SPEC NO:DSAC1623
REV NO: V.1
DATE: DEC/15/2002
PAGE: 1 OF 5
APPROVED:J.LU
CHECKED:Joe Lee DRAWN: F.Y.YUAN
SURFACE MOUNT DISPLAY
Package Dimensions
Internal Circuit Diagram
Features
!
0.3 INCH DIGIT HEIGHT.
!
LOW CURRENT OPERATION.
!
EXCELLENT CHARACTER APPEARANCE.
!
I.C. COMPATIBLE.
!
MECHANICALLY RUGGED.
!
GRAY FACE,WHITE SEGMENT.
!
PACKAGE: 800PCS/REEL.
Notes:
1. All dimensions are in millimeters (inches), Tolerance is
0.25(0.01")unless otherwise noted.
2. Specifications are subject to change whitout notice.
APBA03-41SYKWA SUPER BRIGHT YELLOW
Description
The Super Bright Yellow source color devices are made
with DH InGaAlP on GaAs substrate Light Emitting Diode.
Digitally signed by Nenuphar
cn=Nenuphar, ou=d3e, o=display, c=CN
Date: 2002.12.15 18:44:25 +08'00'
Reason: Document is certified
SPEC NO:DSAC1623
REV NO: V.1
DATE: DEC/15/2002
PAGE: 2 OF 5
APPROVED:J.LU
CHECKED:Joe Lee DRAWN: F.Y.YUAN
Electrical / Optical Characteristics at T
)
=25
C
Absolute Maximum Ratings at T
)
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M .
x
a
M
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
9
5
m
n
I
F
A
m
0
2
=
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
9
5
m
n
I
F
A
m
0
2
=
2
/
1
h
t
d
i
w
-f
l
a
H
e
n
i
L
l
a
rt
c
e
p
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
2
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
2
F
p
V
F
z
H
M
1
=
f;
V
0
=
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
.
2
5
.
2
V
I
F
A
m
0
2
=
I
R
t
n
e
rr
u
C
e
s
r
e
v
e
R
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
1
A
u
V
R
V
5
=
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
5
2
1
W
m
t
n
e
rr
u
C
d
r
a
w
r
o
F
C
D
0
3
A
m
]
1
[
t
n
e
rr
u
C
d
r
a
w
r
o
F
k
a
e
P
5
7
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
e
c
i
D e
c
i
D e
c
i
D e
c
i
D e
c
i
D
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
A
m
0
1
@
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
A
W
K
Y
S
1
4
-
3
0
A
B
P
A
)
P
l
A
a
G
n
I(
W
O
L
L
E
Y
T
H
G
I
R
B
R
E
P
U
S
D
E
S
U
F
F
I
D
E
T
I
H
W
0
0
0
8
0
0
4
5
3
,
e
d
o
n
A
n
o
m
m
o
C
l
a
m
i
c
e
D
d
n
a
H
.t
R
SPEC NO:DSAC1623
REV NO: V.1
DATE: DEC/15/2002
PAGE: 4 OF 5
APPROVED:J.LU
CHECKED:Joe Lee DRAWN: F.Y.YUAN
Recommended Soldering Pattern
(Units : mm)
APBA03-41SYKWA
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP
