Integrated Silicon Solution, Inc. -- www.issi.com --
1-800-379-4774
1
PRELIMINARY INFORMATION
Rev. 00B
08/01/02
IS71VPCF32
X
S04
ISSI
Copyright 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
3.0 Volt-Only Flash & SRAM COMBO with Stacked Multi-Chip
Package (MCP) -- 32 Mbit Simultaneous Operation Flash
Memory and 4 Mbit Static RAM
PRELIMINARY INFORMATION
AUGUST 2002
MCP FEATURES
Power supply voltage 2.7V to 3.3V
High performance:
Flash: 70ns maximum access time
SRAM: 70ns maximum access time
Package: 73-ball BGA
Operating Temperature: -40C to +85C
FLASH FEATURES
Power Dissipation:
Read Current at 1 Mhz: 7 mA maximum
Read Current at 5 Mhz: 18 mA maximum
Sleep Mode: 5
A maximum
Simultaneous Read and Write Operations:
Zero latency between read and write operations; Data
can be programmed or erased in one bank while data
is simultaneously being read from the other bank
Low-Power Mode:
A period of no activity causes flash to enter a
low-power state
Erase Suspend/Resume:
Suspends of erase activity to allow a read in the
same bank
Sector Erase Architecture:
8 words of 4k size and 63 words of 32K size (32 Mbit)
Any combination of sectors, or the entire flash can
be simultaneously erased
Erase Algorithms:
Automatically preprograms/erases the flash memory
entirely, or by sector
Program Algorithms:
Automatically writes and verifies data at specified
address
Hidden ROM Region:
64KB with a Factory-serialized secure electronic
serial number (ESN), which is accessible through a
command sequence
Data Polling and Toggle Bit:
Allow for detection of program or erase cycle
completion
Ready-Busy output (RY/
BY
)
Detection of program or erase cycle completion
Over 100,000 write/erase cycles
Low supply voltage (Vccf
2.5V) inhibits writes
WP
/ACC input pin:
If V
IL
, allows protection of boot sectors
If V
IH
, allows removal of boot sector protection
If Vacc, program time is reduced by 40%
Boot sector: Top or Bottom
SRAM FEATURES (4 Mb density)
Power Dissipation:
Operating: 40 mA maximum
Standby: 7 A maximum
Chip Selects:
CE1
s, CE2s
Power down feature using
CE1s
, or CE2s
Data retention supply voltage: 1.5 to 3.3 volt
Byte data control:
LB
s (DQ0DQ7),
UB
s
(DQ8DQ15) -- in x16 mode
GENERAL DESCRIPTION
The flash and SRAM MCP is available in 32 Mbit Flash/4
Mbit SRAM having a data bus of either x8 or x16. The 32
Mbit flash is composed of 2,097,152 words of 16 bits or
4,194,304 bytes of 8 bits. The 4Mb SRAM has 262,144
words of 16 bits or 524,288 bytes of 8 bits. Data lines DQ0-
DQ7 handle the x8 format, while lines DQ0-DQ15 handle
the x16 format.
The package uses a 3.0V power supply for all operations.
No other source is required for program and erase opera-
tions. The flash can be programmed in system using this
3.0V supply, or can be programmed in a standard EPROM
programmer.
The 32 Mbit flash/4 Mbit SRAM is offered in a 73-pin BGA
package. The flash is compatible with the JEDEC Flash
command set standard . The flash access time is 70ns or
85ns and the SRAM access time is 70ns or 85ns.
The Flash architecture is composed of two banks which
allows simultaneous operation on each. Optimized per-
formance can be achieved by first initializing a program or
erase function in one bank, then immediately starting a
read from the other bank. Both operations would then be
operating simultaneously, with zero latency.
