ChipFind - документация

Электронный компонент: IS61LV12824-9B

Скачать:  PDF   ZIP
IS61LV12824
ISSI
Integrated Silicon Solution, Inc. -- 1-800-379-4774
1
Rev. B
04/17/01
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any
errors which may appear in this publication. Copyright 2001, Integrated Silicon Solution, Inc.
FEATURES
High-speed access time: 8, 9, 10, 12 ns
CMOS low power operation
-- 756 mW (max.) operating @ 8 ns
-- 36 mW (max.) standby @ 8 ns
TTL compatible interface levels
Single 3.3V power supply
Fully static operation: no clock or refresh
required
Three state outputs
Available in 119-pin Plastic Ball Grid Array
(PBGA) and 100-pin TQFP packages.
Industrial temperature available
DESCRIPTION
The
ISSI
IS61LV12824 is a high-speed, static RAM organized
as 131,072 words by 24 bits. It is fabricated using
ISSI
's high-
performance CMOS technology. This highly reliable process
coupled with innovative circuit design techniques, yields ac-
cess times as fast as 8 ns with low power consumption.
When
CE1, CE2 are HIGH and CE2 is LOW (deselected), the
device assumes a standby mode at which the power dissipa-
tion can be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs,
CE1, CE2, CE2 and OE. The active
LOW Write Enable (
WE) controls both writing and reading of
the memory.
The IS61LV12824 is packaged in the JEDEC standard
119-pin PBGA and 100-pin TQFP.
FUNCTIONAL BLOCK DIAGRAM
DECEMBER 1999
A0-A16
CE1
OE
WE
128K x 24
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
VCC
I/O
DATA
CIRCUIT
CE2
CE2
I/O0-I/O23
128K x 24 HIGH-SPEED CMOS STATIC RAM
WITH 3.3V SUPPLY
IS61LV12824
ISSI
2
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. B
04/17/01
PIN CONFIGURATION - 119-pin PBGA
PIN DESCRIPTIONS
A0-A16
Address Inputs
I/O0-I/O23 Data Inputs/Outputs
CE1, CE2 Chip Enable Input LOW
CE2
Chip Enable Input HIGH
OE
Output Enable Input
WE
Write Enable Input
NC
No Connection
Vcc
Power
V
CCQ
I/O Power
GND
Ground
1
2
3
4
5
6
7
A
NC
A11
A14
A15
A16
A4
NC
B
NC
A12
A13
CE1
A5
A3
NC
C
I/O16
NC
CE2
NC
CE2
NC
I/O0
D
I/O17
V
CCQ
GND
GND
GND
V
CCQ
I/O1
E
I/O18
GND
V
CC
GND
V
CC
GND
I/O2
F
I/O19
V
CCQ
GND
GND
GND
V
CCQ
I/O3
G
I/O20
GND
V
CC
GND
V
CC
GND
I/O4
H
I/O21
V
CCQ
GND
GND
GND
V
CCQ
I/O5
J
V
CCQ
GND
V
CC
GND
V
CC
GND
V
CCQ
K
I/O22
V
CCQ
GND
GND
GND
V
CCQ
I/O6
L
I/O23
GND
V
CC
GND
V
CC
GND
I/O7
M
I/O12
V
CCQ
GND
GND
GND
V
CCQ
I/O8
N
I/O13
GND
V
CC
GND
V
CC
GND
I/O9
P
I/O14
V
CCQ
GND
GND
GND
V
CCQ
I/O10
R
I/O15
NC
NC
NC
NC
NC
I/O11
T
NC
A10
A8
WE
A0
A1
NC
U
NC
A9
A7
OE
A6
A2
NC
IS61LV12824
1
2
3
4
5
6
7
8
9
10
11
12
ISSI
Integrated Silicon Solution, Inc. -- 1-800-379-4774
3
Rev. B
04/17/01
PIN CONFIGURATION
100-Pin TQFP
NC
Vcc
GND
I/O0
I/O1
GND
Vcc
Q
I/O2
I/O3
GND
Vcc
Q
I/O4
I/O5
Vcc
NC
NC
GND
I/O6
I/O7
Vcc
Q
GND
I/O8
I/O9
Vcc
Q
GND
I/O10
I/O11
Vcc
GND
NC
NC
NC
A11
A12
A13
A14
A15
CE2
Vcc
GND
CE2
CE1
A16
A5
A4
A3
NC
NC
NC
NC
NC
Vcc
GND
I/O16
I/O17
GND
Vcc
Q
I/O18
I/O19
GND
Vcc
Q
I/O20
I/O21
Vcc
NC
NC
GND
I/O22
I/O23
Vcc
Q
GND
I/O12
I/O13
Vcc
Q
GND
I/O14
I/O15
Vcc
GND
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45
NC
NC
NC
NC
A10
A9
A8
A7
OE
GND
Vcc
WE
A6
A0
A1
A2
NC
NC
NC
NC
46 47 48 49 50
IS61LV12824
ISSI
4
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. B
04/17/01
OPERATING RANGE
Range
Ambient Temperature
V
CC
(8, 9 ns)
V
CC
(10, 12 ns)
Commercial
0C to +70C
3.3V + 10%, 5%
3.3V 10%
Industrial
40C to +85C
3.3V + 10%, 5%
3.3V 10%
DC ELECTRICAL CHARACTERISTICS
(Over Operating Range)
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
V
OH
Output HIGH Voltage
V
CC
= Min., I
OH
= 4.0 mA
2.4
--
V
V
OL
Output LOW Voltage
V
CC
= Min., I
OL
= 8.0 mA
--
0.4
V
V
IH
Input HIGH Voltage
2.2
V
CC
+ 0.3
V
V
IL
Input LOW Voltage
(1)
0.3
0.8
V
I
LI
Input Leakage
GND
V
IN
V
CC
1
1
A
I
LO
Output Leakage
GND
V
OUT
V
CC
, Outputs Disabled
1
1
A
Note:
1. V
IL
(min.) = 0.3V DC; V
IL
(min.) = 2.0V AC (pulse width
2.0 ns).
V
IH
(max.) = V
CC
+ 0.3V DC; V
IH
(max.) = V
CC
+ 2.0V AC (pulse width
2.0 ns).
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
Parameter
Value
Unit
V
CC
Power Supply Voltage Relative to GND
0.5 to 5.0
V
V
TERM
Terminal Voltage with Respect to GND
0.5 to Vcc + 0.5
V
T
STG
Storage Temperature
65 to + 150
C
T
BIAS
Temperature Under Bias:
Com.
10 to + 85
C
Ind.
45 to + 90
C
P
T
Power Dissipation
2.0
W
I
OUT
DC Output Current
20
mA
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at these or
any other conditions above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
TRUTH TABLE
Mode
WE
CE1
CE2
CE2
OE
I/O0-I/O23
Vcc Current
Not Selected
X
H
X
X
X
High-Z
I
SB
1
, I
SB
2
X
X
L
X
X
X
X
X
H
X
Output Disabled
H
L
H
L
H
High-Z
I
CC
Read
H
L
H
L
L
D
OUT
I
CC
Write
L
L
H
L
X
D
IN
I
CC
IS61LV12824
1
2
3
4
5
6
7
8
9
10
11
12
ISSI
Integrated Silicon Solution, Inc. -- 1-800-379-4774
5
Rev. B
04/17/01
CAPACITANCE
(1)
Symbol
Parameter
Conditions
Max.
Unit
C
IN
Input Capacitance
V
IN
= 0V
6
pF
C
OUT
Input/Output Capacitance
V
OUT
= 0V
8
pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
-8 ns
-9 ns
-10 ns
-12 ns
Symbol Parameter
Test Conditions
Min. Max.
Min. Max.
Min. Max.
Min. Max.
Unit
I
CC
Vcc Dynamic Operating V
CC
= Max.,
Com.
--
210
--
200
--
180
--
170
mA
Supply Current
I
OUT
= 0 mA, f = f
MAX
Ind.
--
--
--
220
--
210
--
190
I
SB
1
TTL Standby Current
V
CC
= Max.,
Com.
