/home/web/doc/html/irf/175630
Absolute Maximum Ratings
Parameter
Units
ID @ VGS = 10V, TC = 25C
Continuous Drain Current
14
ID @ VGS = 10V, TC = 100C Continuous Drain Current
9.0
IDM
Pulsed Drain Current
56
PD @ TC = 25C
Max. Power Dissipation
150
W
Linear Derating Factor
1.2
W/C
VGS
Gate-to-Source Voltage
20
V
EAS
Single Pulse Avalanche Energy
700
mJ
IAR
Avalanche Current
14
A
EAR
Repetitive Avalanche Energy
15
mJ
dv/dt
Peak Diode Recovery dv/dt
4.0
V/ns
T J
Operating Junction
-55 to 150
TSTG
Storage Temperature Range
Package Mounting Surface Temperature
300(for 5 seconds)
Weight
2.6 (Typical)
g
PD - 91551C
HEXFET
MOSFET technology is the key to International
Rectifier's advanced line of power MOSFET transistors. The
efficient geometry design achieves very low on-state re-
sistance combined with high transconductance.
HEXFET
transistors also feature all of the well-established advan-
tages of MOSFETs, such as voltage control, very fast switch-
ing, ease of paralleling and electrical parameter temperature
stability. They are well-suited for applications such as switch-
ing power supplies, motor controls, inverters, choppers,
audio amplifiers, high energy pulse circuits, and virtually
any application where high reliability is required. The
HEXFET
transistor's totally isolated package eliminates the
need for additional isolating material between the device
and the heatsink. This improves thermal efficiency and
reduces drain capacitance.
o
C
A
POWER MOSFET
SURFACE MOUNT(SMD-1)
1/25/01
www.irf.com
1
SMD-1
Product Summary
Part Number R
DS(on)
I
D
IRFN350 0.315
14A
Features:
n
Simple Drive Requirements
n
Ease of Paralleling
n
Hermetically Sealed
n
Electrically Isolated
n
Surface Mount
n
Dynamic dv/dt Rating
n
Light-weight
For footnotes refer to the last page
IRFN350
JANTX2N7227U
JANTXV2N7227U
REF:MIL-PRF-19500/592
400V, N-CHANNEL
HEXFET
MOSFET TECHNOLOGY
IRFN350
2
www.irf.com
Electrical Characteristics
@ Tj = 25C (Unless Otherwise Specified)
Parameter
Min
Typ Max Units
Test Conditions
BVDSS
Drain-to-Source Breakdown Voltage
400
--
--
V
VGS = 0V, ID = 1.0mA
BVDSS/
TJ Temperature Coefficient of Breakdown
--
0.46
--
V/C
Reference to 25C, ID = 1.0mA
Voltage
RDS(on)
Static Drain-to-Source On-State
--
--
0.315
VGS = 10V, ID = 9.0A
Resistance
--
--
0.415
VGS = 10V, ID = 14A
VGS(th)
Gate Threshold Voltage
2.0
--
4.0
V
VDS = VGS, ID = 250A
gfs
Forward Transconductance
6.0
--
--
S (
)
VDS > 15V, IDS = 9.0A
IDSS
Zero Gate Voltage Drain Current
--
--
25
VDS= 320V ,VGS=0V
--
--
250
VDS = 320V,
VGS = 0V, TJ = 125C
IGSS
Gate-to-Source Leakage Forward
--
--
100
VGS = 20V
IGSS
Gate-to-Source Leakage Reverse
--
--
-100
VGS = -20V
Qg
Total Gate Charge
--
--
110
VGS =10V, ID = 14A
Qgs
Gate-to-Source Charge
--
--
18
nC
VDS =200V
Qgd
Gate-to-Drain (`Miller') Charge
--
--
65
td
(on)
Turn-On Delay Time
--
--
35
VDD = 200V, ID = 14A,
tr
Rise Time
--
--
190
VGS =10V, RG = 2.35
td
(off)
Turn-Off Delay Time
--
--
170
tf
Fall Time
--
--
130
LS + LD
Total Inductance
--
4.0
--
Ciss
Input Capacitance
--
2600
--
VGS = 0V, VDS = 25V
Coss
Output Capacitance
--
680
--
pF
f = 1.0MHz
Crss
Reverse Transfer Capacitance
--
250
--
nA
nH
ns
A
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
Thermal Resistance
Parameter
Min Typ Max
Units
Test Conditions
RthJC
Junction-to-Case
--
--
0.83
RthJ-PCB
Junction-to-PC board
--
3.0
--
Soldered to a copper-clad PC board
C/W
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
Test Conditions
IS
Continuous Source Current (Body Diode)
--
--
14
ISM
Pulse Source Current (Body Diode)
--
--
56
VSD
Diode Forward Voltage
--
--
1.7
V
T
j
= 25C, IS = 14A, VGS = 0V
trr
Reverse Recovery Time
--
--
1200
nS
Tj = 25C, IF = 14A, di/dt
100A/
s
QRR Reverse Recovery Charge
--
--
11
C
VDD
30V
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
Measured from the center of drain
pad to center of source pad.
www.irf.com
3
IRFN350
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
IRFN350
4
www.irf.com
Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
13a & b
www.irf.com
5
IRFN350
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig 10b. Switching Time Waveforms
V
DS
Pulse Width
1
s
Duty Factor
0.1 %
R
D
V
GS
R
G
D.U.T.
10V
+
-
V
DD
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
PDF 
ZIP