IRLR/U2703
HEXFET
Power MOSFET
S
D
G
Parameter
Typ.
Max.
Units
R
JC
Junction-to-Case
3.3
R
JA
Case-to-Ambient (PCB mount)**
50
C/W
R
JA
Junction-to-Ambient
110
Thermal Resistance
V
DSS
= 30V
R
DS(on)
= 0.045
I
D
= 23A
Description
7/30/03
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1
D-Pak
TO-252AA
I-Pak
TO-251AA
l
Logic-Level Gate Drive
l
Ultra Low On-Resistance
l
Surface Mount (IRLR2703)
l
Straight Lead (IRLU2703)
l
Advanced Process Technology
l
Fast Switching
l
Fully Avalanche Rated
Fifth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve the lowest possible on-resistance per
silicon area. This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs are well known for,
provides the designer with an extremely efficient device for use in a wide
variety of applications.
The D-PAK is designed for surface mounting using vapor phase, infrared, or
wave soldering techniques. The straight lead version (IRFU series) is for
through-hole mounting applications. Power dissipation levels up to 1.5 watts
are possible in typical surface mount applications.
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
Parameter
Max.
Units
I
D
@ T
C
= 25C
Continuous Drain Current, V
GS
@ 10V
23
I
D
@ T
C
= 100C
Continuous Drain Current, V
GS
@ 10V
16
A
I
DM
Pulsed Drain Current
96
P
D
@T
C
= 25C
Power Dissipation
45
W
Linear Derating Factor
0.30
W/C
V
GS
Gate-to-Source Voltage
16
V
E
AS
Single Pulse Avalanche Energy
77
mJ
I
AR
Avalanche Current
14
A
E
AR
Repetitive Avalanche Energy
4.5
mJ
dv/dt
Peak Diode Recovery dv/dt
5.0
V/ns
T
J
Operating Junction and
-55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
C
Absolute Maximum Ratings
PD- 91335D
IRLR/U2703
2
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S
D
G
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current
integral reverse
(Body Diode)
p-n junction diode.
V
SD
Diode Forward Voltage
1.3
V
T
J
= 25C, I
S
= 14A, V
GS
= 0V
t
rr
Reverse Recovery Time
65
97
ns
T
J
= 25C, I
F
= 14A
Q
rr
Reverse RecoveryCharge
140
210
nC
di/dt = 100A/s
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
23
96
A
V
DD
= 15V, starting T
J
= 25C, L =570H
R
G
= 25
, I
AS
= 14A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Pulse width
300s; duty cycle
2%.
This is applied for I-PAK, L
S
of D-PAK is measured
between lead and center of die contact.
Uses IRL2703 data and test conditions.
I
SD
14A, di/dt
140A/s, V
DD
V
(BR)DSS
,
T
J
175C
Notes:
Caculated continuous current based on maximum allowable
junction temperature; Package limitation current = 20A.
Parameter
Min.
Typ. Max. Units
Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage
30
V
V
GS
= 0V, I
D
= 250A
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
0.030
V/C
Reference to 25C, I
D
= 1mA
0.045
V
GS
= 10V, I
D
= 14A
0.065
V
GS
= 4.5V, I
D
= 12A
V
GS(th)
Gate Threshold Voltage
1.0
V
V
DS
= V
GS
, I
D
= 250A
g
fs
Forward Transconductance
6.4
S
V
DS
= 25V, I
D
= 14A
25
A
V
DS
= 30V, V
GS
= 0V
250
V
DS
= 24V, V
GS
= 0V, T
J
= 150C
Gate-to-Source Forward Leakage
100
nA
V
GS
= 16V
Gate-to-Source Reverse Leakage
-100
V
GS
= -16V
Q
g
Total Gate Charge
15
I
D
= 14A
Q
gs
Gate-to-Source Charge
4.6
nC