--
70
--
60
--
50
--
50
mA
(TTL Inputs)
V
IN
= V
IH
or V
IL
, f = max.
Ind.
--
--
--
70
--
55
--
55
CE1, CE2,
V
IH
, CE2
V
IL
I
SB
2
CMOS Standby
V
CC
= Max.,
Com.
--
10
--
10
--
10
--
10
mA
Current (CMOS Inputs)
CE1, CE2
V
CC
0.2V,
Ind.
--
--
--
20
--
20
--
20
CE2
0.2V, V
IN
V
CC
0.2V,
or V
IN
0.2V, f = 0
Note:
1. At f = f
MAX
, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
AC TEST CONDITIONS
Parameter
Unit
Input Pulse Level
0V to 3.0V
Input Rise and Fall Times
2 ns
Input and Output Timing
1.5V
and Reference Level
Output Load
See Figures 1 and 2
AC TEST LOADS
Figure 1
Figure 2
319
5 pF
Including
jig and
scope
353
OUTPUT
3.3V
OUTPUT
Z
O
= 50
1.5V
50
IS61LV12824
ISSI
6
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. B
04/17/01
READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
-8
-9
-10
-12
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
t
RC
Read Cycle Time
8
--
9
--
10
--
12
--
ns
t
AA
Address Access Time
--
8
--
9
--
10
--
12
ns
t
OHA
Output Hold Time
3
--
3
--
3
--
3
--
ns
t
ACE
CE1, CE2 Access Time
8
--
--
9
--
10
--
12
ns
t
ACE
2
CE2 Access Time
t
DOE
OE Access Time
--
4
--
4
--
4
--
4
ns
t
HZOE
(2)
OE to High-Z Output
0
3
0
3
0
3
0
3
ns
t
LZOE
(2)
OE to Low-Z Output
0
--
0
--
0
--
0
--
ns
t
HZCE
(2)
CE1, CE2 to High-Z Output
0
4
0
5
0
5
0
6
ns
t
HZCE
2
(2)
CE2 to High-Z Output
t
LZCE
(2)
CE, CE2 to Low-Z Output
3
--
3
--
3
--
3
--
ns
t
LZCE
2
(2)
CE2 to Low-Z Output
Notes:
1. Test conditions assume signal transition times of 2 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and
output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured 200 mV from steady-state voltage. Not 100% tested.
IS61LV12824
1
2
3
4
5
6
7
8
9
10
11
12
ISSI
Integrated Silicon Solution, Inc. -- 1-800-379-4774
7
Rev. B
04/17/01
READ CYCLE NO. 2
(1,3)
AC WAVEFORMS
READ CYCLE NO. 1
(1,2)
(Address Controlled) (
CE1 = CE2 = OE = V
IL
; CE2 = V
IH
)
Notes:
1.
WE is HIGH for a Read Cycle.
2. The device is continuously selected.
OE, CE1, CE2 = V
IL
. CE2 = V
IH
.
3. Address is valid prior to or coincident with
CE1, CE2 LOW and CE2 HIGH transition.