4
Integrated Silicon Solution, Inc. -- www.issi.com --
1-800-379-4774
PRELIMINARY INFORMATION
Rev. 00B
08/01/02
IS71VPCF32
X
S04
ISSI
PIN DESCRIPTIONS
A0-A17
Address Inputs, Common
A18-A20, A-1
Address Inputs, Flash
DQ0-DQ15/A-1
Data Inputs/Outputs
RESET
Reset
CE1
s, CE2s
Chip Selects, SRAM
I/Of
I/O Configuration, Flash
CE
f
Chip Enable Input, Flash
OE
Output Enable Input
WE
Write Enable Input
I/Os
I/O Configuration, SRAM
LB
s
Lower-byte Control(DQ0-DQ7), SRAM
UB
s
Upper-byte Control (DQ8-DQ15), SRAM
WP
/ACC
Write Protect/Acceleration Pin, Flash
RY/
BY
Ready/Busy Output
SA
High Order Address Pin, SRAM (x8)
NC
No Connection
Vccf
Power, Flash
Vccs
Power, SRAM
GND
Ground
PIN CONFIGURATION (32 Mb Flash and 4 Mb SRAM)
PACKAGE CODE: B 73 BALL FBGA (Top View) (8.00 mm x 11.60 mm Body, 0.8 mm Ball Pitch)
1
2
3
4
5
6
7
8
9 10
A
B
C
D
E
F
G
H
J
K
L
M
NC
NC
NC
NC
NC
NC
NC
A3
A2
A1
A0
CEf
CE1S
A7
A6
A5
A4
Vss
OE
DQ0
Q
DQ8
LB
UB
A18
A17
DQ1
Q
DQ9
Q
DQ10
Q
DQ2
NC
/
RESET
RY/
BY
/
DQ3
Vccf
DQ11
NC
NC
WE
CE2s
A20
DQ4
VccS
I/Os
NC
A8
A19
A9
A10
DQ6
DQ13
DQ12
DQ5
A11
A12
A13
A14
SA
DQ7
DQ14
A15
NC
NC
A16
I/Of
GND
NC
NC
NC
NC
NC
NC
Shared
Flash Only
SRAM Only
*
DQ15/A-1
Integrated Silicon Solution, Inc. -- www.issi.com --
1-800-379-4774
5
PRELIMINARY INFORMATION
Rev. 00B
08/01/02
IS71VPCF32
X
S04
ISSI
OPERATION
(1,3)
CE
CE
CE
CE
CE
f
CE
CE
CE
CE
CE
1s CE2s
OE
OE
OE
OE
OE
WE
WE
WE
WE
WE
SA
(6)
LB
LB
LB
LB
LB
s
UB
UB
UB
UB
UB
s
DQ
0-
DQ
7
DQ
8
-DQ
15
RESET
RESET
RESET
RESET
RESET WP
WP
WP
WP
WP
/ACC
(5)
Full Standby
H
H
X
X
X
X
X
X
High-Z
High-Z
H
X
H
X
L
X
X
X
X
X
High-Z
High-Z
H
X
Output Disable
H
L
H
H
H
X
X
X
High-Z
High-Z
H
X
H
L
H
X
X
X
H
H
High-Z
High-Z
H
X
L
H
X
H
H
X
X
X
High-Z
High-Z
H
X
L
X
L
H
H
X
X
X
High-Z
High-Z
H
X
Read from Flash
(2)
L
H
X
L
H
X
X
X
D
OUT
D
OUT
H
X
L
X
L
L
H
X
X
X
D
OUT
D
OUT
H
X
Write to Flash
L
H
X
H
L
X
X
X
D
IN
D
IN
H
X
L
X
L
H
L
X
X
X
D
IN
D
IN
H
X
Read from SRAM
H
L
H
L
H
X
L
L
D
OUT
D
OUT
H
X
H
L
H
L
H
X
H
L
High-Z
D
OUT
H
X
H
L
H
L
H
X
L
H
D
OUT
High-Z
H
X
Write to SRAM
H
L
H
X
L
X
L
L
D
IN
D
IN
H
X
H
L
H
X
L
X
H
L
High-Z
D
IN
H
X
H
L
H
X
L
X
L
H
D
IN
High-Z
H
X
Temporary Sector
X
X
X
X
X
X
X
X
X
X
V
ID
(8)
X
Group Unprotection
(4)
Flash Hardware
X
H
X
X
X
X
X
X
High-Z
High-Z
L
X
Reset
X
X
L
X
X
X
X
X
High-Z
High-Z
L
X
Boot Block Sector
X
X
X
X
X
X
X
X
X
X
X
L
Write Protection
Notes:
1. Any operations not indicated this column are inhibited.
2.
WE
can be VIL if
OE
is VIL,
OE
at VIH initiates the write operations.
3. Do not apply
CE
f = VIL,
CE
1s = VIL and CE2s = VIH all at once.
4. It is also used for the extended sector group protections.
5.
WP
/ACC = VIL: protection of boot sectors.
WP
/ACC = VIH: removal of boot sectors protection.
WP
/ACC = VACC (9V): Program time will reduce by 40%.
6. SA: Don't care or open.
7. L = VIL, H = VIH, X = VIL or VIH.
8. See DC CHARACTERISTICS.
DEVICE BUS OPERATIONS
User Bus Operations (Flash=Word mode: I/Of = Vccf, SRAM= Word Mode: I/Os = Vccs)
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