SPEC NO:DSAD1106
REV NO: V.1
DATE:MAR/19/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED: Allen Liu
DRAWN:Y.H.LI
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
3.2x2.4mm SMD CHIP LED LAMP
Features
l
3.2x2.4mm SMT LED, 2.4mm THICKNESS.
l
LOW POWER CONSUMPTION.
l
IDEAL FOR BACKLIGHT AND INDICATOR.
l
VARIOUS COLORS AND LENS TYPES AVAILABLE.
l
PACKAGE : 1500PCS / REEL.
APBD3224SGNC SUPER BRIGHT GREEN
PURE ORANGE
Description
The Super Bright Green source color devices are made
with Gallium Phosphide Green Light Emitting Diode.
The Pure Orange source color devices are made with
Gallium Arsenide Phosphide on Gallium Phosphide Pure
Orange Light Emitting Diode.
SPEC NO:DSAD1106
REV NO: V.1
DATE:MAR/19/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED: Allen Liu
DRAWN:Y.H.LI
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
A
=25
C
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
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ka
ep
ht
gn
el
ev
a
W
ka
e
P
ne
er
G
th
gir
B
re
pu
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eg
na
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er
u
P
56
5 70
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
ne
er
G
th
gir
B
re
pu
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eg
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u
P
86
5 01
6
m
n
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F
A
m
02
=
2/
1
ht
di
w-
fla
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en
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lar
tc
ep
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ne
er
G
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P
03
53
m
n
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F
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m
02
=
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tic
ap
a
C
ne
er
G
th
gir
B
re
pu
S
eg
na
rO
er
u
P
51
51
Fp
V
F
zH
M
1=
f;V
0=
V
F
eg
atl
oV
dr
a
wr
oF
ne
er
G
th
gir
B
re
pu
S
eg
na
rO
er
u
P
2.
2 50.
2
5.
2 5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
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ve
R
llA
01
Au
V
R
V
5
=
ret
e
m
ar
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P
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m
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m
ar
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P
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er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
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G
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P
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P
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n
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U sti
n
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n
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no
ita
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ss
id
re
w
o
P
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iD ec
iD ec
iD ec
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gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
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n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
N
G
S4
22
3
D
B
P
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)P
a
G(
N
E
E
R
G
T
H
GI
R
B
R
E
P
U
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R
A
EL
C
R
ET
A
W
01
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Ps
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P
81
06
SPEC NO:DSAD1106
REV NO: V.1
DATE:MAR/19/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED: Allen Liu
DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APBD3224SGNC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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