SPEC NO:DSAD1328
REV NO: V.1
DATE: MAR/29/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: X.T.HU
SUBMINIATURE SOLID STATE LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Package Dimensions
AM27SURC09 HYPER RED
Features
!
SUBMINIATURE PACKAGE.
!
WIDE VIEWING ANGLE.
!
Z-BEND LEAD.
!
LONG LIFE - SOLID STATE RELIABILITY.
!
LOW PACKAGE PROFILE.
!
PACKAGE : 1000PCS / REEL.
Description
The Hyper Red source color devices are made with DH
InGaAlP on GaAs substrate Light Emitting Diode.
SPEC NO:DSAD1328
REV NO: V.1
DATE: MAR/29/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: X.T.HU
Selection Guide
Note:
1
.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
)
=25
C
Electrical / Optical Characteristics at T
)
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
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SPEC NO:DSAD1328
REV NO: V.1
DATE: MAR/29/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: X.T.HU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM27SURC09
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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