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Электронный компонент: AP23MGC-F

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SPEC NO: DSAD0972
REV NO: V.1 DATE: MAR/15/2003 PAGE: 1 OF 4
APPROVED: J.LU
CHECKED: Allen Liu DRAWN: Z.Y.YANG
3x2.4mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.2(0.008") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Features
!
3mmx2.4mm SMT LED, 1.05mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACKLIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES
AVAILABLE.
!
PACKAGE : 2000PCS / REEL.
Package Dimensions
AP23MGC-F MEGA GREEN
Description
The Mega Green source color devices are made with
DH InGaAlP on GaAs substrate Light Emitting Diode.
SPEC NO: DSAD0972
REV NO: V.1 DATE: MAR/15/2003 PAGE: 2 OF 4
APPROVED: J.LU
CHECKED: Allen Liu DRAWN: Z.Y.YANG
Electrical / Optical Characteristics at T
)
=25


C
Absolute Maximum Ratings at T
)
=25


C
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
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SPEC NO: DSAD0972
REV NO: V.1 DATE: MAR/15/2003 PAGE: 3 OF 4
APPROVED: J.LU
CHECKED: Allen Liu DRAWN: Z.Y.YANG
Mega Green AP23MGC-F
SPEC NO: DSAD0972
REV NO: V.1 DATE: MAR/15/2003 PAGE: 4 OF 4
APPROVED: J.LU
CHECKED: Allen Liu DRAWN: Z.Y.YANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AP23MGC-F
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.