ChipFind - документация

Электронный компонент: AP2012CGCK

Скачать:  PDF   ZIP
SPEC NO:DSAA6049
REV NO: V.3
DATE:MAR/18/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:D.L.HUANG
AP2012CGCK GREEN
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
Description
The Green source color devices are made with
InGaAlP on GaAs substrate Light Emitting Diode.
2.0x1.25mm SMD CHIP LED LAMP
Features
!
2.0mmx1.25mm SMT LED, 1.1mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACKLIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE : 2000PCS / REEL.
SPEC NO:DSAA6049
REV NO: V.3
DATE:MAR/18/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:D.L.HUANG
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T
)
=25


C
Absolute Maximum Ratings at T
)
=25


C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
e
c
i
D e
c
i
D e
c
i
D e
c
i
D e
c
i
D
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
A
m
0
2
@
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
e
l
g
n
A
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
K
C
G
C
2
1
0
2
P
A
)
P
l
A
a
G
n
I(
N
E
E
R
G
R
A
E
L
C
R
E
T
A
W
5
1
0
4
0
2
1
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M .
x
a
M
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
n
e
e
r
G
4
7
5
m
n
I
F
A
m
0
2
=
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
n
e
e
r
G
0
7
5
m
n
I
F
A
m
0
2
=
2
/
1
h
t
d
i
w
-f
l
a
H
e
n
i
L
l
a
rt
c
e
p
S
n
e
e
r
G
0
2
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
n
e
e
r
G
5
1
F
p
V
F
z
H
M
1
=
f;
V
0
=
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
n
e
e
r
G
1
.
2
5
.
2
V
I
F
A
m
0
2
=
I
R
t
n
e
r
r
u
C
e
s
r
e
v
e
R
n
e
e
r
G
0
1
A
u
V
R
V
5
=
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
n
e
e
r
G
n
e
e
r
G
n
e
e
r
G
n
e
e
r
G
n
e
e
r
G
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
5
0
1
W
m
t
n
e
rr
u
C
d
r
a
w
r
o
F
C
D
0
3
A
m
]
1
[
t
n
e
rr
u
C
d
r
a
w
r
o
F
k
a
e
P
0
5
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
SPEC NO:DSAA6049
REV NO: V.3
DATE:MAR/18/2003
PAGE: 3 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:D.L.HUANG
Green AP2012CGCK
SPEC NO:DSAA6049
REV NO: V.3
DATE:MAR/18/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:D.L.HUANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AP2012CGCK
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.