V
CC
Threshold Reset Procedure
The X5163, X5165 has a standard V
CC
threshold (V
TRIP
)
voltage. This value will not change over normal operating
and storage conditions. However, in applications where the
standard V
TRIP
is not exactly right, or for higher precision in
the V
TRIP
value, the X5163, X5165 threshold may be
adjusted.
Setting the V
TRIP
Voltage
This procedure sets the V
TRIP
to a higher voltage value. For
example, if the current V
TRIP
is 4.4V and the new V
TRIP
is
4.6V, this procedure directly makes the change. If the new
setting is lower than the current setting, then it is necessary
to reset the trip point before setting the new value.
To set the new V
TRIP
voltage, apply the desired V
TRIP
threshold to the V
CC
pin and tie the CS/WDI pin and the WP
pin HIGH. RESET and SO pins are left unconnected. Then
apply the programming voltage V
P
to both SCK and SI and
pulse CS/WDI LOW then HIGH. Remove V
P
and the
sequence is complete.
Resetting the V
TRIP
Voltage
This procedure sets the V
TRIP
to a "native" voltage level. For
example, if the current V
TRIP
is 4.4V and the V
TRIP
is reset,
the new V
TRIP
is something less than 1.7V. This procedure
must be used to set the voltage to a lower value.
To reset the V
TRIP
voltage, apply a voltage between 2.7 and
5.5V to the V
CC
pin. Tie the CS/WDI pin, the WP pin, AND
THE SCK pin HIGH. RESET and SO pins are left
unconnected. Then apply the programming voltage V
P
to the
SI pin ONLY and pulse CS/WDI LOW then HIGH. Remove V
P
and the sequence is complete.
SCK
SI
V
P
V
P
CS
FIGURE 1. SET V
TRIP
VOLTAGE
SCK
SI
V
CC
V
P
CS
FIGURE 2. RESET V
TRIP
VOLTAGE
X5163, X5165
4
FN8128.1
May 16, 2005
V
TRIP
PROGRAMMING
APPLY 5V TO V
CC
DECREMENT V
CC
RESET PIN
GOES ACTIVE?
MEASURED V
TRIP
DESIRED V
TRIP
DONE
EXECUTE
SEQUENCE
RESET V
TRIP
SET V
CC
= V
CC
APPLIED =
DESIRED V
TRIP
EXECUTE
SEQUENCE
SET V
TRIP
NEW V
CC
APPLIED =
OLD V
CC
APPLIED + ERROR
(V
CC
= V
CC
- 50MV)
EXECUTE
SEQUENCE
RESET V
TRIP
NEW V
CC
APPLIED =
OLD V
CC
APPLIED - ERROR
ERROR > -EMAX
ERROR < EMAX
YES
NO
ERROR > EMAX
EMAX = MAXIMUM DESIRED ERROR
FIGURE 3. V
TRIP
PROGRAMMING SEQUENCE FLOW CHART
1
2
3
4
8
7
6
5
X5163, X5165
V
TRIP
ADJ.
PROGRAM
NC
NC
V
P
RESET V
TRIP
TEST
V
TRIP
SET V
TRIP
NC
RESET
4.7K
4.7K
10K
10K
+
FIGURE 4. SAMPLE V
TRIP
RESET CIRCUIT
X5163, X5165
5
FN8128.1
May 16, 2005
SPI Serial Memory
The memory portion of the device is a CMOS Serial EEPROM
array with Intersil's block lock protection. The array is
internally organized as x 8. The device features a Serial
Peripheral Interface (SPI) and software protocol allowing
operation on a simple four-wire bus.
The device utilizes Intersil's proprietary Direct Write
TM
cell,
providing a minimum endurance of 100,000 cycles and a
minimum data retention of 100 years.
The device is designed to interface directly with the
synchronous Serial Peripheral Interface (SPI) of many
popular microcontroller families. It contains an 8-bit
instruction register that is accessed via the SI input, with
data being clocked in on the rising edge of SCK. CS must be
LOW during the entire operation.
All instructions (Table 1), addresses and data are transferred
MSB first. Data input on the SI line is latched on the first
rising edge of SCK after CS goes LOW. Data is output on the
SO line by the falling edge of SCK. SCK is static, allowing
the user to stop the clock and then start it again to resume
operations where left off.
Write Enable Latch
The device contains a Write Enable Latch. This latch must
be SET before a Write Operation is initiated. The WREN
instruction will set the latch and the WRDI instruction will
reset the latch (Figure 7). This latch is automatically reset
upon a power-up condition and after the completion of a
valid Write Cycle.
Status Register
The RDSR instruction provides access to the Status
Register. The Status Register may be read at any time, even
during a Write Cycle. The Status Register is formatted as
follows:
The Write-In-Progress (WIP) bit is a volatile, read only bit
and indicates whether the device is busy with an internal
nonvolatile write operation. The WIP bit is read using the
RDSR instruction. When set to a "1", a nonvolatile write
operation is in progress. When set to a "0", no write is in
progress.
7
6
5
4
3
2
1
0
WPEN
FLB
WD1
WD0
BL1
BL0
WEL
WIP
TABLE 1. INSTRUCTION SET
INSTRUCTION NAME
INSTRUCTION FORMAT*
OPERATION
WREN
0000 0110
Set the Write Enable Latch (Enable Write Operations)
SFLB
0000 0000
Set Flag Bit
WRDI/RFLB
0000 0100
Reset the Write Enable Latch/Reset Flag Bit
RSDR
0000 0101
Read Status Register
WRSR
0000 0001
Write Status Register(Watchdog,BlockLock,WPEN & Flag Bits)
READ
0000 0011
Read Data from Memory Array Beginning at Selected Address
WRITE
0000 0010
Write Data to Memory Array Beginning at Selected Address
NOTE: *Instructions are shown MSB in leftmost position. Instructions are transferred MSB first.
TABLE 2. BLOCK PROTECT MATRIX
WREN CMD
STATUS REGISTER
DEVICE PIN
BLOCK
BLOCK
STATUS REGISTER
WEL
WPEN
WP#
PROTECTED BLOCK
UNPROTECTED BLOCK
WPEN, BL0, BL1, WD0,
WD1
0
X
X
Protected
Protected
Protected
1
1
0
Protected
Writable
Protected
1
0
X
Protected
Writable
Writable
1
X
1
Protected
Writable
Writable
X5163, X5165
6
FN8128.1
May 16, 2005
The Write Enable Latch (WEL) bit indicates the Status of
the Write Enable Latch. When WEL = 1, the latch is set
HIGH and when WEL = 0 the latch is reset LOW. The WEL
bit is a volatile, read only bit. It can be set by the WREN
instruction and can be reset by the WRDS instruction.
The block lock bits, BL0 and BL1, set the level of block lock
protection. These nonvolatile bits are programmed using the
WRSR instruction and allow the user to protect one quarter,
one half, all or none of the EEPROM array. Any portion of
the array that is block lock protected can be read but not
written. It will remain protected until the BL bits are altered to
disable block lock protection of that portion of memory.
The Watchdog Timer bits, WD0 and WD1, select the
Watchdog Time Out Period. These nonvolatile bits are
programmed with the WRSR instruction.
The FLAG bit shows the status of a volatile latch that can be
set and reset by the system using the SFLB and RFLB
instructions. The Flag bit is automatically reset upon power-
up. This flag can be used by the system to determine
whether a reset occurs as a result of a watchdog time out or
power failure.
The nonvolatile WPEN bit is programmed using the WRSR
instruction. This bit works in conjunction with the WP pin to
provide an In-Circuit Programmable ROM function (Table
2). WP is LOW and WPEN bit programmed HIGH disables
all Status Register Write Operations.
In Circuit Programmable ROM Mode
This mechanism protects the block lock and Watchdog bits
from inadvertent corruption.