V
DS
= 24V
Q
gd
Gate-to-Drain ("Miller") Charge
9.3
V
GS
= 4.5V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time
8.5
V
DD
= 15V
t
r
Rise Time
140
ns
I
D
= 14A
t
d(off)
Turn-Off Delay Time
12
R
G
= 12
,
V
GS
= 4.5V
t
f
Fall Time
20
R
D
= 1.0
,
See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance
450
V
GS
= 0V
C
oss
Output Capacitance
210
pF
V
DS
= 25V
C
rss
Reverse Transfer Capacitance
110
= 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25C (unless otherwise specified)
nH
I
GSS
S
D
G
L
S
Internal Source Inductance
7.5
R
DS(on)
Static Drain-to-Source On-Resistance
L
D
Internal Drain Inductance
4.5
I
DSS
Drain-to-Source Leakage Current
IRLR/U2703
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3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.1
1
10
100
1000
0.1
1
10
100
I , D
r
a
i
n
-
to
-S
o
u
rc
e
C
u
rre
n
t
(A
)
D
V , Drain-to-Source Voltage (V)
DS
A
20s PULSE WIDTH
T = 25C
J
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
0.1
1
10
100
1000
0.1
1
10
100
I , D
r
a
i
n
-
to
-S
o
u
rc
e
C
u
rre
n
t
(A
)
D
V , Drain-to-Source Voltage (V)
DS
A
20s PULSE WIDTH
T = 175C
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
J
0.1
1
10
100
2
3
4
5
6
7
8
9
10
T = 25C
J
GS
V , Gate-to-Source Voltage (V)
D
I
,
Dra
i
n
-
to
-So
u
r
c
e
Cu
rr
e
n
t
(
A
)
T = 175C
J
A
V = 15V
20s PULSE WIDTH
DS
0.0
0.5
1.0
1.5
2.0
-60 -40 -20
0
20
40
60
80
100 120 140 160 180
J
T , Junction Temperature (C)
R
, D
r
a
i
n
-
to
-S
o
u
rc
e
O
n
R
e
s
i
s
t
a
n
c
e
DS
(
o
n)
(
N
or
m
a
l
i
z
ed)
V = 10V
GS
A
I = 24A
D
23A
IRLR/U2703
4
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Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
Fig 8. Maximum Safe Operating Area
0
200
400
600
800
1000
1
10
100
C
,
C
a
p
a
c
i
ta
n
c
e
(p
F
)
DS
V , Drain-to-Source Voltage (V)
A
V = 0V, f = 1MHz
C = C + C , C SHORTED
C = C
C = C + C
GS
iss gs gd ds
rss gd
oss ds gd
C
iss
C
oss
C
rss
0
3
6
9
12
15
0
4
8
12
16
20
Q , Total Gate Charge (nC)
G
V
, G
a
te
-to
-
S
o
u
r
c
e
V
o
lta
g
e
(V
)
GS
A
FOR TEST CIRCUIT
SEE FIGURE 13
V = 24V
V = 15V
I = 14A
DS
DS
D
1
10
100
0.4
0.8
1.2
1.6
2.0
2.4
T = 25C
J
V = 0V
GS
V , Source-to-Drain Voltage (V)
I
, R
e
v
e
rs
e
D
r
a
i
n
C
u
r
r
e
n
t (
A
)
SD
SD
A
T = 175C
J
1
10
100
1000
1
10
100
V , Drain-to-Source Voltage (V)
DS
I
, D
r
a
i
n
C
u
rre
n
t
(A
)
OPERATION IN THIS AREA LIMITED
BY R
D
DS(on)
10s
100s
1ms
10ms
A
T = 25C
T = 175C
Single Pulse
C
J
IRLR/U2703
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5
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig 10b. Switching Time Waveforms
V
DS
Pulse Width 1 s
Duty Factor 0.1 %
R
D
V
GS
R
G
D.U.T.
4.5V
+
-
V
DD
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
0.01
0.1
1
10
0.00001
0.0001
0.001
0.01
0.1
1
t , Rectangular Pulse Duration (sec)
1
th
J
C
D = 0.50
0.01
0.02
0.05
0.10
0.20
SINGLE PULSE
(THERMAL RESPONSE)
A
T
h
e
r
m
a
l R
e
s
p
o
n
s
e
(Z
)
P
t
2
1
t
DM
Notes:
1. Duty factor D = t / t
2. Peak T = P x Z + T
1
2
J
DM
thJC
C
25
50
75
100
125
150
175
0
5
10
15
20
25
T , Case Temperature ( C)
I , Drain Current (A)
C
D
LIMITED BY PACKAGE
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