IRHNA9064.pmd

Absolute Maximum Ratings

Parameter

Units

ID @ VGS = -12V, TC = 25°C

Continuous Drain Current

-48

ID @ VGS = -12V, TC = 100°C Continuous Drain Current

-30

IDM

Pulsed Drain Current

-192

PD @ TC = 25°C

Max. Power Dissipation

300

Linear Derating Factor

2.4

W/°C

VGS

Gate-to-Source Voltage

±20

EAS

Single Pulse Avalanche Energy

500

IAR

Avalanche Current

-48

EAR

Repetitive Avalanche Energy

dv/dt

Peak Diode Recovery dv/dt

-4.4

V/ns

T J

Operating Junction

-55 to 150

TSTG

Storage Temperature Range

Package Mounting Surface Temperature

300 (for 5 Sec.)

Weight

3.3 (typical)

PD - 91447C

Pre-Irradiation

International Rectifier's RAD-Hard HEXFET

technol-

ogy provides high performance power MOSFETs for
space applications. This technology has over a de-
cade of proven performance and reliability in satellite
applications. These devices have been character-
ized for both Total Dose and Single Event Effects (SEE).
The combination of low Rds(on) and low gate charge
reduces the power losses in switching applications
such as DC to DC converters and motor control. These
devices retain all of the well established advantages
of MOSFETs such as voltage control, fast switching,
ease of paralleling and temperature stability of elec-
trical parameters.

02/18/03

www.irf.com

SMD-2

Product Summary

Part Number Radiation Level R

DS(on)

QPL Part Number

IRHNA9064 100K Rads (Si)

0.045

-48A

JANSR2N7424U

IRHNA93064 300K Rads (Si)

0.045

-48A

JANSF2N7424U

Features:

Single Event Effect (SEE) Hardened

Low R

DS(on)

Low Total Gate Charge

Proton Tolerant

Simple Drive Requirements

Ease of Paralleling

Hermetically Sealed

Ceramic Package

Light Weight

Surface Mount

For footnotes refer to the last page

IRHNA9064

JANSR2N7424U

RADIATION HARDENED

60V, P-CHANNEL

POWER MOSFET

REF: MIL-PRF-19500/655

SURFACE MOUNT (SMD-2)

RAD-Hard

HEXFET

ECHNOLOGY

IRHNA9064

Pre-Irradiation

www.irf.com

Electrical Characteristics

@ Tj = 25°C (Unless Otherwise Specified)

Parameter

Min

Typ Max Units

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

-60

VGS = 0V, ID =-1.0mA

BVDSS/

TJ Temperature Coefficient of Breakdown

-0.055

V/°C

Reference to 25°C, ID = -1.0mA

Voltage

RDS(on)

Static Drain-to-Source On-State

0.045

VGS = -12V, ID = -30A

Resistance -- -- 0.048

VGS = -12V, ID = -48A

VGS(th)

Gate Threshold Voltage

-2.0

-4.0

VDS = VGS, ID = -1.0mA

gfs

Forward Transconductance

S (

)

VDS >-15V, IDS = -30A

IDSS

Zero Gate Voltage Drain Current

-25

VDS= -48V ,VGS=0V

-250

VDS = -48V,

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

-100

VGS = -20V

IGSS

Gate-to-Source Leakage Reverse

100

VGS = 20V

Total Gate Charge

300

VGS =-12V, ID = -48A

Qgs

Gate-to-Source Charge

VDS = -30V

Qgd

Gate-to-Drain (`Miller') Charge

(on)

Turn-On Delay Time

VDD = -30V, ID = -48A,

Rise Time

150

VGS =-12V, RG = 2.35

(off)

Turn-Off Delay Time

200

Fall Time

200

LS + LD

Total Inductance

4.0

Ciss

Input Capacitance

6700

VGS = 0V, VDS = -25V

Coss

Output Capacitance

2800

f = 1.0MHz

Crss

Reverse Transfer Capacitance

920

Thermal Resistance

Parameter

Min Typ Max Units

Test Conditions

RthJC

Junction-to-Case

0.42

RthJ-PCB

Junction-to-PC board

1.6

Soldered to a 1" square copper-clad board

Source-Drain Diode Ratings and Characteristics

Parameter

Min Typ

Max Units

Test Conditions

Continuous Source Current (Body Diode)

-48

ISM

Pulse Source Current (Body Diode)

-192

VSD

Diode Forward Voltage

-3.0

= 25°C, IS = -48A, VGS = 0V

trr

Reverse Recovery Time

270

Tj = 25°C, IF = -48A, di/dt

-100A/

QRR Reverse Recovery Charge

2.5

µC

VDD

-50V

ton

Forward Turn-On Time

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page

Measured from drain lead (6mm/0.25in. from

package) to source lead (6mm/0.25in. from

package)