In the locked state (Programmable ROM Mode) the WP pin
is LOW and the nonvolatile bit WPEN is "1". This mode
disables nonvolatile writes to the device's Status Register.
Setting the WP pin LOW while WPEN is a "1" while an
internal write cycle to the Status Register is in progress will
not stop this write operation, but the operation disables
subsequent write attempts to the Status Register.
STATUS
REGISTER BITS
ARRAY ADDRESSES PROTECTED
BL1
BL0
X516X
0
0
None
0
1
$0600-$07FF
1
0
$0400-$07FF
1
1
$0000-$07FF
STATUS REGISTER BITS
WATCHDOG TIME OUT
(TYPICAL)
WD1
WD0
0
0
1.4 seconds
0
1
600 milliseconds
1
0
200 milliseconds
1
1
disabled
STATUS REGISTER BITS
WATCHDOG TIME OUT
(TYPICAL)
WD1
WD0
0
1
2
3
4
5
6
7
8
9
10
20
21
22
23
24
25
26
27
28
29
30
7
6
5
4
3
2
1
0
DATA OUT
CS
SCK
SI
SO
MSB
HIGH IMPEDANCE
INSTRUCTION
16 BIT ADDRESS
15
14
13
3
2
1
0
FIGURE 5. READ EEPROM ARRAY SEQUENCE
X5163, X5165
7
FN8128.1
May 16, 2005
When WP is HIGH, all functions, including nonvolatile
writes to the Status Register operate normally. Setting the
WPEN bit in the Status Register to "0" blocks the WP pin
function, allowing writes to the Status Register when WP is
HIGH or LOW. Setting the WPEN bit to "1" while the WP pin
is LOW activates the Programmable ROM mode, thus
requiring a change in the WP pin prior to subsequent Status
Register changes. This allows manufacturing to install the
device in a system with WP pin grounded and still be able
to program the Status Register. Manufacturing can then
load Configuration data, manufacturing time and other
parameters into the EEPROM, then set the portion of
memory to be protected by setting the block lock bits, and
finally set the "OTP mode" by setting the WPEN bit. Data
changes now require a hardware change.
Read Sequence
When reading from the EEPROM memory array, CS is first
pulled low to select the device. The 8-bit READ instruction is
transmitted to the device, followed by the 16-bit address. After
the READ opcode and address are sent, the data stored in the
memory at the selected address is shifted out on the SO line.
The data stored in memory at the next address can be read
sequentially by continuing to provide clock pulses. The address
is automatically incremented to the next higher address after
each byte of data is shifted out. When the highest address is
reached, the address counter rolls over to address $0000
allowing the read cycle to be continued indefinitely. The read
operation is terminated by taking CS high. Refer to the Read
EEPROM Array Sequence (Figure 5).
To read the Status Register, the CS line is first pulled low to
select the device followed by the 8-bit RDSR instruction. After
the RDSR opcode is sent, the contents of the Status Register
are shifted out on the SO line. Refer to the Read Status
Register Sequence (Figure 6).
Write Sequence
Prior to any attempt to write data into the device, the "Write
Enable" Latch (WEL) must first be set by issuing the WREN
instruction (Figure 7). CS is first taken LOW, then the WREN
instruction is clocked into the device. After all eight bits of the
instruction are transmitted, CS must then be taken HIGH. If the
user continues the Write Operation without taking CS HIGH
after issuing the WREN instruction, the Write Operation will be
ignored.
To write data to the EEPROM memory array, the user then
issues the WRITE instruction followed by the 16 bit address
and then the data to be written. Any unused address bits are
specified to be "0's". The WRITE operation minimally takes
32 clocks. CS must go low and remain low for the duration of
the operation. If the address counter reaches the end of a
page and the clock continues, the counter will roll back to the
first address of the page and overwrite any data that may
have been previously written.
For the Page Write Operation (byte or page write) to be
completed, CS can only be brought HIGH after bit 0 of the
last data byte to be written is clocked in. If it is brought HIGH
at any other time, the write operation will not be completed
(Figure 8).
To write to the Status Register, the WRSR instruction is
followed by the data to be written (Figure 9). Data bits 0 and
1 must be "0".
While the write is in progress following a Status Register or
EEPROM Sequence, the Status Register may be read to
check the WIP bit. During this time the WIP bit will be high.
Operational Notes
The device powers-up in the following state:
The device is in the low power standby state.
A HIGH to LOW transition on CS is required to enter an
active state and receive an instruction.
SO pin is high impedance.
The Write Enable Latch is reset.
The Flag Bit is reset.
Reset Signal is active for t
PURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
A WREN instruction must be issued to set the Write Enable
Latch.
CS must come HIGH at the proper clock count in order to
start a nonvolatile write cycle.
X5163, X5165
8
FN8128.1
May 16, 2005
0
1
2
3
4
5
6
7
8
9
10
11 12
13
14
7
6
5
4
3
2
1
0
DATA OUT
CS
SCK
SI
SO
MSB
HIGH IMPEDANCE
INSTRUCTION
FIGURE 6. READ STATUS REGISTER SEQUENCE
0
1
2
3
4
5
6
7
CS
SI
SCK
HIGH IMPEDANCE
SO
FIGURE 7. WRITE ENABLE LATCH SEQUENCE
32 33
34
35 36
37
38 39
SCK
SI
CS
0
1
2
3
4
5
6
7
8
9
10
SCK
SI
INSTRUCTION
16 BIT ADDRESS
DATA BYTE 1
7
6
5
4
3
2
1
0
CS
40 41
42
43 44
45
46 47
DATA BYTE 2
7
6
5
4
3
2
1
0
DATA BYTE 3
7
6
5
4
3
2
1
0
DATA BYTE N
15 14
13
3
2
1
0
20
21 22
23 24 25
26 27
28 29 30
31
6
5
4
3
2
1
0
FIGURE 8. WRITE SEQUENCE
X5163, X5165
9
FN8128.1
May 16, 2005
Symbol Table
0
1
2
3
4
5
6
7
8
9
CS
SCK
SI
SO
HIGH IMPEDANCE
INSTRUCTION
DATA BYTE
7
6
5
4
3
2
1
0
10
11 12 13
14
15
FIGURE 9. STATUS REGISTER WRITE SEQUENCE
WAVEFORM
INPUTS
OUTPUTS
MUST BE
STEADY
WILL BE
STEADY
MAY CHANGE
FROM LO
W TO
HIGH
WILL CHANGE
FROM LO
W TO
HIGH
MAY CHANGE
FROM HIGH TO
LOW
WILL CHANGE
FROM HIGH TO
LOW
DON'T CARE:
CHANGES
ALLO
WED
CHANGING:
STATE NOT
KNOWN
N/A
CENTER LINE
IS HIGH
IMPEDANCE
X5163, X5165
10
FN8128.1
May 16, 2005
Absolute Maximum Ratings
Recommended Operating Conditions
Temperature under bias . . . . . . . . . . . . . . . . . . . . . . . .-65 to +135C
Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . .-65 to +150C
Voltage on any pin with
respect to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +7V
D.C. output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . 300C
Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to +85C
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Specifications
Over operating conditions unless otherwise specified.
