SPEC NO:DSAD1303
REV NO: V.1
DATE: MAR/31/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: L.ZHANG
Package Dimensions
SUBMINIATURE SOLID STATE LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Features
!
SUBMINIATURE PACKAGE.
!
GULL WING.
!
LONG LIFE - SOLID STATE RELIABILITY.
!
LOW PACKAGE PROFILE.
!
PACKAGE :1000PCS / REEL.
AM27SYCK03 SUPER BRIGHT YELLOW
Description
The Super Bright Yellow source color devices
are made with DH InGaAlP on GaAs substrate
Light Emitting Diode.
SPEC NO:DSAD1303
REV NO: V.1
DATE: MAR/31/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: L.ZHANG
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Selection Guide
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M
.
x
a
M
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
9
5
m
n
I
F
A
m
0
2
=
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
9
5
m
n
I
F
A
m
0
2
=
2
/
1
h
t
d
i
w
-
fl
a
H
e
n
i
L
l
a
r
t
c
e
p
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
2
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
2
F
p
V
F
;
V
0
=
f
z
H
M
1
=
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
.
2
5
.
2
V
I
F
A
m
0
2
=
I
R
t
n
e
r
r
u
C
e
s
r
e
v
e
R
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
1
A
u
V
R
V
5
=
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
5
2
1
W
m
t
n
e
r
r
u
C
d
r
a
w
r
o
F
C
D
0
3
A
m
]
1
[
t
n
e
r
r
u
C
d
r
a
w
r
o
F
k
a
e
P
5
7
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
e
c
i
D e
c
i
D e
c
i
D e
c
i
D e
c
i
D
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
A
m
0
2
@
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
e
l
g
n
A
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
2
2
2
2
2
2
/
1 2
/
1 2
/
1 2
/
1 2
/
1
3
0
K
C
Y
S
7
2
M
A
)
P
l
A
a
G
n
I
(
W
O
L
L
E
Y
T
H
G
I
R
B
R
E
P
U
S
R
A
E
L
C
R
E
T
A
W
0
7
0
0
3
0
2
SPEC NO:DSAD1303
REV NO: V.1
DATE: MAR/31/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: L.ZHANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM27SYCK03
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP