irf9140
Absolute Maximum Ratings
Parameter
Units
ID @ VGS = 10V, TC = 25C
Continuous Drain Current
2.25
ID @ VGS = 10V, TC = 100C
Continuous Drain Current
1.50
IDM
Pulsed Drain Current
9.0
PD @ TC = 25C
Max. Power Dissipation
1 5
W
Linear Derating Factor
0.12
W/C
VGS
Gate-to-Source Voltage
20
V
EAS
Single Pulse Avalanche Energy
4 8
mJ
IAR
Avalanche Current
--
A
EAR
Repetitive Avalanche Energy
--
mJ
dv/dt
Peak Diode Recovery dv/dt
5.0
V/ns
T J
Operating Junction
-55 to 150
TSTG
Storage Temperature Range
Lead Temperature
300 (0.063 in. (1.6mm) from case for 10s)
Weight
0.98(typical)
g
PD - 90424C
The HEXFET
technology is the key to International
Rectifier's advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
"State of the Art" design achieves: very low on-state resis-
tance combined with high transconductance.
The HEXFET transistors also feature all of the well
established advantages of MOSFETs such as volt-
age control, very fast switching, ease of parelleling
and temperature stability of the electrical parameters.
They are well suited for applications such as switch-
ing power supplies, motor controls, inverters, chop-
pers, audio amplifiers and high energy pulse circuits.
o
C
A
01/22/01
www.irf.com
1
TO-39
Product Summary
Part Number BVDSS R
DS(on)
I
D
IRFF210 200V 1.5
2.25A
Features:
n
Repetitive Avalanche Ratings
n
Dynamic dv/dt Rating
n
Hermetically Sealed
n
Simple Drive Requirements
n
Ease of Paralleling
For footnotes refer to the last page
IRFF210
REPETITIVE AVALANCHE AND dv/dt RATED
JANTX2N6784
HEXFET
TRANSISTORS
JANTXV2N6784
THRU-HOLE (TO-205AF)
REF:MIL-PRF-19500/556
200V, N-CHANNEL
IRFF210
2
www.irf.com
Thermal Resistance
Parameter
Min Typ Max
Units
Test Conditions
RthJC
Junction-to-Case
--
--
8.3
RthJA
Junction-to-Ambient
--
-- 175
Typical socket mount.
C/W
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ
Max Units
Test Conditions
IS
Continuous Source Current (Body Diode)
--
--
2.25
ISM
Pulse Source Current (Body Diode)
--
--
9.0
VSD
Diode Forward Voltage
--
--
1.5
V
T
j
= 25C, IS =2.25A, VGS = 0V
trr
Reverse Recovery Time
--
--
350
nS
Tj = 25C, IF = 2.25A, di/dt
100A/
s
QRR
Reverse Recovery Charge
--
--
3.0
C
VDD
50V
t o n
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
Electrical Characteristics
@ Tj = 25C (Unless Otherwise Specified)
Parameter
Min
Typ
Max Units
Test Conditions
BVDSS
Drain-to-Source Breakdown Voltage
2 00
--
--
V
VGS = 0V, ID = 1.0mA
BVDSS/
TJ
Temperature Coefficient of Breakdown
--
0.25
--
V/C
Reference to 25C, ID = 1.0mA
Voltage
RDS(on)
Static Drain-to-Source On-State
--
--
1.5 VGS = 10V, ID = 1.50A
Resistance
--
-- 1.725
VGS =10V, ID = 2.25A
VGS(th)
Gate Threshold Voltage
2.0
--
4.0 V VDS = VGS, ID = 250
A
gfs
Forward Transconductance
0.9
--
--
S (
)
VDS > 15V, IDS = 1.50A
IDSS
Zero Gate Voltage Drain Current
--
--
2 5
VDS= 160V, VGS=0V
--
--
2 5 0
A
VDS = 160V
VGS = 0V, TJ = 125C
IGSS
Gate-to-Source Leakage Forward
--
--
1 0 0
VGS = 20V
IGSS
Gate-to-Source Leakage Reverse
--
--
-100
nA
VGS = -20V
Qg
Total Gate Charge
4.3
--
6.2
VGS =10V, ID = 2.25A
Qgs
Gate-to-Source Charge
0.7
--
1.2
nC
VDS=100V
Qgd
Gate-to-Drain (`Miller') Charge
0.5
--
5.0
td
(on)
Turn-On Delay Time
--
--
1 5
VDD = 100V, ID = 2.25A,
t r
Rise Time
--
--
2 0
RG = 7.5
td
(off)
Turn-Off Delay Time
--
--
3 0
tf
Fall Time
--
--
2 0
LS + LD
Total Inductance
--
7.0
--
Ciss
Input Capacitance
--
140
VGS = 0V, VDS = 25V
Coss
Output Capacitance
--
5 5
--
pF
f = 1.0MHz
Crss
Reverse Transfer Capacitance
--
8.6
--
nH
n s
Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in. from
package)
www.irf.com
3
IRFF210
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
IRFF210
4
www.irf.com
Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
13 a& b
13 a& b
13 a& b
www.irf.com
5
IRFF210
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig 10b. Switching Time Waveforms
V
DS
Pulse Width
1
s
Duty Factor
0.1 %
R
D
V
GS
R
G
D.U.T.
10V
+
-
V
DD
PDF 
ZIP