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
MIN
TYP
MAX
I
CC1
V
CC
Write Current (Active)
SCK = V
CC
x 0.1/V
CC
x 0.9 @ 2MHz, SO =
Open
5
mA
I
CC2
V
CC
Read Current (Active)
SCK = V
CC
x 0.1/V
CC
x 0.9 @ 2MHz, SO =
Open
0.4
mA
I
SB1
V
CC
Standby Current WDT = OFF CS = V
CC
, V
IN
= V
SS
or V
CC
, V
CC
= 5.5V
1
A
I
SB2
V
CC
Standby Current WDT = ON
CS = V
CC
, V
IN
= V
SS
or V
CC
, V
CC
= 5.5V
50
A
I
SB3
V
CC
Standby Current WDT = ON
CS = V
CC
, V
IN
= V
SS
or V
CC
, V
CC
= 3.6V 20
A
I
LI
Input Leakage Current
V
IN
= V
SS
to V
CC
0.1
10
A
I
LO
Output Leakage Current
V
OUT
= V
SS
to V
CC
0.1
10
A
V
IL
(1)
Input LOW Voltage
-0.5
V
CC
x 0.3
V
V
IH
(1)
Input HIGH Voltage
V
CC
x 0.7
V
CC
+ 0.5
V
V
OL1
Output LOW Voltage
V
CC
> 3.3V, I
OL
= 2.1mA
0.4
V
V
OL2
Output LOW Voltage
2V < V
CC
3.3V, I
OL
= 1mA
0.4
V
V
OL3
Output LOW Voltage
V
CC
2V, I
OL
= 0.5mA
0.4
V
V
OH1
Output HIGH Voltage
V
CC
> 3.3V, I
OH
= 1.0mA
V
CC
- 0.8
V
V
OH2
Output HIGH Voltage
2V < V
CC
3.3V, I
OH
= 0.4mA
V
CC
- 0.4
V
V
OH3
Output HIGH Voltage
V
CC
2V, I
OH
= 0.25mA
V
CC
- 0.2
V
V
OLS
Reset Output LOW Voltage
I
OL
= 1mA
0.4
V
Capacitance T
A
= +25C, f = 1MHz, V
CC
= 5V
SYMBOL
TEST
MAX.
UNIT
CONDITIONS
C
OUT
(2)
Output Capacitance (SO, RESET, RESET)
8
pF
V
OUT
= 0V
C
IN
(2)
Input Capacitance (SCK, SI, CS, WP)
6
pF
V
IN
= 0V
NOTES:
1. V
IL
min. and V
IH
max. are for reference only and are not tested.
2. This parameter is periodically sampled and not 100% tested.
X5163, X5165
11
FN8128.1
May 16, 2005
5V
OUTPUT
100pF
5V
3.3k
RESET/RESET
30pF
1.64k
1.64k
FIGURE 10. EQUIVALENT A.C. LOAD CIRCUIT AT 5V V
CC
A.C. Test Conditions
Input pulse levels
V
CC
x 0.1 to V
CC
x 0.9
Input rise and fall times
10ns
Input and output timing level
V
CC
x0.5
AC Electrical Specifications
Serial Input Timing
(Over operating conditions unless otherwise specified.)
SYMBOL
PARAMETER
2.7-5.5V
UNIT
MIN MAX
f
SCK
Clock Frequency
0
2
MHz
t
CYC
Cycle Time
500
ns
t
LEAD
CS Lead Time
250
ns
t
LAG
CS Lag Time
250
ns
t
WH
Clock HIGH Time
200
ns
t
WL
Clock LOW Time
200
ns
t
SU
Data Setup Time
50
ns
t
H
Data Hold Time
50
ns
t
RI
(3)
Input Rise Time
100
ns
t
FI
(3)
Input Fall Time
100
ns
t
CS
CS Deselect Time
500
ns
t
WC
(4)
Write Cycle Time
10
ms
SCK
CS
SI
SO
MSB IN
t
SU
t
RI
t
LAG
t
LEAD
t
H
LSB IN
t
CS
t
FI
HIGH IMPEDANCE
FIGURE 11. SERIAL INPUT TIMING
X5163, X5165
12
FN8128.1
May 16, 2005
AC Electrical Specifications
Serial Output Timing
(Over operating conditions unless otherwise specified.)
SYMBOL
PARAMETER
2.7-5.5V
UNIT
MIN
MAX
f
SCK
Clock Frequency
0
2
MHz
t
DIS
Output Disable Time
250
ns
t
V
Output Valid from Clock Low
200
ns
t
HO
Output Hold Time
0
ns
t
RO
(3)
Output Rise Time
100
ns
t
FO
(3)
Output Fall Time
100
ns
NOTES:
3. This parameter is periodically sampled and not 100% tested.
4. t
WC
is the time from the rising edge of CS after a valid write sequence has been sent to the end of the self-timed internal nonvolatile write cycle.
