SPEC NO:CDA0454
REV NO: V.1
DATE: OCT/27/2001
PAGE: 1 OF 4
APPROVED:J.LU
CHECKED:
DRAWN:M.F.CAI
Description
The Mega Green source color devices are made with
DH InGaAlP on GaAs substrate Light Emitting Diode.
SUBMINIATURE SOLID STATE LAMP
AM2520MGC03
MEGA GREEN
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Features
!
SUBMINIATURE PACKAGE.
!
WIDE VIEWING ANGLE.
!
GULL WING.
!
LONG LIFE - SOLID STATE RELIABILITY.
!
LOW PACKAGE PROFILE.
!
PACKAGE : 1000PCS / REEL.
Package Dimensions
SPEC NO: CDA0454
REV NO: V.1
DATE: OCT/27/2001
PAGE: 2 OF 4
APPROVED:J.LU
CHECKED:
DRAWN:M.F.CAI
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
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m
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c
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.
p
y
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.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M
.
x
a
M
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
n
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it
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d
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t
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T
s
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it
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t
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t
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it
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it
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W
k
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P
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a
g
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M
4
7
5
m
n
A
m
0
2
=
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I
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t
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W
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m
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D
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G
a
g
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M
8
6
5
m
n
A
m
0
2
=
F
I
2
/
1
h
t
d
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w
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a
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L
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a
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M
6
2
m
n
A
m
0
2
=
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I
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ti
c
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p
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r
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a
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0
2
F
p
z
H
M
1
=
f;
V
0
=
F
V
V
F
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g
a
tl
o
V
d
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w
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1
.
2
5
.
2
V
A
m
0
2
=
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n
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0
1
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V
5
=
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V
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m
]
1
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t
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/
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-
5
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p
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p
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s
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e
L
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
A
m
0
2
@
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
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i
V
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n
i
w
e
i
V
e
l
g
n
A
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
3
0
C
G
M
0
2
5
2
M
A
)
P
l
A
a
G
n
I
(
N
E
E
R
G
A
G
E
M
R
A
E
L
C
R
E
T
A
W
0
0
1
0
0
4
0
2
SPEC NO: CDA0454
REV NO: V.1
DATE: OCT/27/2001
PAGE: 4 OF 4
APPROVED:J.LU
CHECKED:
DRAWN:M.F.CAI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM2520MGC03
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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