SPEC NO: DSAB0007
REV NO: V.3
DATE:MAR/22/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:D.L.HUANG
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
APD3224SURC HYPER RED
3.2x2.4mm SMD CHIP LED LAMP
Features
!
3.2x2.4mm SMT LED, 2.4mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
IDEAL FOR BACKLIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE : 1500PCS / REEL.
Description
The Hyper Red source color devices are made
with DH InGaAlP on GaAs substrate Light Emitting
Diode.
SPEC NO: DSAB0007
REV NO: V.3
DATE:MAR/22/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:D.L.HUANG
Absolute Maximum Ratings at T
)
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
)
=25
C
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
e
c
i
D e
c
i
D e
c
i
D e
c
i
D e
c
i
D
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
A
m
0
2
@
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
e
l
g
n
A
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
R
U
S
4
2
2
3
D
P
A
)
P
I
A
a
G
n
I(
D
E
R
R
E
P
Y
H
R
A
E
L
C
R
E
T
A
W
0
5
6
0
0
2
1
0
2
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M .
x
a
M
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
d
e
R
r
e
p
y
H
0
4
6
m
n
I
F
A
m
0
2
=
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
d
e
R
r
e
p
y
H
8
2
6
m
n
I
F
A
m
0
2
=
2
/
1
h
t
d
i
w
-f
l
a
H
e
n
i
L
l
a
rt
c
e
p
S
d
e
R
r
e
p
y
H
7
2
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
d
e
R
r
e
p
y
H
5
4
F
p
V
F
z
H
M
1
=
f;
V
0
=
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
d
e
R
r
e
p
y
H
9
.
1
5
.
2
V
I
F
A
m
0
2
=
I
R
t
n
e
rr
u
C
e
s
r
e
v
e
R
d
e
R
r
e
p
y
H
0
1
A
u
V
R
V
5
=
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
d
e
R
r
e
p
y
H
d
e
R
r
e
p
y
H
d
e
R
r
e
p
y
H
d
e
R
r
e
p
y
H
d
e
R
r
e
p
y
H
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
0
7
1
W
m
t
n
e
rr
u
C
d
r
a
w
r
o
F
C
D
0
3
A
m
]
1
[
t
n
e
rr
u
C
d
r
a
w
r
o
F
k
a
e
P
5
8
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
SPEC NO: DSAB0007
REV NO: V.3
DATE:MAR/22/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:D.L.HUANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APD3224SURC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP