SPEC NO: DSAD1241
REV NO: V.1
DATE: MAR/28/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: D.H.FANG
Package Dimensions
Features
l
2.7mm X 3.4mm SMT LED, 1.5mm HEIGHT ONLY.
l
BOTH CHIPS CAN BE CONTROLLED SEPARATELY.
l
SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER
PROCESS.
l
AVAILABLE ON TAPE AND REEL.
l
IDEAL FOR BACKLIGHTING.
l
PACKAGE: 1000PCS / REEL.
2.7x3.4mm SURFACE MOUNT LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0
.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
AA2734SRSGC SUPER BRIGHT RED
SUPER BRIGHT GREEN
Description
The Super Bright Red source color devices are made
with Gallium Aluminum Arsenide Red Light Emitting
Diode.
The Super Bright Green source color devices are
made with Gallium Phosphide Green Light Emitting
Diode.
SPEC NO: DSAD1241
REV NO: V.1
DATE: MAR/28/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: D.H.FANG
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Selection Guide
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
G
S
R
S4
37
2
A
A
)s
Al
Aa
G(
D
E
R
T
H
GI
R
B
R
E
P
U
S
R
A
EL
C
R
ET
A
W
63
05
1
0
21
)P
a
G(
N
E
E
R
G
T
H
GI
R
B
R
E
P
U
S
7
03
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
de
R
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
06
6 56
5
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
de
R
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
04
6 86
5
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
de
R
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
02
03
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
de
R
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
5451
Fp
V
F
zH
M
1=
f;V
0=
V
F
eg
atl
oV
dr
a
wr
oF
de
R
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gir
B
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er
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re
pu
S
58
.12.2
5.
2 5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
llA
01
Au
V
R
V5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
de
R
th
gir
B
re
pu
S
de
R
th
gir
B
re
pu
S
de
R
th
gir
B
re
pu
S
de
R
th
gir
B
re
pu
S
de
R
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
00
1
50
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
52
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
55
1
04
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
SPEC NO: DSAD1241
REV NO: V.1
DATE: MAR/28/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: D.H.FANG
AA2734SRSGC
SMT Reflow Soldering Instruction
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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