SPEC NO: DSAD0901
REV NO: V.2
DATE: MAY/07/2003
PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
5.0mm x 6.0mm SURFACE MOUNT LED LAMP
Features
lSINGLE COLOR.
lSUITABLE FOR ALL SMT ASSEMBLY AND
SOLDER PROCESS.
lAVAILABLE ON TAPE AND REEL.
lIDEAL FOR BACKLIGHTING.
lPACKAGE : 500PCS / REEL.
AA5060TGC GREEN
Description
The Green source color devices are made with
InGaN on SiC Light Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded.
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
SPEC NO: DSAD0901
REV NO: V.2
DATE: MAY/07/2003
PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Electrical / Optical Characteristics at T
A
=25
C
Selection Guide
Note:
1
.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI Am
03
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
G
T0
60
5
A
A
)N
a
G
nI(
N
E
E
R
G
R
A
EL
C
R
ET
A
W
07
05
2
0
01
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Absolute Maximum Ratings at T
A
=25
C
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ne
er
G ne
er
G ne
er
G ne
er
G ne
er
G
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
23
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
05
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
ne
er
G
00
5
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
ne
er
G
50
5
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
ne
er
G
03
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
ne
er
G
65
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
ne
er
G
6.
3
4.
4
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
ne
er
G
01
A
u
V
R
V
5
=
SPEC NO: DSAD0901
REV NO: V.2
DATE: MAY/07/2003
PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AA5060TGC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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