SCK
CS
SO
SI
MSB OUT
MSB1 OUT
LSB OUT
ADDR
LSB IN
t
CYC
t
V
t
HO
t
WL
t
WH
t
DIS
t
LAG
TABLE 3. SERIAL OUTPUT TIMING
V
CC
t
PURST
t
PURST
t
R
t
F
t
RPD
RESET (X5163)
0 Volts
V
TRIP
V
TRIP
RESET (X5165)
TABLE 4. POWER-UP AND POWER-DOWN TIMING
X5163, X5165
13
FN8128.1
May 16, 2005
RESET Output Timing
SYMBOL
PARAMETER
MIN
TYP
MAX
UNIT
V
TRIP
Reset Trip Point Voltage, X5163-4.5A, X5163-4.5A
Reset Trip Point Voltage, X5163, X5165
Reset Trip Point Voltage, X5163-2.7A, X5165-2.7A
Reset Trip Point Voltage, X5163-2.7, X5165-2.7
4.5
4.25
2.85
2.55
4.63
4.38
2.92
2.63
4.75
4.5
3.0
2.7
V
V
TH
V
TRIP
Hysteresis (HIGH to LOW vs. LOW to HIGH V
TRIP
voltage)
20
mV
t
PURST
Power-up Reset Time Out
100
200
280
ms
t
RPD
(5)
V
CC
Detect to Reset/Output
500
ns
t
F
(5)
V
CC
Fall Time
100
s
t
R
(5)
V
CC
Rise Time
100
s
V
RVALID
Reset Valid V
CC
1
V
NOTES:
5. This parameter is periodically sampled and not 100% tested.
6. Typical values not tested.
RESET/RESET Output Timing
SYMBOL
PARAMETER
MIN
TYP
MAX
UNIT
t
WDO
Watchdog Time Out Period,
WD1 = 1, WD0 = 0
WD1 = 0, WD0 = 1
WD1 = 0, WD0 = 0
100
450
1
200
600
1.4
300
800
2
ms
ms
sec
t
CST
CS Pulse Width to Reset the Watchdog
400
ns
t
RST
Reset Time Out
100
200
300
ms
CS/WDI
t
CST
RESET
t
WDO
t
RST
RESET
t
WDO
t
RST
FIGURE 12. CS/WDI VS. RESET/RESET TIMING
X5163, X5165
14
FN8128.1
May 16, 2005
SCK
SI
V
P
V
P
CS
t
VPS
t
VPH
t
P
t
VPS
t
VPH
t
RP
t
VPO
t
VPO
t
TSU
t
THD
V
TRIP
V
CC
FIGURE 13. V
TRIP
SET CONDITIONS
SCK
SI
V
CC
V
P
CS
t
VPS
t
VPH
t
P
t
VPS
t
VP1
t
RP
t
VPO
t
VPO
t
TSU
t
THD
V
TRIP
V
CC
FIGURE 14. V
TRIP
RESET CONDITIONS
X5163, X5165
15
FN8128.1
May 16, 2005
V
TRIP
Programming Specifications: V
CC
= 1.7-5.5V; Temperature = 0C to 70C
PARAMETER
DESCRIPTION
MIN
MAX
UNIT
t
VPS
SCK V
TRIP
Program Voltage Setup time
1
s
t
VPH
SCK V
TRIP
Program Voltage Hold time
1
s
t
P
V
TRIP
Program Pulse Width
1
s
t
TSU
V
TRIP
Level Setup time
10
s
t
THD
V
TRIP
Level Hold (stable) time
10
ms
t
WC
V
TRIP
Write Cycle Time
10
ms
t
RP
V
TRIP
Program Cycle Recovery Period (Between successive programming cycles)
10
ms
t
VPO
SCK V
TRIP
Program Voltage Off time before next cycle
0
ms
V
P
Programming Voltage
15
18
V
V
TRAN
V
TRIP
Programed Voltage Range
1.7
5.0
V
V
ta1
Initial V
TRIP
Program Voltage accuracy (
V
CC applied-V
TRIP
) (Programmed at 25C.)