°C/W

www.irf.com

Pre-Irradiation

IRHNA9064

Table 1. Electrical Characteristics @ Tj = 25°C, Post Total Dose Irradiation

Parameter

100K Rads(Si)

300K Rads (Si)

Units

Test Conditions

Min Max Min Max
BV

DSS

Drain-to-Source Breakdown Voltage -60 -- -60 -- V V

= 0V, I

= -1.0mA

GS(th)

Gate Threshold Voltage

-2.0 -4.0 -2.0 -5.0 V

= V

, I

= -1.0mA

GSS

Gate-to-Source Leakage Forward

-- -100 -- -100 nA

= -20V

GSS

Gate-to-Source Leakage Reverse

-- 100 -- 100

= 20 V

DSS

Zero Gate Voltage Drain Current

-- -25 -- -25 µA

=-48V, V

=0V

DS(on)

Static Drain-to-Source

-- 0.045 -- 0.045

= -12V, I

=-30A

On-State Resistance (TO-3)

DS(on)

Static Drain-to-Source

-- 0.045 -- 0.045

= -12V, I

=-30A

On-State Resistance (SMD-2)

International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability.
The hardness assurance program at International Rectifier is comprised of two radiation environments.
Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-3 package. Both
pre- and post-irradiation performance are tested and specified using the same drive circuitry and test
conditions in order to provide a direct comparison.

Radiation Characteristics

1. Part number IRHNA9064 (JANSR2N7424U)
2. Part number IRHNA93064 (JANSF2N7424U)

Fig a. Single Event Effect, Safe Operating Area

International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for
Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.

Table 2. Single Event Effect Safe Operating Area

For footnotes refer to the last page

Diode Forward Voltage

-- -3.0 -- - 3.0 V

= 0V, IS = -48A

)

(

)

(

)

(

)

(

-80

-60

-40

-20

VGS

VDS

IRHNA9064

Pre-Irradiation

www.irf.com

Fig 4. Normalized On-Resistance

Vs. Temperature

Fig 2. Typical Output Characteristics

Fig 1. Typical Output Characteristics

Fig 3. Typical Transfer Characteristics

100

1000

0.1

100

20µs PULSE WIDTH
T = 25 C

TOP

BOTTOM

VGS
-15V
-12V
-10V
-9.0V
-8.0V
-7.0V
-6.0V
-5.0V

-V , Drain-to-Source Voltage (V)

-I , Drain-to-Source Current (A)

-5.0V

100

1000

0.1

100

20µs PULSE WIDTH
T = 150 C

TOP

BOTTOM

VGS
-15V
-12V
-10V
-9.0V
-8.0V
-7.0V
-6.0V
-5.0V

-V , Drain-to-Source Voltage (V)

-I , Drain-to-Source Current (A)

-5.0V

100

1000

V = -25V
20µs PULSE WIDTH

-V , Gate-to-Source Voltage (V)

-I , Drain-to-Source Current (A)

T = 25 C

T = 150 C

-60 -40 -20

80 100 120 140 160

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

T , Junction Temperature ( C)

R , Drain-to-Source On Resistance

(Normalized)

DS(on)

I =

-12V

-48A

www.irf.com

Pre-Irradiation

IRHNA9064

Fig 8. Maximum Safe Operating Area

Fig 6. Typical Gate Charge Vs.

Gate-to-Source Voltage

Fig 5. Typical Capacitance Vs.

Drain-to-Source Voltage

Fig 7. Typical Source-Drain Diode

Forward Voltage

100

2000

4000

6000

8000

10000

12000

-V , Drain-to-Source Voltage (V)

C, Capacitance (pF)

V
C
C
C

=
=
=
=

0V,
C
C
C

f = 1MHz

+ C

C SHORTED

GS
iss

gd ,

rss

oss

iss

oss

rss

100

150

200

250

300

350

Q , Total Gate Charge (nC)

-V , Gate-to-Source Voltage (V)

FOR TEST CIRCUIT

SEE FIGURE

I =

-48A

= -30V

= -48V

100

1000

0.0

1.0

2.0

3.0

4.0

5.0

-V ,Source-to-Drain Voltage (V)

-I , Reverse Drain Current (A)

V = 0 V

T = 25 C

T = 150 C

100

1000

100

1000

OPERATION IN THIS AREA LIMITED

BY R

DS(on)

Single Pulse

= 150 C

= 25 C

-V , Drain-to-Source Voltage (V)

-I , Drain Current (A)
I , Drain Current (A)

100us

1ms

10ms

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