SPEC NO:DSAD1313
REV NO: V.1
DATE:MAR/29/2003
PAGE: 1 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
SUBMINIATURE SOLID STATE LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Features
l
SUBMINIATURE PACKAGE.
l
WIDE VIEWING ANGLE.
l
YOKE LEAD.
l
LONG LIFE - SOLID STATE RELIABILITY.
l
LOW PACKAGE PROFILE.
l
PACKAGE :1000PCS / REEL.
Package Dimensions
AM27SURCK08 HYPER RED
Description
The Hyper Red source color devices are made with
DH InGaAlP on GaAs substrate Light Emitting Diode.
SPEC NO:DSAD1313
REV NO: V.1
DATE:MAR/29/2003
PAGE: 2 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
de
R
re
py
H
05
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
de
R
re
py
H
53
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
de
R
re
py
H
82
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
de
R
re
py
H
53
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
de
R
re
py
H
59
.1
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
de
R
re
py
H
01
A
u
V
R
V
5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
07
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
58
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
80
K
C
R
U
S7
2
M
A
)
Pl
Aa
G
nI
(
D
E
R
R
E
PY
H
R
A
EL
C
R
ET
A
W
08
1
05
6
0
2
SPEC NO:DSAD1313
REV NO: V.1
DATE:MAR/29/2003
PAGE: 4 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM27SURCK08
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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