-0.1
+0.4
V
V
ta2
Subsequent V
TRIP
Program Voltage accuracy [(
V
CC applied-V
ta1
)-V
TRIP
] (Programmed at 25C.)
-25
+25
mV
V
tr
V
TRIP
Program Voltage repeatability (Successive program operations.) (Programmed at 25C.)
-25
+25
mV
V
tv
V
TRIP
Program variation after programming (0-75C). (Programmed at 25C.)
-25
+25
mV
V
TRIP
programming parameters are periodically sampled and are not 100% tested.
X5163, X5165
16
FN8128.1
May 16, 2005
FIGURE 15. V
CC
SUPPLY CURRENT VS. TEMPERATURE (I
SB
)
FIGURE 16. t
WDO
VS. VOLTAGE/TEMPERATURE (WD1, 0 = 1, 1)
FIGURE 17. V
TRIP
vs. Temperature (programmed at 25C)
FIGURE 18. t
WDO
VS. VOLTAGE/TEMPERATURE (WD1, 0 = 1, 0)
FIGURE 19. t
PURST
VS. TEMPERATURE
FIGURE 20. t
WDO
VS. VOLTAGE/TEMPERATURE (WD1, 0 0 = 0, 1)
18
16
14
12
10
8
6
4
2
0
WATCHDOG TIMER ON (V
CC
= 5V)
WATCHDOG TIMER ON (V
CC
= 5V)
WATCHDOG TIMER OFF (V
CC
= 3V, 5V)
-40
25
90
TEMP (C)
IS
B (A)
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1
1.7
2.4
3.1
3.8
4.5
5.2
90C
25C
-40C
RESET (SE
C
ONDS)
VOLTAGE
5.025
5.000
4.975
3.525
3.500
3.475
2.525
2.500
2.475
0
25
85
VO
LTA
GE
TEMPERATURE
V
TRIP
= 5V
V
TRIP
= 3.5V
V
TRIP
= 2.5V
0.8
0.75
0.7
0.65
0.6
0.55
0.5
0.45
1.7
5.2
RE
SET (SE
C
ONDS)
VOLTAGE
2.4
3.1
3.8
4.5
90C
25C
-40C
200
195
190
185
180
175
170
165
160
-40
25
90
DEGREES C
205
TIME (
M
S)
90C
25C
-40C
200
195
190
185
180
175
170
165
160
205
RESE
T (S
ECONDS)
VOLTAGE
1.7
5.2
2.4
3.1
3.8
4.5
X5163, X5165
17
FN8128.1
May 16, 2005
Packaging Information
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
0.014 (0.35)
0.019 (0.49)
PIN 1
PIN 1 INDEX
0.010 (0.25)
0.020 (0.50)
0.050 (1.27)
0.188 (4.78)
0.197 (5.00)
0.004 (0.19)
0.010 (0.25)
0.053 (1.35)
0.069 (1.75)
(4X) 7
0.016 (0.410)
0.037 (0.937)
0.0075 (0.19)
0.010 (0.25)
0 - 8
X 45
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
0.250"
0.050" TYPICAL
0.050"
TYPICAL
0.030"
TYPICAL
8 PLACES
FOOTPRINT
X5163, X5165
18
FN8128.1
May 16, 2005
Packaging Information
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
14-LEAD PLASTIC, TSSOP, PACKAGE TYPE V
SEE DETAIL "A"
.031 (.80)
.041 (1.05)
.169 (4.3)
.177 (4.5)
.252 (6.4) BSC
.025 (.65) BSC
.193 (4.9)
.200 (5.1)
.002 (.05)
.006 (.15)
.047 (1.20)