DATA VALID
READ1.eps
PREVIOUS DATA VALID
t
AA
t
OHA
t
OHA
t
RC
D
OUT
ADDRESS
t
RC
t
OHA
t
AA
t
DOE
t
LZOE
t
ACS1
t
ACS2
t
LZCS1
t
LZCS2
t
HZOE
HIGH-Z
DATA VALID
ADDRESS
OE
CS1
CS2
D
OUT
t
HZCS1
t
HZCS2
CS2_RD2.eps
IS61LV12824
ISSI
8
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. B
04/17/01
WRITE CYCLE SWITCHING CHARACTERISTICS
(1,3)
(Over Operating Range)
-8
-9
-10
-12
Symbol Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
t
WC
Write Cycle Time
8
--
9
--
10
--
12
--
ns
t
SCE
CE1, CE2 to Write End
7
--
8
--
8
--
9
--
ns
t
SCE
2
CE2 to Write End
7
--
8
--
8
--
9
--
t
AW
Address Setup Time
7
--
8
--
8
--
9
--
ns
to Write End
t
HA
Address Hold from Write End
0
--
0
--
0
--
0
--
ns
t
SA
Address Setup Time
0
--
0
--
0
--
0
--
ns
t
PWE
1
WE Pulse Width (OE = HIGH) 6
--
8
--
8
--
9
--
ns
t
PWE
2
WE Pulse Width (OE = LOW)
6
--
9
--
9
--
10
--
ns
t
SD
Data Setup to Write End
4.5
--
5
--
5
--
5
--
ns
t
HD
Data Hold from Write End
0
--
0
--
0
--
0
--
ns
t
HZWE
(2)
WE LOW to High-Z Output
--
3.5
--
3.5
--
3.5
--
3.5
ns
t
LZWE
(2)
WE HIGH to Low-Z Output
3
--
3
--
3
--
3
--
ns
Notes:
1. Test conditions assume signal transition times of 2 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V
and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured 200 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of
CE1, CE2 LOW, CE2 HIGH and WE LOW. All signals must be in valid
states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are
referenced to the rising or falling edge of the signal that terminates the write.
IS61LV12824
1
2
3
4
5
6
7
8
9
10
11
12
ISSI
Integrated Silicon Solution, Inc. -- 1-800-379-4774
9
Rev. B
04/17/01
WRITE CYCLE NO. 1
(
CE Controlled, OE = HIGH or LOW)
WRITE CYCLE NO. 2
(1)
(
WE Controlled: OE = HIGH during Write Cycle)
DATA UNDEFINED
t
WC
VALID ADDRESS
t
SCE1
t
SCE2
t
PWE1
t
PWE2
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE1
CE2
WE
D
OUT
D
IN
DATA
IN
VALID
t
LZWE
t
SD
CE2_WR1.eps
DATA UNDEFINED
LOW
t
WC
VALID ADDRESS
t
PWE1
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE1
WE
D
OUT
D
IN
OE
DATA
IN
VALID
t
LZWE
t
SD
HIGH
CE2
CE2_WR2.eps
IS61LV12824
ISSI
10
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. B
04/17/01
WRITE CYCLE NO. 3
(1)
(
WE Controlled: OE
I
S
LOW
DURING
W
RITE
C
YLE
)
Note:
1. The internal Write time is defined by the overlap of
CE1 and CE2 = LOW, CE2 = HIGH and WE = LOW. All signals must be
in valid states to initiate a Write, but any can be deasserted to terminate the Write. The Data Input Setup and Hold timing is
referenced to the rising or falling edge of the signal that terminates the Write.
DATA UNDEFINED
t
WC
VALID ADDRESS
LOW
LOW
t
PWE2
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE1
WE
D
OUT
D
IN
OE
DATA
IN
VALID
t
LZWE
t
SD
HIGH
CE2
CE2_WR3.eps
IS61LV12824
1
2
3
4
5
6
7
8
9
10
11
12
ISSI
Integrated Silicon Solution, Inc. -- 1-800-379-4774
11
Rev. B
04/17/01
ORDERING INFORMATION
Commercial Range: 0C to +70C
Speed (ns) Order Part No.
Package
8
IS61LV12824-8B
Plastic Ball Grid Array
IS61LV12824-8TQ
TQFP
9
IS61LV12824-9B
Plastic Ball Grid Array
IS61LV12824-9TQ
TQFP
10
IS61LV12824-10B
Plastic Ball Grid Array
IS61LV12824-10TQ
TQFP
12
IS61LV12824-12B
Plastic Ball Grid Array
IS61LV12824-12TQ
TQFP
ORDERING INFORMATION
Industrial Range: 40C to +85C
Speed (ns) Order Part No.
Package
9
IS61LV12824-9BI
Plastic Ball Grid Array
IS61LV12824-9TQI
TQFP
10
IS61LV12824-10BI
Plastic Ball Grid Array
IS61LV12824-10TQI
TQFP
12
IS61LV12824-12BI
Plastic Ball Grid Array
IS61LV12824-12TQI
TQFP
ISSI
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774
Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com