SPEC NO: DSAD1284
REV NO: V.1
DATE: MAR/27/2003
PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
SUBMINIATURE SOLID STATE LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Package Dimensions
Features
l
SUBMINIATURE PACKAGE.
l
WIDE VIEWING ANGLE.
l
Z-BEND LEAD.
l
LONG LIFE - SOLID STATE RELIABILITY.
l
LOW PACKAGE PROFILE.
l
PACKAGE : 1000PCS / REEL.
AM2520SEC09 SUPER BRIGHT ORANGE
Description
The Super Bright Orange source color devices
are made with DH InGaAlP on GaAs substrate
Light Emitting Diode.
SPEC NO: DSAD1284
REV NO: V.1
DATE: MAR/27/2003
PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Selection Guide
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
90
C
E
S0
25
2
M
A
)PI
Aa
G
nI(
E
G
N
A
R
O
T
H
GI
R
B
R
E
P
U
S
R
A
EL
C
R
ET
A
W
08
4
00
31
0
2
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
eg
na
rO
th
gir
B
re
pu
S
01
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
eg
na
rO
th
gir
B
re
pu
S
10
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
eg
na
rO
th
gir
B
re
pu
S
92
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
eg
na
rO
th
gir
B
re
pu
S
03
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
eg
na
rO
th
gir
B
re
pu
S
0.
2
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
eg
na
rO
th
gir
B
re
pu
S
01
A
u
V
R
V
5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
57
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
59
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
SPEC NO: DSAD1284
REV NO: V.1
DATE: MAR/27/2003
PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM2520SEC09
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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