.0075 (.19)
.0118 (.30)
0 - 8
.010 (.25)
.019 (.50)
.029 (.75)
GAGE PLANE
SEATING PLANE
DETAIL A (20X)
X5163, X5165
19
FN8128.1
May 16, 2005
Ordering Information
V
CC
RANGE
V
TRIP
RANGE
PACKAGE
OPERATING TEMPERATURE
RANGE
PART NUMBER RESET
(ACTIVE LOW)
PART NUMBER RESET
(ACTIVE HIGH)
4.5-5.5V
4.5.4.75
8-Pin PDIP
0C - 70C
X5163P-4.5A
-40C - 85C
X5163PI-4.5A
X5165PI-4.5A
8L SOIC
0C - 70C
X5163S8-4.5A
X5165S8-4.5A
-40C - 85C
X5163S8I-4.5A
X5165S8I-4.5A
14L TSSOP
0C - 70C
X5163V14-4.5A
X5165V14-4.5A
-40C - 85C
X5163V14I-4.5A
X5165V14I-4.5A
4.5-5.5V
4.25.4.5
8-Pin PDIP
0C - 70C
X5163P
X5165P
-40C - 85C
X5163PI
X5165PI
8L SOIC
0C - 70C
X5163S8
X5165S8
0C - 70C
X51638S8
0C - 70C
X5163S8T1
X5165S8T1
0C - 70C
X5163S8T2
-40C - 85C
X5163S8I
X5165S8I
-40C - 85C
X5163S8IT1
X5165S8IT1
14L TSSOP
0C - 70C
X5163V14
X5165V14
0C - 70C
X5163V14T1
X5165V14T1
-40C - 85C
X5163V14I
X5165V14I
-40C - 85C
X5163V14IT1
X5165V14IT1
2.7-5.5V
2.85-3.0
8-Pin PDIP
0C - 70C
X5163P-2.7A
X5165P-2.7A
-40C - 85C
X5163PI-2.7A
X5165PI-2.7A
8L SOIC
0C - 70C
X5163S8-2.7A
X5165S8-2.7A
0C - 70C
X5163S8-2.7AT1
-40C - 85C
X5163S8I-2.7A
X5165S8I-2.7A
-40C - 85C
X5163S8I-2.7AT1
14L TSSOP
0C - 70C
X5163V14-2.7A
X5165V14-2.7A
-40C - 85C
X5163V14I-2.7A
X5165V14I-2.7A
-40C - 85C
X5163V14I-2.7T1
X5165V14I-2.7T1
2.7-5.5V
2.55-2.7
8-Pin PDIP
0C - 70C
X5163P-2.7
X5165P-2.7
-40C - 85C
X5163PI-2.7
X5165PI-2.7
8L SOIC
0C - 70C
X5163S8-2.7
X5165S8-2.7
0C - 70C
X5163S8-2.7T1
X5165S8-2.7T1
-40C - 85C
X5163S8I-2.7
X5165S8I-2.7
-40C - 85C
X5165S8I-2.7T1
14L TSSOP
0C - 70C
X5163V14-2.7
X5165V14-2.7
0C - 70C
X5163V14-2.7T1
X5165V14-2.7T1
-40C - 85C
X5163V14I-2.7
X5165V14I-2.7
X5163, X5165
20
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8128.1
May 16, 2005
Part Mark Information
Blank = 8-Lead SOIC
V = 14 Lead TSSOP
Blank = 5V 10%, 0C to +70C, V
TRIP
= 4.25-4.5
A = 5V10%, 0C to +70C, V
TRIP
= 4.5-4.75
I = 5V 10%, -40C to +85C, V
TRIP
= 4.25-4.5
IA = 5V 10%, -40C to +85C, V
TRIP
= 4.5-4.75
F = 2.7V to 5.5V, 0C to +70C, V
TRIP
= 2.55-2.7
FA = 2.7V to 5.5V, 0C to +70C, V
TRIP
= 2.85-3.0
G = 2.7V to 5.5V, -40C to +85C, V
TRIP
= 2.55-2.7
GA = 2.7V to 5.5V, -40C to +85C, V
TRIP
= 2.85-3.0
W
X5163, X51665
X
X5163, X5165